JP5147403B2 - 歪みチャネルを備える二重ゲートデバイス - Google Patents
歪みチャネルを備える二重ゲートデバイス Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 claims description 155
- 239000000463 material Substances 0.000 claims description 106
- 238000009792 diffusion process Methods 0.000 claims description 29
- 125000006850 spacer group Chemical group 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 10
- 229910021332 silicide Inorganic materials 0.000 claims description 8
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical group [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 44
- 238000000034 method Methods 0.000 description 39
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 20
- 229910052710 silicon Inorganic materials 0.000 description 20
- 239000010703 silicon Substances 0.000 description 20
- 230000015572 biosynthetic process Effects 0.000 description 16
- 239000002019 doping agent Substances 0.000 description 14
- 238000002513 implantation Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 11
- 238000007796 conventional method Methods 0.000 description 9
- 230000008901 benefit Effects 0.000 description 8
- 238000000137 annealing Methods 0.000 description 6
- 229910052732 germanium Inorganic materials 0.000 description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical group [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 6
- 230000001590 oxidative effect Effects 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 150000004767 nitrides Chemical group 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
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- 238000001312 dry etching Methods 0.000 description 2
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- 229910021480 group 4 element Inorganic materials 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
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- 230000002411 adverse Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
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- 238000006731 degradation reaction Methods 0.000 description 1
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Description
図1は、本発明による半導体デバイス10を示す。基板12が提供される。一実施形態において、基板12はシリコンである。しかし、任意の半導体材料を使用してもよい。基板12上を覆う誘電体層14が形成される。ウエハボンディング又は酸素種材料の注入を用いて誘電体層14が形成される。一実施形態において、誘電体層14は酸化物である。半導体層16が、誘電体層14の一部を覆うように形成され、パターニングされる。一実施形態において、半導体層16は、シリコンであり、半導体層16の厚さで除算したゲート長に匹敵するアスペクト比が少なくとも3となる厚さを有している。従って、半導体層16は相対的に薄い。半導体層16には、隔離領域18が隣接している。隔離領域18は、材料の空隙又は任意の誘電体材料であることを理解すべきである。従って、一実施形態における隔離領域18は空隙である。ゲート誘電体20が、半導体層16上を覆うように形成される。ゲート22が、ゲート誘電体20上を覆うように形成される。窒化物等の誘電体層24は、ゲート22及びゲート誘電体20の周囲に形成される。誘電体層24の組成物は、ゲート誘電体20内に拡散する酸素を最小限に抑え、熱安定性も有する材料からなる。従って、窒化物に加え、他の材料を使用してもよい。
図12は、半導体材料72がシリコン層62上を覆い、かつ包囲することで選択的に成長又は蒸着された半導体デバイス60の断面を示す。半導体材料72は、シリコンゲルマニウム(SiGe)であり、シリコン炭素、炭素及び他の第四族元素又は合金等の他の材料から形成してもよい。
Claims (5)
- 二重ゲートトランジスタ構造を有する半導体デバイスであって、
前記二重ゲートトランジスタのフィン構造として機能する半導体層と、
前記半導体層を覆うように形成される酸化層と、
前記酸化層を覆うように形成される絶縁体と、
前記絶縁体を覆うように形成されるゲート電極と、
前記ゲート電極、前記酸化層及び前記絶縁体の周囲に形成される誘電体層と、
前記半導体層の内部において前記ゲート電極の下部に形成される歪みチャネル領域であって、前記歪みチャネル領域の対向する端部に隣接した第一及び第二ヘテロ接合を有する歪みチャネル領域と、
選択的に成長され、前記ゲート電極の外側にある前記半導体層を覆う半導体材料とを備え、
前記半導体材料は、前記半導体層の材料とは異なる材料からなり、
前記半導体材料は、前記歪みチャネル領域中に前記半導体材料が拡散する量を制御することにより、拡散源として使用される半導体デバイス。 - 請求項1記載の半導体デバイスは、更に、
前記半導体層内のソース/ドレインエクステンション領域と、
前記ゲート電極に隣接する少なくとも一つの側壁スペーサであって、前記ソース/ドレインエクステンション領域に隣接して配置される側壁スペーサと、
前記ソース/ドレインエクステンション領域に隣接し、かつ前記半導体層内に存在するソース/ドレイン領域と
を備える半導体デバイス。 - 請求項2記載の半導体デバイスは、更に、
前記ソース/ドレイン領域のシリサイド領域と、
前記ゲート電極のシリサイド領域と
を備える半導体デバイス。 - 請求項1記載の半導体デバイスにおいて、
