JP5130640B2 - 蛍光体の製造方法 - Google Patents
蛍光体の製造方法 Download PDFInfo
- Publication number
- JP5130640B2 JP5130640B2 JP2006086850A JP2006086850A JP5130640B2 JP 5130640 B2 JP5130640 B2 JP 5130640B2 JP 2006086850 A JP2006086850 A JP 2006086850A JP 2006086850 A JP2006086850 A JP 2006086850A JP 5130640 B2 JP5130640 B2 JP 5130640B2
- Authority
- JP
- Japan
- Prior art keywords
- phosphor
- light
- emitting device
- activated
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
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- Luminescent Compositions (AREA)
Priority Applications (20)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006086850A JP5130640B2 (ja) | 2005-04-01 | 2006-03-28 | 蛍光体の製造方法 |
| KR1020137008922A KR101422046B1 (ko) | 2005-04-01 | 2006-03-31 | 무기 기능재 원료용 합금 분말 및 형광체 |
| CN2013100376072A CN103131410A (zh) | 2005-04-01 | 2006-03-31 | 无机功能材料原料用合金粉末及荧光体 |
| EP14169080.0A EP2781575A3 (en) | 2005-04-01 | 2006-03-31 | Alloy powder for inorganic funtional material precursor and phosphor |
| CN201310125018XA CN103254894A (zh) | 2005-04-01 | 2006-03-31 | 无机功能材料原料用合金粉末及荧光体 |
| KR1020147011854A KR20140063899A (ko) | 2005-04-01 | 2006-03-31 | 무기 기능재 원료용 합금 분말 및 형광체 |
| US11/910,320 US7824573B2 (en) | 2005-04-01 | 2006-03-31 | Alloy powder for material of inorganic functional material precursor and phosphor |
| CN201510080165.9A CN104759615A (zh) | 2005-04-01 | 2006-03-31 | 无机功能材料原料用合金粉末及荧光体 |
| EP06730851A EP1867695A4 (en) | 2005-04-01 | 2006-03-31 | ALLOY POWDER AS A RAW MATERIAL FOR INORGANIC FUNCTIONAL MATERIAL AND FLUORESCENT |
| KR1020137000182A KR101346580B1 (ko) | 2005-04-01 | 2006-03-31 | 무기 기능재 원료용 합금 분말 및 형광체 |
| KR1020137033409A KR101471883B1 (ko) | 2005-04-01 | 2006-03-31 | 무기 기능재 원료용 합금 분말 및 형광체 |
| CN201310188892.8A CN103361046B (zh) | 2005-04-01 | 2006-03-31 | 无机功能材料原料用合金粉末及荧光体 |
| CN2006800158625A CN101171321B (zh) | 2005-04-01 | 2006-03-31 | 无机功能材料原料用合金粉末及荧光体 |
| PCT/JP2006/306903 WO2006106948A1 (ja) | 2005-04-01 | 2006-03-31 | 無機機能材原料用合金粉末及び蛍光体 |
| KR1020077025384A KR101241488B1 (ko) | 2005-04-01 | 2006-03-31 | 무기 기능재 원료용 합금 분말 및 형광체 |
| TW095111732A TWI433908B (zh) | 2005-04-01 | 2006-04-03 | 螢光體及其應用 |
| TW102125508A TWI597348B (zh) | 2005-04-01 | 2006-04-03 | 螢光體及其應用 |
| TW104109173A TWI522446B (zh) | 2005-04-01 | 2006-04-03 | 螢光體及其應用 |
| US12/615,002 US8460580B2 (en) | 2005-04-01 | 2009-11-09 | Alloy powder for raw material of inorganic functional material and phosphor |
| US13/834,110 US8801970B2 (en) | 2005-04-01 | 2013-03-15 | Europium- and strontium-based phosphor |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005106285 | 2005-04-01 | ||
| JP2005106285 | 2005-04-01 | ||
| JP2006086850A JP5130640B2 (ja) | 2005-04-01 | 2006-03-28 | 蛍光体の製造方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010097614A Division JP4548549B1 (ja) | 2005-04-01 | 2010-04-21 | 蛍光体の製造方法 |
| JP2011276918A Division JP2012057173A (ja) | 2005-04-01 | 2011-12-19 | 蛍光体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006307182A JP2006307182A (ja) | 2006-11-09 |
| JP2006307182A5 JP2006307182A5 (https=) | 2010-07-01 |
| JP5130640B2 true JP5130640B2 (ja) | 2013-01-30 |
Family
