JP5137947B2 - 効率的なトランジスタ構造 - Google Patents
効率的なトランジスタ構造 Download PDFInfo
- Publication number
- JP5137947B2 JP5137947B2 JP2009509836A JP2009509836A JP5137947B2 JP 5137947 B2 JP5137947 B2 JP 5137947B2 JP 2009509836 A JP2009509836 A JP 2009509836A JP 2009509836 A JP2009509836 A JP 2009509836A JP 5137947 B2 JP5137947 B2 JP 5137947B2
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- Japan
- Prior art keywords
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- source
- drain
- regions
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000003990 capacitor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 39
- 238000000034 method Methods 0.000 description 17
- 230000001788 irregular Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 2
- 241000219793 Trifolium Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823418—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823437—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
Description
Claims (6)
- 第1のソースと、
第1のドレインと、
第2のソースと、
前記第1のソースと前記第1のドレインとの間に配置される第1のゲートと、
前記第1のドレインと前記第2のソースとの間に配置される第2のゲートと、
ウェルコンタクトと、
を備え、
前記第1のゲートおよび前記第2のゲートは、前記第1のドレイン内に交互に配置される第1の領域および第2の領域を定め、
前記第1のゲートおよび前記第2のゲートは、前記第2の領域より前記第1の領域内での方が間隔をより大きくとって配置され、
前記ウェルコンタクトは、前記第1の領域内に配置される、
集積回路。 - 前記第1の領域内にR個の前記ウェルコンタクトが配置され、Rは1より大きい整数である、請求項1に記載の集積回路。
- Rは、3より大きく7より小さい整数である、請求項2に記載の集積回路。
- 前記集積回路は、前記第1のソース、前記第1のドレインおよび前記第1のゲートで形成される複数のトランジスタと、前記第2のソース、前記第1のドレインおよび前記第2のゲートで形成されるトランジスタとを有する、請求項1に記載の集積回路。
- 前記複数のトランジスタは、PMOSトランジスタを含む、請求項4に記載の集積回路。
- 前記R個のウェルコンタクトは、前記第1のソース、前記第1のドレインおよび前記第1のゲートで形成されるR個のトランジスタによって共有される、請求項2に記載の集積回路。
Applications Claiming Priority (19)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US79856806P | 2006-05-08 | 2006-05-08 | |
US60/798,568 | 2006-05-08 | ||
US82100806P | 2006-08-01 | 2006-08-01 | |
US60/821,008 | 2006-08-01 | ||
US82333206P | 2006-08-23 | 2006-08-23 | |
US60/823,332 | 2006-08-23 | ||
US82435706P | 2006-09-01 | 2006-09-01 | |
US60/824,357 | 2006-09-01 | ||
US82551706P | 2006-09-13 | 2006-09-13 | |
US60/825,517 | 2006-09-13 | ||
US11/524,113 US7851872B2 (en) | 2003-10-22 | 2006-09-20 | Efficient transistor structure |
US11/524,113 | 2006-09-20 | ||
US11/586,467 US7528444B2 (en) | 2003-10-22 | 2006-10-25 | Efficient transistor structure |
US11/586,471 | 2006-10-25 | ||
US11/586,470 US7863657B2 (en) | 2003-10-22 | 2006-10-25 | Efficient transistor structure |
US11/586,467 | 2006-10-25 | ||
US11/586,471 US7652338B2 (en) | 2003-10-22 | 2006-10-25 | Efficient transistor structure |
US11/586,470 | 2006-10-25 | ||
PCT/US2007/011207 WO2007136556A2 (en) | 2006-05-08 | 2007-05-08 | Efficient transistor structure |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009536789A JP2009536789A (ja) | 2009-10-15 |
JP2009536789A5 JP2009536789A5 (ja) | 2010-06-17 |
JP5137947B2 true JP5137947B2 (ja) | 2013-02-06 |
Family
ID=38723776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009509836A Expired - Fee Related JP5137947B2 (ja) | 2006-05-08 | 2007-05-08 | 効率的なトランジスタ構造 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2030237B1 (ja) |
JP (1) | JP5137947B2 (ja) |
KR (1) | KR101373792B1 (ja) |
CN (1) | CN101490843B (ja) |
TW (4) | TWI407566B (ja) |
WO (1) | WO2007136556A2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2100334B1 (en) * | 2006-12-28 | 2016-04-13 | Marvell World Trade Ltd. | Geometry of mos device with low on-resistance |
CN102623496B (zh) * | 2011-01-27 | 2014-11-05 | 无锡华润上华半导体有限公司 | 矩阵型mos场效应晶体管 |
JP5586546B2 (ja) * | 2011-03-23 | 2014-09-10 | 株式会社東芝 | 半導体装置 |
CN111599862A (zh) * | 2020-05-21 | 2020-08-28 | Oppo广东移动通信有限公司 | 晶体管以及集成电路 |
US20220254854A1 (en) * | 2020-07-10 | 2022-08-11 | Sony Group Corporation | Drive circuit array substrate, display device, and electronic apparatus |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
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US4409499A (en) * | 1982-06-14 | 1983-10-11 | Standard Microsystems Corporation | High-speed merged plane logic function array |