前記半導体層は、絶縁基板上における半導体の半導体層を含む半導体デバイス。 - 請求項1記載の半導体デバイスにおいて、
前記誘電体層は、前記ゲート電極及び前記酸化層のうちの少なくとも一つの内部に拡散する酸素を最小化する半導体デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/952,676 US7067868B2 (en) | 2004-09-29 | 2004-09-29 | Double gate device having a heterojunction source/drain and strained channel |
US10/952,676 | 2004-09-29 | ||
PCT/US2005/031000 WO2006039037A1 (en) | 2004-09-29 | 2005-08-31 | Double gate device having a strained channel |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008515224A JP2008515224A (ja) | 2008-05-08 |
JP2008515224A5 JP2008515224A5 (ja) | 2008-07-31 |
JP5147403B2 true JP5147403B2 (ja) | 2013-02-20 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007534608A Active JP5147403B2 (ja) | 2004-09-29 | 2005-08-31 | 歪みチャネルを備える二重ゲートデバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | US7067868B2 (ja) |
EP (1) | EP1797592A1 (ja) |
JP (1) | JP5147403B2 (ja) |
KR (1) | KR20070061565A (ja) |
WO (1) | WO2006039037A1 (ja) |
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JP4256381B2 (ja) * | 2005-11-09 | 2009-04-22 | 株式会社東芝 | 半導体装置 |
US7279758B1 (en) * | 2006-05-24 | 2007-10-09 | International Business Machines Corporation | N-channel MOSFETs comprising dual stressors, and methods for forming the same |
US20080293192A1 (en) * | 2007-05-22 | 2008-11-27 | Stefan Zollner | Semiconductor device with stressors and methods thereof |
KR100848242B1 (ko) * | 2007-07-11 | 2008-07-24 | 주식회사 동부하이텍 | 반도체 소자 및 반도체 소자의 제조 방법 |
JP5164745B2 (ja) * | 2007-09-03 | 2013-03-21 | 株式会社半導体エネルギー研究所 | 記憶装置 |
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WO2011125455A1 (en) | 2010-04-09 | 2011-10-13 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor memory device |
JP5592281B2 (ja) * | 2011-01-05 | 2014-09-17 | 猛英 白土 | 半導体装置及びその製造方法 |
US8803233B2 (en) * | 2011-09-23 | 2014-08-12 | International Business Machines Corporation | Junctionless transistor |
JP6050034B2 (ja) * | 2012-06-12 | 2016-12-21 | 猛英 白土 | 半導体装置及びその製造方法 |
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US8957476B2 (en) * | 2012-12-20 | 2015-02-17 | Intel Corporation | Conversion of thin transistor elements from silicon to silicon germanium |
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JP3450547B2 (ja) * | 1995-09-14 | 2003-09-29 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP3383154B2 (ja) * | 1996-06-20 | 2003-03-04 | 株式会社東芝 | 半導体装置 |
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JP3782021B2 (ja) * | 2002-02-22 | 2006-06-07 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、半導体基板の製造方法 |
JP2003318198A (ja) * | 2002-04-25 | 2003-11-07 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
US6995430B2 (en) | 2002-06-07 | 2006-02-07 | Amberwave Systems Corporation | Strained-semiconductor-on-insulator device structures |
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KR100728173B1 (ko) * | 2003-03-07 | 2007-06-13 | 앰버웨이브 시스템즈 코포레이션 | 쉘로우 트렌치 분리법 |
US6838322B2 (en) | 2003-05-01 | 2005-01-04 | Freescale Semiconductor, Inc. | Method for forming a double-gated semiconductor device |
US7303949B2 (en) * | 2003-10-20 | 2007-12-04 | International Business Machines Corporation | High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture |
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KR20070061565A (ko) | 2007-06-13 |
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EP1797592A1 (en) | 2007-06-20 |
US20060065927A1 (en) | 2006-03-30 |
US7067868B2 (en) | 2006-06-27 |
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