JP2018182174A - 半導体装置及び半導体装置の製造方法 - Google Patents
半導体装置及び半導体装置の製造方法 Download PDFInfo
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Abstract
Description
第1の実施の形態の半導体装置について、図1及び図2を用いて説明する。
第2の実施の形態では、ケース11の底部11cの設置領域に下に凸に(頂点がプリント基板の裏面側になるように)反ったプリント基板を配置する場合について図6及び図7を用いて説明する。
第3の実施の形態では、ケース11の底部11cの設置領域に下に凸に反った、または、上に凸に反ったプリント基板を配置する場合について図9を用いて説明する。
11 ケース
11a 枠部
11b 端子台
11c 底部
11d 開口部
11e,11e1,11e2,11e3,11e4,11e5,11e6,11e7,11e8,11e9,21e,21e1,21e2,21e3,21e4,21e5,21e6,21e7,31e1,31e2,31e3,31e4,31e5,31e6,31e7,31e8 突起部
12a1,12b1,12c1,12d1,12e1,12f1,12g1 外部接続端子
12a2,12b2,12c2,12d2,12e2,12f2,12g2 内部接続端子
13,23,33 プリント基板
13a,23a 設置領域
15 セラミック回路基板
15a 絶縁板
15b1,15b2、15b3,15b4,15b5,15b6 導電パターン
16a,16b 半導体素子
17 金属ベース板
18 接着剤
50 押圧治具
51 ピン固定部
52a,52b,52c,52d 押圧用ピン
52a1,52b1,52c1,52d1 押圧部
53a,53b 取り付け部
Claims (15)
- 平面視で矩形状のプリント基板と、
前記プリント基板が接着剤からなる接合部材を介して設置される設置領域上に、前記プリント基板を裏面側から支持して前記設置領域と前記裏面との間に間隙を維持する少なくとも1つの突起部が形成されたケースと、
を有する半導体装置。 - 前記突起部は、前記設置領域の前記プリント基板の角部にそれぞれ対向している、
請求項1に記載の半導体装置。 - 前記突起部は、さらに、前記設置領域の前記プリント基板の中心部に対向している、
請求項2に記載の半導体装置。 - 前記突起部は、さらに、前記設置領域の前記プリント基板の前記角部からそれぞれ前記プリント基板の長手方向内側に離れて対向している、
請求項2に記載の半導体装置。 - 前記突起部は、前記設置領域の前記プリント基板の長辺の中心を通って前記長辺に直交する方向の線に沿って少なくとも1箇所に存在する、
請求項1に記載の半導体装置。 - 前記プリント基板は、上に凸に反っている、
請求項2乃至4のいずれかに記載の半導体装置。 - 前記プリント基板は、下に凸に反っている、
請求項2または5に記載の半導体装置。 - 前記突起部は、前記設置領域に対して垂直方向の断面が方形状または台形状である、
請求項1に記載の半導体装置。 - 前記突起部は、前記設置領域に対して水平方向の断面が円形状、楕円形状または方形状である、
請求項8に記載の半導体装置。 - 前記突起部の高さは、0.08mm以上、0.15mm以下である、
請求項9に記載の半導体装置。 - 前記突起部の幅は、0.5mm以上、1.5mm以下である、
請求項10に記載の半導体装置。 - 上に凸に反った、平面視で矩形状のプリント基板を用意する工程と、
前記プリント基板が設置される設置領域の前記プリント基板のそれぞれの角部に対向する位置にそれぞれ形成されている4つの突起部を備えるケースを用意する工程と、
接着剤からなる接合部材を介して前記プリント基板を前記設置領域に配置する工程と、
前記プリント基板のおもて面の前記突起部よりも内側の4つ押圧位置を同時に押圧して、前記接合部材が硬化するまで維持する工程と、
を有する半導体装置の製造方法。 - 下に凸に反った、平面視で矩形状のプリント基板を用意する工程と、
前記プリント基板が設置される設置領域の前記プリント基板のそれぞれの角部よりも内側の対向する位置に形成されている少なくとも1つの突起部を備えるケースを用意する工程と、
接着剤からなる接合部材を介して前記プリント基板を前記設置領域に配置する工程と、
前記プリント基板のおもて面の前記角部をそれぞれ同時に押圧して、前記接合部材が硬化するまで維持する工程と、
を有する半導体装置の製造方法。 - 前記所定位置は、前記設置領域の前記プリント基板の前記角部からそれぞれ前記プリント基板の長手方向内側に所定の距離、離れて対向している、
請求項13に記載の半導体装置の製造方法。 - 前記所定位置は、前記設置領域の、前記プリント基板の長辺の中心を通って前記長辺に直交する方向の線に沿って少なくとも1箇所に存在する、
請求項13に記載の半導体装置の製造方法。
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JP2017082469A JP6981033B2 (ja) | 2017-04-19 | 2017-04-19 | 半導体装置及び半導体装置の製造方法 |
CN201810165700.4A CN108735722B (zh) | 2017-04-19 | 2018-02-28 | 半导体装置及半导体装置的制造方法 |
US15/908,402 US10658253B2 (en) | 2017-04-19 | 2018-02-28 | Semiconductor device including a warped printed circuit board disposed in a case and method of manufacturing same |
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US11658151B2 (en) | 2020-09-25 | 2023-05-23 | Fuji Electric Co., Ltd. | Semiconductor device |
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JP2000077602A (ja) * | 1998-08-28 | 2000-03-14 | Fuji Electric Co Ltd | 半導体装置 |
JP2000133769A (ja) * | 1998-10-23 | 2000-05-12 | Fuji Electric Co Ltd | パワー半導体装置およびその組立方法 |
JP2006166604A (ja) * | 2004-12-08 | 2006-06-22 | Mitsubishi Electric Corp | 電力変換装置 |
WO2016009741A1 (ja) * | 2014-07-18 | 2016-01-21 | 富士電機株式会社 | 半導体装置 |
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JP3688249B2 (ja) * | 2002-04-05 | 2005-08-24 | Necエレクトロニクス株式会社 | 半導体装置の製造方法 |
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JP5205867B2 (ja) * | 2007-08-27 | 2013-06-05 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
JP5279345B2 (ja) * | 2008-05-27 | 2013-09-04 | 三菱電機株式会社 | 電力変換装置の収納構造 |
WO2013118415A1 (ja) * | 2012-02-09 | 2013-08-15 | 富士電機株式会社 | 半導体装置 |
JP6119313B2 (ja) * | 2013-03-08 | 2017-04-26 | 富士電機株式会社 | 半導体装置 |
JP6205892B2 (ja) * | 2013-06-25 | 2017-10-04 | 富士通株式会社 | バックアップピンの設置方法およびプリント基板ユニットの製造方法 |
KR102237870B1 (ko) * | 2013-10-25 | 2021-04-09 | 엘지이노텍 주식회사 | 인쇄회로기판 및 그 제조방법과 이를 이용하는 반도체 패키지 |
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JP2000077602A (ja) * | 1998-08-28 | 2000-03-14 | Fuji Electric Co Ltd | 半導体装置 |
JP2000133769A (ja) * | 1998-10-23 | 2000-05-12 | Fuji Electric Co Ltd | パワー半導体装置およびその組立方法 |
JP2006166604A (ja) * | 2004-12-08 | 2006-06-22 | Mitsubishi Electric Corp | 電力変換装置 |
WO2016009741A1 (ja) * | 2014-07-18 | 2016-01-21 | 富士電機株式会社 | 半導体装置 |
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US10658253B2 (en) | 2020-05-19 |
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