JP2008508673A5 - - Google Patents

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Publication number
JP2008508673A5
JP2008508673A5 JP2007523148A JP2007523148A JP2008508673A5 JP 2008508673 A5 JP2008508673 A5 JP 2008508673A5 JP 2007523148 A JP2007523148 A JP 2007523148A JP 2007523148 A JP2007523148 A JP 2007523148A JP 2008508673 A5 JP2008508673 A5 JP 2008508673A5
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JP
Japan
Prior art keywords
layer
light
electrode
electrodes
cells
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007523148A
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English (en)
Japanese (ja)
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JP2008508673A (ja
JP5142715B2 (ja
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Publication date
Priority claimed from GB0416701A external-priority patent/GB2416621A/en
Application filed filed Critical
Publication of JP2008508673A publication Critical patent/JP2008508673A/ja
Publication of JP2008508673A5 publication Critical patent/JP2008508673A5/ja
Application granted granted Critical
Publication of JP5142715B2 publication Critical patent/JP5142715B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2007523148A 2004-07-27 2005-07-25 有機光−電子装置用積層相互接続 Expired - Fee Related JP5142715B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0416701A GB2416621A (en) 2004-07-27 2004-07-27 Laminated interconnects for opto-electronic device modules
GB0416701.1 2004-07-27
PCT/GB2005/002903 WO2006010911A2 (en) 2004-07-27 2005-07-25 Laminated interconnects for organic opto-electronic device modules

Publications (3)

Publication Number Publication Date
JP2008508673A JP2008508673A (ja) 2008-03-21
JP2008508673A5 true JP2008508673A5 (enExample) 2010-07-29
JP5142715B2 JP5142715B2 (ja) 2013-02-13

Family

ID=32947490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007523148A Expired - Fee Related JP5142715B2 (ja) 2004-07-27 2005-07-25 有機光−電子装置用積層相互接続

Country Status (5)

Country Link
US (1) US8425272B2 (enExample)
JP (1) JP5142715B2 (enExample)
DE (1) DE112005001791T5 (enExample)
GB (2) GB2416621A (enExample)
WO (1) WO2006010911A2 (enExample)

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DE102012106607B4 (de) 2012-07-20 2024-04-04 Heliatek Gmbh Verfahren zur Versiegelung von Modulen mit optoelektronischen Bauelementen
US9494792B2 (en) * 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9385342B2 (en) 2013-07-30 2016-07-05 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9287522B2 (en) 2013-07-30 2016-03-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
DE102014205747A1 (de) * 2014-03-27 2015-10-01 Tridonic Gmbh & Co Kg Leuchtmodul und Herstellungsverfahren für ein Leuchtmodul
KR102152034B1 (ko) * 2014-09-30 2020-09-04 코오롱인더스트리 주식회사 유기태양전지 모듈 및 이의 제조방법
DE102017214347B4 (de) * 2017-08-17 2022-08-25 Asca Gmbh Verfahren zur Herstellung eines Fassadenelements sowie Fassadenelement
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