JPS6076160A (ja) * | 1983-10-03 | 1985-04-30 | Seiko Epson Corp | 半導体集積回路 |
JPH01207976A (ja) * | 1988-02-15 | 1989-08-21 | Nec Corp | 半導体装置 |
EP0466463A1 (en) * | 1990-07-10 | 1992-01-15 | Kawasaki Steel Corporation | Basic cell and arrangement structure thereof |
JPH07161984A (ja) * | 1993-12-06 | 1995-06-23 | Mitsubishi Electric Corp | 半導体集積回路装置 |
JPH07283377A (ja) * | 1994-01-03 | 1995-10-27 | Texas Instr Inc <Ti> | 小型ゲートアレイおよびその製造方法 |
JP2611687B2 (ja) * | 1995-06-26 | 1997-05-21 | セイコーエプソン株式会社 | 半導体装置 |
US5838050A (en) * | 1996-06-19 | 1998-11-17 | Winbond Electronics Corp. | Hexagon CMOS device |
US6236258B1 (en) * | 1998-08-25 | 2001-05-22 | International Business Machines Corporation | Wordline driver circuit using ring-shaped devices |
JP2000208759A (ja) * | 1999-01-12 | 2000-07-28 | Rohm Co Ltd | 半導体装置 |
DE19958906A1 (de) * | 1999-12-07 | 2001-07-05 | Infineon Technologies Ag | Herstellung von integrierten Schaltungen |
JP2001339047A (ja) * | 2000-05-29 | 2001-12-07 | Matsushita Electric Ind Co Ltd | 半導体装置 |
TW447129B (en) * | 2000-06-30 | 2001-07-21 | United Microelectronics Corp | Array type SOI transistor layout |
JP4124981B2 (ja) * | 2001-06-04 | 2008-07-23 | 株式会社ルネサステクノロジ | 電力用半導体装置および電源回路 |
US6566710B1 (en) * | 2001-08-29 | 2003-05-20 | National Semiconductor Corporation | Power MOSFET cell with a crossed bar shaped body contact area |
US6724044B2 (en) * | 2002-05-10 | 2004-04-20 | General Semiconductor, Inc. | MOSFET device having geometry that permits frequent body contact |
JP5179692B2 (ja) * | 2002-08-30 | 2013-04-10 | 富士通セミコンダクター株式会社 | 半導体記憶装置及びその製造方法 |
US7079829B2 (en) * | 2002-11-15 | 2006-07-18 | Matsushita Electric Industrial Co, Ltd. | Semiconductor differential circuit, oscillation apparatus, switching apparatus, amplifying apparatus, mixer apparatus and circuit apparatus using same, and semiconductor differential circuit placement method |
KR100485174B1 (ko) | 2002-12-24 | 2005-04-22 | 동부아남반도체 주식회사 | 모스 트랜지스터 제조 방법 |
JP3708082B2 (ja) * | 2003-02-27 | 2005-10-19 | 株式会社ルネサステクノロジ | 電力半導体装置 |
US7091565B2 (en) * | 2003-10-22 | 2006-08-15 | Marvell World Trade Ltd. | Efficient transistor structure |
TWI241720B (en) * | 2004-01-16 | 2005-10-11 | Super Nova Optoelectronics Cor | Replaceable light emitting diode packaging structure |
JP2005311131A (ja) * | 2004-04-22 | 2005-11-04 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
JP2007258314A (ja) * | 2006-03-22 | 2007-10-04 | Seiko Npc Corp | 半導体装置の製造方法及び半導体装置 |
-
2007
- 2007-05-08 KR KR1020087029444A patent/KR101373792B1/ko not_active IP Right Cessation
- 2007-05-08 TW TW096116397A patent/TWI407566B/zh not_active IP Right Cessation
- 2007-05-08 TW TW096116401A patent/TW200805663A/zh unknown
- 2007-05-08 EP EP07809055A patent/EP2030237B1/en not_active Expired - Fee Related
- 2007-05-08 TW TW096116400A patent/TWI420665B/zh not_active IP Right Cessation
- 2007-05-08 JP JP2009509836A patent/JP5137947B2/ja not_active Expired - Fee Related
- 2007-05-08 CN CN2007800259194A patent/CN101490843B/zh not_active Expired - Fee Related
- 2007-05-08 WO PCT/US2007/011207 patent/WO2007136556A2/en active Application Filing
- 2007-05-08 TW TW096116398A patent/TWI429078B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200802870A (en) | 2008-01-01 |
WO2007136556A2 (en) | 2007-11-29 |
JP2009536789A (ja) | 2009-10-15 |
KR101373792B1 (ko) | 2014-03-13 |
EP2030237B1 (en) | 2011-02-09 |
WO2007136556B1 (en) | 2008-08-28 |
TWI429078B (zh) | 2014-03-01 |
CN101490843B (zh) | 2011-01-26 |
TW200802869A (en) | 2008-01-01 |
TWI420665B (zh) | 2013-12-21 |
TW200805662A (en) | 2008-01-16 |
TW200805663A (en) | 2008-01-16 |
CN101490843A (zh) | 2009-07-22 |
TWI407566B (zh) | 2013-09-01 |
KR20090013219A (ko) | 2009-02-04 |
WO2007136556A3 (en) | 2008-07-03 |
EP2030237A2 (en) | 2009-03-04 |
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