JP4356899B2 - 有機el発光装置およびその製造方法 - Google Patents
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- JP4356899B2 JP4356899B2 JP2007066073A JP2007066073A JP4356899B2 JP 4356899 B2 JP4356899 B2 JP 4356899B2 JP 2007066073 A JP2007066073 A JP 2007066073A JP 2007066073 A JP2007066073 A JP 2007066073A JP 4356899 B2 JP4356899 B2 JP 4356899B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 238000000034 method Methods 0.000 title description 16
- 239000004020 conductor Substances 0.000 claims description 70
- 239000000758 substrate Substances 0.000 claims description 41
- 238000005192 partition Methods 0.000 claims description 23
- 239000002923 metal particle Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 74
- 238000007740 vapor deposition Methods 0.000 description 35
- 239000000463 material Substances 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000000151 deposition Methods 0.000 description 12
- 230000008021 deposition Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000007772 electrode material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000001989 lithium alloy Substances 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/86—Series electrical configurations of multiple OLEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/861—Repairing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2041—Beam type
- H10N30/2042—Cantilevers, i.e. having one fixed end
- H10N30/2044—Cantilevers, i.e. having one fixed end having multiple segments mechanically connected in series, e.g. zig-zag type
Description
2a〜2c 第1電極(透明電極)
3a〜3c 有機EL発光層
4a〜4c 第2電極(対向電極)
5 導体部
6 絶縁層
7 セパレータ
7a オーバハング部
7b 絶縁ギャップ部
8 隔壁部
9 絶縁ギャップ部
11 蒸着装置
12 ノズル開口
13 案内板
Claims (7)
- 第1電極、有機EL発光層および第2電極からなる複数の発光セグメントが基板上に形成され、前記各発光セグメントが直列に接続された構成の有機EL発光装置であって、
隣接する発光セグメントの境界部における前記第1電極上に、前記第2電極とは別に形成された導体部を前記第1電極と導通状態に接続形成すると共に、前記導体部は前記境界部に沿って連続した隔壁状に、かつ前記第2電極よりも高く形成され、前記各第1電極上に前記有機EL発光層と前記第2電極とがそれぞれ積層されることにより、前記第2電極よりも突出した前記導体部が、前記有機EL発光層上の第2電極に接続され、前記導体部を介して隣接する発光セグメントにおける前記第1電極と前記第2電極とが電気的に接続されていることを特徴とする有機EL発光装置。 - 前記基板の法線方向の面において切断した前記導体部の断面形状が、長方形もしくは逆台形に形成されていることを特徴とする請求項1に記載された有機EL発光装置。
- 前記導体部における頂上部には、P−V値で10nm〜10μmの凹凸が形成されていることを特徴とする請求項1または請求項2に記載された有機EL発光装置。
- 前記導体部が導電性ペーストにより形成され、前記導電性ペーストに含まれる金属粒子の粒径が、1nm〜10μmに選定されていることを特徴とする請求項1ないし請求項3のいずれか1項に記載された有機EL発光装置。
- 前記各発光セグメントの導体部にそれぞれ隣接するようにして隔壁状のセパレータが発光セグメントの境界部に沿ってさらに形成され、当該セパレータにより前記第2電極の形成時において、第2電極を発光セグメントごとに電気的に分離する絶縁ギャップ部をセパレータの根元部分に形成することを特徴とする請求項1ないし請求項4のいずれか1項に記載された有機EL発光装置。
- 前記セパレータの上部には、前記基板の面に平行な方向に突出するオーバハング部が形成されていることを特徴とする請求項5に記載された有機EL発光装置。
- 第1電極、有機EL発光層および第2電極からなる複数の発光セグメントが基板上に形成され、前記各発光セグメントが直列に接続された構成の有機EL発光装置の製造方法であって、
前記各発光セグメントごとの前記第1電極をそれぞれ分離した状態で前記基板上に形成するパターニング工程と、
前記基板上の隣り合う発光セグメントの境界部における前記第1電極上に、導体部を前記第1電極と導通状態に接続形成すると共に、前記導体部は前記境界部に沿って連続した隔壁状に、かつ後工程において形成される第2電極よりも高く形成する工程と、
前記第1電極上に前記有機EL発光層を形成する工程と、
前記有機EL発光層上に前記第2電極を形成する工程と、
を実行することにより、前記第2電極よりも突出した前記導体部が、前記有機EL発光層上の第2電極に接続され、
隣接する発光セグメント間における前記第1電極と前記第2電極とが前記導体部を介して電気的に接続した構成を得ることを特徴とする有機EL発光装置の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007066073A JP4356899B2 (ja) | 2007-03-15 | 2007-03-15 | 有機el発光装置およびその製造方法 |
TW097105939A TW200906220A (en) | 2007-03-15 | 2008-02-20 | Organic EL light emitting device and method for manufacturing the same |
KR1020080020054A KR20080084610A (ko) | 2007-03-15 | 2008-03-04 | 유기 el 발광 장치 및 그 제조 방법 |
EP08004157A EP1970960A3 (en) | 2007-03-15 | 2008-03-06 | Organic EL light emitting device and method for manufacturing the same |
US12/048,518 US20080224606A1 (en) | 2007-03-15 | 2008-03-14 | Organic el light emitting device and method for manufacturing the same |
CNA2008100811970A CN101267702A (zh) | 2007-03-15 | 2008-03-14 | 有机el发光装置及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007066073A JP4356899B2 (ja) | 2007-03-15 | 2007-03-15 | 有機el発光装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2008227326A JP2008227326A (ja) | 2008-09-25 |
JP4356899B2 true JP4356899B2 (ja) | 2009-11-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007066073A Expired - Fee Related JP4356899B2 (ja) | 2007-03-15 | 2007-03-15 | 有機el発光装置およびその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080224606A1 (ja) |
