JP5130939B2 - 半導体用接着組成物およびそれを用いた半導体装置の製造方法 - Google Patents

半導体用接着組成物およびそれを用いた半導体装置の製造方法 Download PDF

Info

Publication number
JP5130939B2
JP5130939B2 JP2008031396A JP2008031396A JP5130939B2 JP 5130939 B2 JP5130939 B2 JP 5130939B2 JP 2008031396 A JP2008031396 A JP 2008031396A JP 2008031396 A JP2008031396 A JP 2008031396A JP 5130939 B2 JP5130939 B2 JP 5130939B2
Authority
JP
Japan
Prior art keywords
semiconductor
adhesive composition
epoxy compound
weight
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008031396A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009194054A5 (https=
JP2009194054A (ja
Inventor
健一 霞
浩一 藤丸
敏央 野中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2008031396A priority Critical patent/JP5130939B2/ja
Publication of JP2009194054A publication Critical patent/JP2009194054A/ja
Publication of JP2009194054A5 publication Critical patent/JP2009194054A5/ja
Application granted granted Critical
Publication of JP5130939B2 publication Critical patent/JP5130939B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
JP2008031396A 2008-02-13 2008-02-13 半導体用接着組成物およびそれを用いた半導体装置の製造方法 Active JP5130939B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008031396A JP5130939B2 (ja) 2008-02-13 2008-02-13 半導体用接着組成物およびそれを用いた半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008031396A JP5130939B2 (ja) 2008-02-13 2008-02-13 半導体用接着組成物およびそれを用いた半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009194054A JP2009194054A (ja) 2009-08-27
JP2009194054A5 JP2009194054A5 (https=) 2011-03-03
JP5130939B2 true JP5130939B2 (ja) 2013-01-30

Family

ID=41075843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008031396A Active JP5130939B2 (ja) 2008-02-13 2008-02-13 半導体用接着組成物およびそれを用いた半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP5130939B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10703945B2 (en) 2018-04-25 2020-07-07 Daxin Materials Corporation Method for temporary bonding workpiece and adhesive

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5444986B2 (ja) * 2009-09-16 2014-03-19 東レ株式会社 半導体用接着組成物、それを用いた半導体装置
MY178933A (en) * 2009-10-19 2020-10-23 Toray Industries Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor device using the same
JP5630639B2 (ja) * 2010-07-07 2014-11-26 住友電気工業株式会社 フィルム状導電性接着剤
JP5779895B2 (ja) * 2011-02-08 2015-09-16 東レ株式会社 半導体用絶縁性接着剤
CN103958602B (zh) 2011-11-29 2016-09-07 东丽株式会社 树脂组合物、树脂组合物片材、半导体器件及其制备方法
CN105339410B (zh) * 2014-06-04 2019-08-20 日立化成株式会社 膜状环氧树脂组合物、膜状环氧树脂组合物的制造方法和半导体装置的制造方法
KR20190142333A (ko) * 2017-04-21 2019-12-26 히타치가세이가부시끼가이샤 반도체 장치 및 그 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000319620A (ja) * 1999-05-06 2000-11-21 Nitto Denko Corp 液状接着剤組成物
JP3894781B2 (ja) * 2001-12-07 2007-03-22 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電膜
JP4449325B2 (ja) * 2003-04-17 2010-04-14 住友ベークライト株式会社 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
JP4394547B2 (ja) * 2004-09-13 2010-01-06 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電膜を用いた接続方法
US8653202B2 (en) * 2005-06-06 2014-02-18 Toray Industries, Inc. Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10703945B2 (en) 2018-04-25 2020-07-07 Daxin Materials Corporation Method for temporary bonding workpiece and adhesive

Also Published As

Publication number Publication date
JP2009194054A (ja) 2009-08-27

Similar Documents

Publication Publication Date Title
JP3995022B2 (ja) 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
JP5141366B2 (ja) 半導体用接着フィルムおよびこれを用いた半導体装置の製造方法
JP5130939B2 (ja) 半導体用接着組成物およびそれを用いた半導体装置の製造方法
JP5740979B2 (ja) 接着組成物、接着シート、それらを用いた回路基板および半導体装置ならびにそれらの製造方法
JP5422878B2 (ja) 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
CN104870595B (zh) 粘合剂、粘合膜、半导体器件及其制造方法
JP6040935B2 (ja) 樹脂組成物、樹脂組成物シート、半導体装置およびその製造方法
JP5040247B2 (ja) 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
KR20160019474A (ko) 수지 조성물, 수지 시트 및 반도체 장치의 제조 방법
JP5609357B2 (ja) 組成物およびそれからなる組成物シート
JP6112013B2 (ja) バンプ電極付き半導体装置製造用接着剤シートおよび半導体装置の製造方法
JP2017141317A (ja) 仮貼り樹脂組成物、樹脂層、永久接着剤、仮貼り接着剤、ウエハ加工体およびこれらを用いた半導体装置の製造方法
JP6716939B2 (ja) 接着剤、それからなる接着フィルム、それらの硬化物を含む半導体装置およびその製造方法
WO2015107990A1 (ja) 接着組成物ならびにそれを有する接着フィルム、接着組成物付き基板、半導体装置およびその製造方法
JP5292793B2 (ja) 半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法
JP5040252B2 (ja) 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法。
JP2003261834A (ja) 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法
JP5103870B2 (ja) 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
JP2009021562A (ja) 半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法
JP2009302426A (ja) 回路基板の製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110114

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110114

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120213

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120221

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120522

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120820

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20120904

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121009

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121022

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151116

Year of fee payment: 3

R151 Written notification of patent or utility model registration

Ref document number: 5130939

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151116

Year of fee payment: 3