JP5142715B2 - 有機光−電子装置用積層相互接続 - Google Patents

有機光−電子装置用積層相互接続 Download PDF

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Publication number
JP5142715B2
JP5142715B2 JP2007523148A JP2007523148A JP5142715B2 JP 5142715 B2 JP5142715 B2 JP 5142715B2 JP 2007523148 A JP2007523148 A JP 2007523148A JP 2007523148 A JP2007523148 A JP 2007523148A JP 5142715 B2 JP5142715 B2 JP 5142715B2
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layer
photo
electrode
cells
electrodes
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Expired - Fee Related
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JP2007523148A
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Japanese (ja)
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JP2008508673A (ja
JP2008508673A5 (enExample
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ホールズ，ジョナサン
ウィルソン，リチャード
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Cambridge Display Technology Ltd
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Cambridge Display Technology Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/601—Assemblies of multiple devices comprising at least one organic radiation-sensitive element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/10—Organic photovoltaic [PV] modules; Arrays of single organic PV cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/88—Terminals, e.g. bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/84—Parallel electrical configurations of multiple OLEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/86—Series electrical configurations of multiple OLEDs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Photovoltaic Devices (AREA)
JP2007523148A 2004-07-27 2005-07-25 有機光−電子装置用積層相互接続 Expired - Fee Related JP5142715B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0416701A GB2416621A (en) 2004-07-27 2004-07-27 Laminated interconnects for opto-electronic device modules
GB0416701.1 2004-07-27
PCT/GB2005/002903 WO2006010911A2 (en) 2004-07-27 2005-07-25 Laminated interconnects for organic opto-electronic device modules

Publications (3)

Publication Number Publication Date
JP2008508673A JP2008508673A (ja) 2008-03-21
JP2008508673A5 JP2008508673A5 (enExample) 2010-07-29
JP5142715B2 true JP5142715B2 (ja) 2013-02-13

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JP2007523148A Expired - Fee Related JP5142715B2 (ja) 2004-07-27 2005-07-25 有機光−電子装置用積層相互接続

Country Status (5)

Country Link
US (1) US8425272B2 (enExample)
JP (1) JP5142715B2 (enExample)
DE (1) DE112005001791T5 (enExample)
GB (2) GB2416621A (enExample)
WO (1) WO2006010911A2 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007005089B3 (de) * 2007-02-01 2008-09-25 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung einer Solarzelle
JP4356899B2 (ja) * 2007-03-15 2009-11-04 財団法人山形県産業技術振興機構 有機ｅｌ発光装置およびその製造方法
DE102007038797A1 (de) * 2007-08-09 2009-02-19 Biametrics Marken Und Rechte Gmbh Untersuchung molekularer Wechselwirkungen an und/oder in dünnen Schichten
JP2010021050A (ja) * 2008-07-11 2010-01-28 Konica Minolta Holdings Inc 有機エレクトロルミネッセンス素子の作製方法
US8350470B2 (en) 2008-12-17 2013-01-08 General Electric Company Encapsulation structures of organic electroluminescence devices
US8102119B2 (en) * 2008-12-17 2012-01-24 General Electric Comapny Encapsulated optoelectronic device and method for making the same
CN102414859B (zh) * 2009-04-23 2015-04-01 皇家飞利浦电子股份有限公司 具有电阻互连层的分段电致发光器件
WO2010125494A1 (en) * 2009-04-27 2010-11-04 Koninklijke Philips Electronics N. V. Organic light emitting diode circuit with cover
JP4661971B2 (ja) * 2009-05-27 2011-03-30 住友化学株式会社 発光装置
WO2011024951A1 (ja) 2009-08-27 2011-03-03 株式会社カネカ 集積化有機発光装置、有機発光装置の製造方法および有機発光装置
US8137148B2 (en) 2009-09-30 2012-03-20 General Electric Company Method of manufacturing monolithic parallel interconnect structure
CN102576806A (zh) * 2009-10-30 2012-07-11 住友化学株式会社 有机光电转换元件的制造方法
JP2013514621A (ja) 2009-12-16 2013-04-25 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 直列に接続されたｏｌｅｄデバイスを生成するための方法
TWI615743B (zh) * 2010-03-25 2018-02-21 永恆科技有限公司 觸控面板及其製造方法
EP2609625B1 (en) 2010-08-24 2015-04-29 Koninklijke Philips N.V. Method of manufacturing an organic electroluminescent device
JP2012113916A (ja) * 2010-11-24 2012-06-14 Sumitomo Chemical Co Ltd 発光装置
WO2012086662A1 (en) * 2010-12-24 2012-06-28 Semiconductor Energy Laboratory Co., Ltd. Lighting device
US8772795B2 (en) 2011-02-14 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and lighting device
US8533639B2 (en) * 2011-09-15 2013-09-10 Taiwan Semiconductor Manufacturing Company, Ltd. Optical proximity correction for active region design layout
EP2640168A1 (en) 2012-03-15 2013-09-18 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Submount, assembly including submount, method of assembling and assembling device
DE102012106607B4 (de) 2012-07-20 2024-04-04 Heliatek Gmbh Verfahren zur Versiegelung von Modulen mit optoelektronischen Bauelementen
US9494792B2 (en) * 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9385342B2 (en) 2013-07-30 2016-07-05 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9287522B2 (en) 2013-07-30 2016-03-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
DE102014205747A1 (de) * 2014-03-27 2015-10-01 Tridonic Gmbh & Co Kg Leuchtmodul und Herstellungsverfahren für ein Leuchtmodul
KR102152034B1 (ko) * 2014-09-30 2020-09-04 코오롱인더스트리 주식회사 유기태양전지 모듈 및 이의 제조방법
DE102017214347B4 (de) * 2017-08-17 2022-08-25 Asca Gmbh Verfahren zur Herstellung eines Fassadenelements sowie Fassadenelement
JP6990598B2 (ja) * 2018-02-19 2022-01-12 浜松ホトニクス株式会社 有機光電変換装置及び有機光電変換装置の製造方法
IT202100000038A1 (it) 2021-01-04 2022-07-04 Polygreen S R L Processo di produzione di un materiale granulare da intaso e relativo materiale granulare da intaso
US20220393092A1 (en) * 2021-06-04 2022-12-08 Anyon Systems Inc. Method for fabricating tunnel junctions

