JP5148045B2 - オプトカプラおよびオプトカプラ製造方法 - Google Patents

オプトカプラおよびオプトカプラ製造方法 Download PDF

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Publication number
JP5148045B2
JP5148045B2 JP2004234194A JP2004234194A JP5148045B2 JP 5148045 B2 JP5148045 B2 JP 5148045B2 JP 2004234194 A JP2004234194 A JP 2004234194A JP 2004234194 A JP2004234194 A JP 2004234194A JP 5148045 B2 JP5148045 B2 JP 5148045B2
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Prior art keywords
layer
die
optocoupler
insulating layer
optical receiver
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JP2004234194A
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Japanese (ja)
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JP2005064513A (ja
JP2005064513A5 (https=
Inventor
フイ ケク テン
チャム シュー タイ ギャリー
ヒン クオク カ
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アバゴ・テクノロジーズ・イーシービーユー・アイピー（シンガポール）プライベート・リミテッド
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Optical Couplings Of Light Guides (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
JP2004234194A 2003-08-14 2004-08-11 オプトカプラおよびオプトカプラ製造方法 Expired - Fee Related JP5148045B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/640923 2003-08-14
US10/640,923 US6943378B2 (en) 2003-08-14 2003-08-14 Opto-coupler

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JP2005064513A JP2005064513A (ja) 2005-03-10
JP2005064513A5 JP2005064513A5 (https=) 2007-07-12
JP5148045B2 true JP5148045B2 (ja) 2013-02-20

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US (2) US6943378B2 (https=)
JP (1) JP5148045B2 (https=)

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* Cited by examiner, † Cited by third party
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JP2006253842A (ja) 2005-03-08 2006-09-21 Ricoh Co Ltd 画像処理装置、画像形成装置、プログラム、記憶媒体および画像処理方法
US7659531B2 (en) * 2007-04-13 2010-02-09 Fairchild Semiconductor Corporation Optical coupler package
US8577190B2 (en) 2010-03-23 2013-11-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Optocoupler
US8571360B2 (en) * 2010-03-23 2013-10-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Optocoupler with light guide defining element
US8412006B2 (en) * 2010-03-23 2013-04-02 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Optocoupler
US9570648B2 (en) * 2012-06-15 2017-02-14 Intersil Americas LLC Wafer level optical proximity sensors and systems including wafer level optical proximity sensors
JP5806994B2 (ja) 2012-09-21 2015-11-10 株式会社東芝 光結合装置
US9466413B2 (en) 2013-06-28 2016-10-11 Freescale Semiconductor, Inc. Die-to-die inductive communication devices and methods
JP2015050281A (ja) * 2013-08-30 2015-03-16 株式会社東芝 光結合装置
JP5985452B2 (ja) 2013-09-12 2016-09-06 株式会社東芝 半導体装置
US9160423B2 (en) 2013-12-12 2015-10-13 Freescale Semiconductor, Inc. Die-to-die inductive communication devices and methods
CN104916729A (zh) * 2014-03-14 2015-09-16 株式会社东芝 光耦合装置
US10992346B2 (en) 2014-03-26 2021-04-27 Nxp Usa, Inc. Systems and devices with common mode noise suppression structures and methods
JP6268059B2 (ja) * 2014-08-08 2018-01-24 株式会社東芝 光結合型絶縁装置および絶縁装置
US9219028B1 (en) 2014-12-17 2015-12-22 Freescale Semiconductor, Inc. Die-to-die inductive communication devices and methods
JP6371725B2 (ja) * 2015-03-13 2018-08-08 株式会社東芝 半導体モジュール
WO2016161161A1 (en) 2015-03-31 2016-10-06 Cree, Inc. Light emitting diodes and methods with encapsulation
US12364074B2 (en) 2015-03-31 2025-07-15 Creeled, Inc. Light emitting diodes and methods
US9721837B2 (en) 2015-04-16 2017-08-01 Intersil Americas LLC Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same
JP2015195401A (ja) * 2015-07-14 2015-11-05 株式会社東芝 光結合装置
JP6626294B2 (ja) * 2015-09-04 2019-12-25 株式会社東芝 半導体装置および光結合装置
JP6402091B2 (ja) * 2015-12-17 2018-10-10 株式会社東芝 光結合装置
JP2017147364A (ja) 2016-02-18 2017-08-24 株式会社東芝 半導体モジュール
JP6216418B2 (ja) * 2016-07-22 2017-10-18 株式会社東芝 半導体装置
JP6329596B2 (ja) * 2016-07-22 2018-05-23 株式会社東芝 半導体装置
CN109524364B (zh) * 2017-09-19 2023-09-26 恩智浦美国有限公司 具有堆叠管芯的封装式集成电路和其方法
US10848152B2 (en) 2018-03-15 2020-11-24 Analog Devices Global Unlimited Company Optically isolated micromachined (MEMS) switches and related methods comprising a light transmitting adhesive layer between an optical receiver and a light source
US20190363039A1 (en) * 2018-05-22 2019-11-28 Advanced Semiconductor Engineering, Inc. Semiconductor package and manufacturing process
US11101410B2 (en) 2018-05-30 2021-08-24 Creeled, Inc. LED systems, apparatuses, and methods
US10453827B1 (en) * 2018-05-30 2019-10-22 Cree, Inc. LED apparatuses and methods
JP6626537B2 (ja) * 2018-07-17 2019-12-25 株式会社東芝 半導体装置および光結合装置
CN111162067A (zh) * 2018-11-08 2020-05-15 喆富创新科技股份有限公司 在晶圆上形成层叠样式的光耦结构
US11107753B2 (en) * 2018-11-28 2021-08-31 Semiconductor Components Industries, Llc Packaging structure for gallium nitride devices
CN117423689A (zh) * 2019-05-24 2024-01-19 晶元光电股份有限公司 封装体与显示模块
CN113675182B (zh) * 2021-07-09 2023-06-27 福建天电光电有限公司 平面式光耦合装置及其制造方法
WO2023168701A1 (zh) * 2022-03-11 2023-09-14 开发晶照明（厦门）有限公司 光耦合装置
TWI875613B (zh) * 2024-06-20 2025-03-01 台亞半導體股份有限公司 光耦合單晶片結構及其製造方法
CN119495693A (zh) * 2024-10-14 2025-02-21 玻芯成（重庆）半导体科技有限公司 一种光耦合器的制备方法、光耦合器及电子设备
CN119650557A (zh) * 2024-12-12 2025-03-18 中国电子科技集团公司第四十四研究所 一种堆叠式光电耦合器及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5049527A (en) * 1985-06-25 1991-09-17 Hewlett-Packard Company Optical isolator
US5329131A (en) * 1991-05-17 1994-07-12 U.S. Philips Corporation Opto-electronic coupler having improved moisture protective housing
JP2981355B2 (ja) * 1992-12-25 1999-11-22 シャープ株式会社 光結合装置の製造方法
EP0645827B1 (de) * 1993-09-23 1998-02-11 Siemens Aktiengesellschaft Optokoppler und Verfahren zu dessen Herstellung
JP2002344005A (ja) * 2001-05-15 2002-11-29 Guanglei Science Technol Co Ltd 光電センサー装置及びその製造方法

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Publication number Publication date
US20050207697A1 (en) 2005-09-22
US7112457B2 (en) 2006-09-26
JP2005064513A (ja) 2005-03-10
US20050035356A1 (en) 2005-02-17
US6943378B2 (en) 2005-09-13

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