EP (1) | EP1970960A3 (ja) |
JP (1) | JP4356899B2 (ja) |
KR (1) | KR20080084610A (ja) |
CN (1) | CN101267702A (ja) |
TW (1) | TW200906220A (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008049057B4 (de) | 2008-09-26 | 2019-01-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Organisches opto-elektrisches Bauelement und ein Verfahren zur Herstellung eines organischen opto-elektrischen Bauelements |
EP2404336A2 (en) * | 2009-03-05 | 2012-01-11 | Koninklijke Philips Electronics N.V. | Oleds connected in series |
JP4661971B2 (ja) * | 2009-05-27 | 2011-03-30 | 住友化学株式会社 | 発光装置 |
KR101742114B1 (ko) * | 2009-12-03 | 2017-05-31 | 노발레드 게엠베하 | 유기 광-전자 디바이스에 전기 상호접속부를 형성하기 위한 방법, 유기 광-전자 디바이스를 형성하기 위한 방법, 및 유기 발광 디바이스 |
EP2355199B1 (en) * | 2010-01-29 | 2017-07-05 | Novaled GmbH | A method for producing an organic light emitting device |
TW201123957A (en) * | 2009-12-17 | 2011-07-01 | Au Optronics Corp | Light-emitting apparatus, pixel structure, contact structure and method for fabricting the same |
US9666827B2 (en) | 2010-08-13 | 2017-05-30 | Lg Display Co., Ltd. | Organic light-emitting element including a conductive pattern which passes through an organic material layer to connect to an external terminal of a second electrode |
WO2012090889A1 (en) | 2010-12-28 | 2012-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting unit, light-emitting device, and lighting device |
WO2012090798A1 (en) * | 2010-12-28 | 2012-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting unit, light-emitting device, lighting device, and method for manufacturing light-emitting unit |
WO2012102218A1 (ja) * | 2011-01-24 | 2012-08-02 | 株式会社日立製作所 | 有機発光装置及びその製造方法 |
US9516713B2 (en) * | 2011-01-25 | 2016-12-06 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device |
WO2012108366A1 (en) | 2011-02-10 | 2012-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and manufacturing method thereof, lighting device, and display device |
JP5925511B2 (ja) * | 2011-02-11 | 2016-05-25 | 株式会社半導体エネルギー研究所 | 発光ユニット、発光装置、照明装置 |
US8772795B2 (en) * | 2011-02-14 | 2014-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and lighting device |
TWI562423B (en) | 2011-03-02 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Light-emitting device and lighting device |
EP2715829B1 (en) * | 2011-05-23 | 2016-06-29 | OLEDWorks GmbH | Method for fabricating a patterned layer |
JP6150733B2 (ja) * | 2012-01-05 | 2017-06-21 | 株式会社カネカ | 有機el装置の製造方法 |
KR102112649B1 (ko) | 2013-11-25 | 2020-05-19 | 엘지디스플레이 주식회사 | 유기전계 발광소자 및 이의 리페어 방법 |
EP3929991A1 (en) | 2020-06-23 | 2021-12-29 | H. Glass SA | Multilayer electronic device and method for producing the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6566808B1 (en) | 1999-12-22 | 2003-05-20 | General Electric Company | Luminescent display and method of making |
US6693296B1 (en) * | 2002-08-07 | 2004-02-17 | Eastman Kodak Company | OLED apparatus including a series of OLED devices |
JP4369211B2 (ja) * | 2003-11-28 | 2009-11-18 | オプトレックス株式会社 | 有機elディスプレイの製造方法 |
US7122398B1 (en) | 2004-03-25 | 2006-10-17 | Nanosolar, Inc. | Manufacturing of optoelectronic devices |
GB2416621A (en) * | 2004-07-27 | 2006-02-01 | Cambridge Display Tech Ltd | Laminated interconnects for opto-electronic device modules |
-
2007
- 2007-03-15 JP JP2007066073A patent/JP4356899B2/ja not_active Expired - Fee Related
-
2008
- 2008-02-20 TW TW097105939A patent/TW200906220A/zh unknown
- 2008-03-04 KR KR1020080020054A patent/KR20080084610A/ko not_active Application Discontinuation
- 2008-03-06 EP EP08004157A patent/EP1970960A3/en not_active Withdrawn
- 2008-03-14 US US12/048,518 patent/US20080224606A1/en not_active Abandoned
- 2008-03-14 CN CNA2008100811970A patent/CN101267702A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1970960A3 (en) | 2009-02-25 |
TW200906220A (en) | 2009-02-01 |
EP1970960A2 (en) | 2008-09-17 |
KR20080084610A (ko) | 2008-09-19 |
JP2008227326A (ja) | 2008-09-25 |
US20080224606A1 (en) | 2008-09-18 |
CN101267702A (zh) | 2008-09-17 |
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