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3713893A (en) * 1969-11-20 1973-01-30 Gould Inc Integrated solar cell array
JPS5628383B2 (enExample) * 1975-03-25 1981-07-01
US4006383A (en) * 1975-11-28 1977-02-01 Westinghouse Electric Corporation Electroluminescent display panel with enlarged active display areas
US4243432A (en) * 1978-09-25 1981-01-06 Photon Power, Inc. Solar cell array
JPS59103383A (ja) * 1982-12-03 1984-06-14 Sanyo Electric Co Ltd 光起電力装置の製造方法
US4539507A (en) 1983-03-25 1985-09-03 Eastman Kodak Company Organic electroluminescent devices having improved power conversion efficiencies
JPS60107872A (ja) * 1983-11-16 1985-06-13 Kanegafuchi Chem Ind Co Ltd 光起電力装置
US4668840A (en) * 1984-06-29 1987-05-26 Sanyo Electric Co., Ltd. Photovoltaic device
US4754544A (en) * 1985-01-30 1988-07-05 Energy Conversion Devices, Inc. Extremely lightweight, flexible semiconductor device arrays
JPS63245964A (ja) * 1987-03-31 1988-10-13 Kanegafuchi Chem Ind Co Ltd 集積型太陽電池
GB8909011D0 (en) 1989-04-20 1989-06-07 Friend Richard H Electroluminescent devices
JP2729239B2 (ja) * 1990-10-17 1998-03-18 昭和シェル石油株式会社 集積型光起電力装置
JP3111797B2 (ja) * 1994-04-01 2000-11-27 富士電機株式会社 薄膜光電変換モジュールの製造方法および製造装置
JPH07297432A (ja) 1994-04-20 1995-11-10 Fuji Electric Co Ltd 薄膜太陽電池モジュール
GB9423692D0 (en) 1994-11-23 1995-01-11 Philips Electronics Uk Ltd A photoresponsive device
US5735966A (en) * 1995-05-15 1998-04-07 Luch; Daniel Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US6265652B1 (en) * 1995-06-15 2001-07-24 Kanegafuchi Kagaku Kogyo Kabushiki Kabushiki Kaisha Integrated thin-film solar battery and method of manufacturing the same
JP3899566B2 (ja) 1996-11-25 2007-03-28 セイコーエプソン株式会社 有機ｅｌ表示装置の製造方法
JP2000252508A (ja) * 1999-03-01 2000-09-14 Kanegafuchi Chem Ind Co Ltd 集積化光電変換装置
JP2001007359A (ja) * 1999-06-25 2001-01-12 Kanegafuchi Chem Ind Co Ltd 集積化光電変換装置およびその製造方法
GB9928014D0 (en) 1999-11-26 2000-01-26 Cambridge Display Tech Ltd Method of producing an organic light-emissive device
US6566808B1 (en) * 1999-12-22 2003-05-20 General Electric Company Luminescent display and method of making
GB0104177D0 (en) 2001-02-20 2001-04-11 Isis Innovation Aryl-aryl dendrimers
FR2831714B1 (fr) 2001-10-30 2004-06-18 Dgtec Assemblage de cellules photovoltaiques
US7049757B2 (en) * 2002-08-05 2006-05-23 General Electric Company Series connected OLED structure and fabrication method
US6693296B1 (en) * 2002-08-07 2004-02-17 Eastman Kodak Company OLED apparatus including a series of OLED devices
US7034470B2 (en) * 2002-08-07 2006-04-25 Eastman Kodak Company Serially connecting OLED devices for area illumination
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
GB0229653D0 (en) * 2002-12-20 2003-01-22 Cambridge Display Tech Ltd Electrical connection of optoelectronic devices
US20050170735A1 (en) * 2004-02-04 2005-08-04 Strip David R. Manufacture of flat panel light emitting devices
US7122398B1 (en) * 2004-03-25 2006-10-17 Nanosolar, Inc. Manufacturing of optoelectronic devices
US7777128B2 (en) * 2004-06-01 2010-08-17 Konarka Technologies, Inc. Photovoltaic module architecture
EP2299779A3 (en) * 2004-09-13 2011-05-04 Semiconductor Energy Laboratory Co, Ltd. Light emitting layer device

Also Published As

Publication number Publication date
US8425272B2 (en) 2013-04-23
WO2006010911A2 (en) 2006-02-02
JP2008508673A (ja) 2008-03-21
DE112005001791T5 (de) 2007-06-06
GB0416701D0 (en) 2004-09-01
GB2430806A (en) 2007-04-04
GB2430806B (en) 2009-04-01
US20090189515A1 (en) 2009-07-30
WO2006010911A3 (en) 2006-09-21
GB0700916D0 (en) 2007-02-28
GB2416621A (en) 2006-02-01

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