DE112005001791T5 - Laminierte Verbindungsleitungen für organische, optoelektronische Bauelementemodule - Google Patents

Laminierte Verbindungsleitungen für organische, optoelektronische Bauelementemodule Download PDF

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Publication number
DE112005001791T5
DE112005001791T5 DE112005001791T DE112005001791T DE112005001791T5 DE 112005001791 T5 DE112005001791 T5 DE 112005001791T5 DE 112005001791 T DE112005001791 T DE 112005001791T DE 112005001791 T DE112005001791 T DE 112005001791T DE 112005001791 T5 DE112005001791 T5 DE 112005001791T5
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DE
Germany
Prior art keywords
layer
electrodes
electrode
cells
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112005001791T
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German (de)
English (en)
Inventor
Jonathan Cambridge Halls
Richard Cambridge Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambridge Display Technology Ltd
Original Assignee
Cambridge Display Technology Ltd
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Filing date
Publication date
Application filed by Cambridge Display Technology Ltd filed Critical Cambridge Display Technology Ltd
Publication of DE112005001791T5 publication Critical patent/DE112005001791T5/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/601—Assemblies of multiple devices comprising at least one organic radiation-sensitive element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/10—Organic photovoltaic [PV] modules; Arrays of single organic PV cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/88—Terminals, e.g. bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/84—Parallel electrical configurations of multiple OLEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/86—Series electrical configurations of multiple OLEDs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Photovoltaic Devices (AREA)
DE112005001791T 2004-07-27 2005-07-25 Laminierte Verbindungsleitungen für organische, optoelektronische Bauelementemodule Withdrawn DE112005001791T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0416701.1 2004-07-27
GB0416701A GB2416621A (en) 2004-07-27 2004-07-27 Laminated interconnects for opto-electronic device modules
PCT/GB2005/002903 WO2006010911A2 (en) 2004-07-27 2005-07-25 Laminated interconnects for organic opto-electronic device modules

Publications (1)

Publication Number Publication Date
DE112005001791T5 true DE112005001791T5 (de) 2007-06-06

Family

ID=32947490

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112005001791T Withdrawn DE112005001791T5 (de) 2004-07-27 2005-07-25 Laminierte Verbindungsleitungen für organische, optoelektronische Bauelementemodule

Country Status (5)

Country Link
US (1) US8425272B2 (enExample)
JP (1) JP5142715B2 (enExample)
DE (1) DE112005001791T5 (enExample)
GB (2) GB2416621A (enExample)
WO (1) WO2006010911A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
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DE102007038797A1 (de) * 2007-08-09 2009-02-19 Biametrics Marken Und Rechte Gmbh Untersuchung molekularer Wechselwirkungen an und/oder in dünnen Schichten
DE102012106607B4 (de) 2012-07-20 2024-04-04 Heliatek Gmbh Verfahren zur Versiegelung von Modulen mit optoelektronischen Bauelementen

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JP2010021050A (ja) * 2008-07-11 2010-01-28 Konica Minolta Holdings Inc 有機エレクトロルミネッセンス素子の作製方法
US8102119B2 (en) * 2008-12-17 2012-01-24 General Electric Comapny Encapsulated optoelectronic device and method for making the same
US8350470B2 (en) 2008-12-17 2013-01-08 General Electric Company Encapsulation structures of organic electroluminescence devices
US8283849B2 (en) 2009-04-23 2012-10-09 Koninklijke Philips Electronics N.V. Segmented electroluminescent device with resistive interconnect layers
WO2010125494A1 (en) * 2009-04-27 2010-11-04 Koninklijke Philips Electronics N. V. Organic light emitting diode circuit with cover
JP4661971B2 (ja) * 2009-05-27 2011-03-30 住友化学株式会社 発光装置
CN102474934B (zh) 2009-08-27 2014-12-31 株式会社钟化 集成化有机发光装置、有机发光装置的制造方法及有机发光装置
US8137148B2 (en) 2009-09-30 2012-03-20 General Electric Company Method of manufacturing monolithic parallel interconnect structure
US20120216868A1 (en) * 2009-10-30 2012-08-30 Takahiro Seike Manufacturing method of organic photovoltaic cell
KR20120104347A (ko) 2009-12-16 2012-09-20 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 직렬 접속된 ｏｌｅｄ 디바이스들을 생성하기 위한 방법
TWI615743B (zh) * 2010-03-25 2018-02-21 永恆科技有限公司 觸控面板及其製造方法
WO2012025867A1 (en) 2010-08-24 2012-03-01 Koninklijke Philips Electronics N.V. Organic electroluminescent device
JP2012113916A (ja) * 2010-11-24 2012-06-14 Sumitomo Chemical Co Ltd 発光装置
KR101872925B1 (ko) * 2010-12-24 2018-06-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 조명 장치
US8772795B2 (en) 2011-02-14 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and lighting device
US8533639B2 (en) * 2011-09-15 2013-09-10 Taiwan Semiconductor Manufacturing Company, Ltd. Optical proximity correction for active region design layout
EP2640168A1 (en) 2012-03-15 2013-09-18 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Submount, assembly including submount, method of assembling and assembling device
US9385342B2 (en) 2013-07-30 2016-07-05 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9494792B2 (en) 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9287522B2 (en) 2013-07-30 2016-03-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
DE102014205747A1 (de) * 2014-03-27 2015-10-01 Tridonic Gmbh & Co Kg Leuchtmodul und Herstellungsverfahren für ein Leuchtmodul
KR102152034B1 (ko) * 2014-09-30 2020-09-04 코오롱인더스트리 주식회사 유기태양전지 모듈 및 이의 제조방법
DE102017214347B4 (de) * 2017-08-17 2022-08-25 Asca Gmbh Verfahren zur Herstellung eines Fassadenelements sowie Fassadenelement
JP6990598B2 (ja) * 2018-02-19 2022-01-12 浜松ホトニクス株式会社 有機光電変換装置及び有機光電変換装置の製造方法
IT202100000038A1 (it) 2021-01-04 2022-07-04 Polygreen S R L Processo di produzione di un materiale granulare da intaso e relativo materiale granulare da intaso
US20220393092A1 (en) * 2021-06-04 2022-12-08 Anyon Systems Inc. Method for fabricating tunnel junctions

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007038797A1 (de) * 2007-08-09 2009-02-19 Biametrics Marken Und Rechte Gmbh Untersuchung molekularer Wechselwirkungen an und/oder in dünnen Schichten
DE102012106607B4 (de) 2012-07-20 2024-04-04 Heliatek Gmbh Verfahren zur Versiegelung von Modulen mit optoelektronischen Bauelementen

Also Published As

Publication number Publication date
GB2416621A (en) 2006-02-01
GB2430806A (en) 2007-04-04
JP5142715B2 (ja) 2013-02-13
GB0416701D0 (en) 2004-09-01
JP2008508673A (ja) 2008-03-21
WO2006010911A2 (en) 2006-02-02
US20090189515A1 (en) 2009-07-30
GB2430806B (en) 2009-04-01
WO2006010911A3 (en) 2006-09-21
GB0700916D0 (en) 2007-02-28
US8425272B2 (en) 2013-04-23

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