ID=37474417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006086850A Expired - Fee Related JP5130640B2 (ja) | 2005-04-01 | 2006-03-28 | 蛍光体の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5130640B2 (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101360805A (zh) * | 2006-02-28 | 2009-02-04 | 三菱化学株式会社 | 荧光体原料和荧光体原料用合金的制造方法 |
| JP4948015B2 (ja) * | 2006-03-30 | 2012-06-06 | スタンレー電気株式会社 | アルミン酸系青色蛍光体およびそれを用いた発光装置 |
| CN101448914B (zh) * | 2006-05-19 | 2012-10-03 | 三菱化学株式会社 | 含氮合金以及使用该含氮合金的荧光体制造方法 |
| JP5292724B2 (ja) * | 2006-05-19 | 2013-09-18 | 三菱化学株式会社 | 窒化物を母体とする蛍光体の製造方法 |
| JP5332136B2 (ja) * | 2006-09-29 | 2013-11-06 | 三菱化学株式会社 | 窒素含有合金、及びそれを使用した蛍光体の製造方法 |
| JP5378644B2 (ja) * | 2006-09-29 | 2013-12-25 | Dowaホールディングス株式会社 | 窒化物蛍光体または酸窒化物蛍光体の製造方法 |
| JP5594924B2 (ja) * | 2006-11-22 | 2014-09-24 | 三菱化学株式会社 | 蛍光体、蛍光体含有組成物、発光装置、画像表示装置、照明装置、及び蛍光体の製造方法 |
| JP2008208238A (ja) * | 2007-02-27 | 2008-09-11 | Showa Denko Kk | 蛍光体及びその製造方法、並びにそれを備えた照明器具と画像表示装置 |
| WO2009017206A1 (ja) * | 2007-08-01 | 2009-02-05 | Mitsubishi Chemical Corporation | 蛍光体及びその製造方法、結晶性窒化珪素及びその製造方法、蛍光体含有組成物、並びに、該蛍光体を用いた発光装置、画像表示装置及び照明装置 |
| WO2009093427A1 (ja) | 2008-01-21 | 2009-07-30 | Nichia Corporation | 発光装置 |
| JP5429731B2 (ja) * | 2008-03-14 | 2014-02-26 | 国立大学法人東京工業大学 | 蛍光体の製造方法、蛍光体含有組成物、発光装置、並びに画像表示装置及び照明装置 |
| JP5832713B2 (ja) * | 2008-04-14 | 2015-12-16 | 日亜化学工業株式会社 | 蛍光体及びこれを用いた発光装置並びに蛍光体の製造方法 |
| EP2412782B1 (en) * | 2009-03-26 | 2015-03-11 | National Institute for Materials Science | Phosphor, method for producing same, light-emitting device, and image display apparatus |
| CN102443391B (zh) * | 2010-09-30 | 2014-07-16 | 奇美实业股份有限公司 | 控制烧成的荧光体结构成分比例的方法、荧光体及发光装置 |
| US20140015400A1 (en) * | 2012-07-13 | 2014-01-16 | Rohm And Haas Electronic Materials Llc | Phosphor and light emitting devices comprising same |
| US20140062287A1 (en) * | 2012-08-29 | 2014-03-06 | Lightscape Materials, Inc. | Oxycarbidonitride phosphor and devices using same |
| JP6528418B2 (ja) | 2014-01-29 | 2019-06-12 | 日亜化学工業株式会社 | 蛍光体及びこれを用いた発光装置 |
| JP7036745B2 (ja) * | 2016-06-02 | 2022-03-15 | ゼネラル・エレクトリック・カンパニイ | 赤色発光蛍光体および関連装置 |
| JP6902368B2 (ja) * | 2017-03-15 | 2021-07-14 | デンカ株式会社 | 赤色蛍光体の製造方法 |
| JP7155507B2 (ja) * | 2017-10-25 | 2022-10-19 | 三菱ケミカル株式会社 | 蛍光体、発光装置、照明装置及び画像表示装置 |
| JP7310977B2 (ja) * | 2017-10-25 | 2023-07-19 | 三菱ケミカル株式会社 | 蛍光体、発光装置、照明装置及び画像表示装置 |
| CN113651531B (zh) * | 2021-09-22 | 2022-11-22 | 烟台希尔德材料科技有限公司 | 一种第二相玻璃增强的荧光体化合物及其制备方法和组合物 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10147040A1 (de) * | 2001-09-25 | 2003-04-24 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
| JP4979187B2 (ja) * | 2003-07-24 | 2012-07-18 | 東洋アルミニウム株式会社 | 窒化アルミニウム系蛍光体及びその製造方法 |
| JP3931239B2 (ja) * | 2004-02-18 | 2007-06-13 | 独立行政法人物質・材料研究機構 | 発光素子及び照明器具 |
| JP4362625B2 (ja) * | 2004-02-18 | 2009-11-11 | 独立行政法人物質・材料研究機構 | 蛍光体の製造方法 |
| JP4511849B2 (ja) * | 2004-02-27 | 2010-07-28 | Dowaエレクトロニクス株式会社 | 蛍光体およびその製造方法、光源、並びにled |
-
2006
- 2006-03-28 JP JP2006086850A patent/JP5130640B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006307182A (ja) | 2006-11-09 |
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