JP5130640B2 - 蛍光体の製造方法 - Google Patents

蛍光体の製造方法 Download PDF

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Publication number
JP5130640B2
JP5130640B2 JP2006086850A JP2006086850A JP5130640B2 JP 5130640 B2 JP5130640 B2 JP 5130640B2 JP 2006086850 A JP2006086850 A JP 2006086850A JP 2006086850 A JP2006086850 A JP 2006086850A JP 5130640 B2 JP5130640 B2 JP 5130640B2
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JP
Japan
Prior art keywords
phosphor
light
emitting device
activated
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006086850A
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English (en)
Japanese (ja)
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JP2006307182A5 (enExample
JP2006307182A (ja
Inventor
博 和田
直人 木島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2006086850A priority Critical patent/JP5130640B2/ja
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Priority to CN201310188892.8A priority patent/CN103361046B/zh
Priority to KR1020137033409A priority patent/KR101471883B1/ko
Priority to CN201510080165.9A priority patent/CN104759615A/zh
Priority to CN2013100376072A priority patent/CN103131410A/zh
Priority to US11/910,320 priority patent/US7824573B2/en
Priority to EP06730851A priority patent/EP1867695A4/en
Priority to CN201310125018XA priority patent/CN103254894A/zh
Priority to KR1020137008922A priority patent/KR101422046B1/ko
Priority to KR1020137000182A priority patent/KR101346580B1/ko
Priority to CN2006800158625A priority patent/CN101171321B/zh
Priority to KR1020147011854A priority patent/KR20140063899A/ko
Priority to EP14169080.0A priority patent/EP2781575A3/en
Priority to KR1020077025384A priority patent/KR101241488B1/ko
Priority to PCT/JP2006/306903 priority patent/WO2006106948A1/ja
Priority to TW104109173A priority patent/TWI522446B/zh
Priority to TW102125508A priority patent/TWI597348B/zh
Priority to TW095111732A priority patent/TWI433908B/zh
Publication of JP2006307182A publication Critical patent/JP2006307182A/ja
Priority to US12/615,002 priority patent/US8460580B2/en
Publication of JP2006307182A5 publication Critical patent/JP2006307182A5/ja
Application granted granted Critical
Publication of JP5130640B2 publication Critical patent/JP5130640B2/ja
Priority to US13/834,110 priority patent/US8801970B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Luminescent Compositions (AREA)
JP2006086850A 2005-04-01 2006-03-28 蛍光体の製造方法 Expired - Fee Related JP5130640B2 (ja)

Priority Applications (20)

Application Number Priority Date Filing Date Title
JP2006086850A JP5130640B2 (ja) 2005-04-01 2006-03-28 蛍光体の製造方法
KR1020077025384A KR101241488B1 (ko) 2005-04-01 2006-03-31 무기 기능재 원료용 합금 분말 및 형광체
CN201510080165.9A CN104759615A (zh) 2005-04-01 2006-03-31 无机功能材料原料用合金粉末及荧光体
CN2013100376072A CN103131410A (zh) 2005-04-01 2006-03-31 无机功能材料原料用合金粉末及荧光体
US11/910,320 US7824573B2 (en) 2005-04-01 2006-03-31 Alloy powder for material of inorganic functional material precursor and phosphor
EP06730851A EP1867695A4 (en) 2005-04-01 2006-03-31 ALLOY POWDER AS A RAW MATERIAL FOR INORGANIC FUNCTIONAL MATERIAL AND FLUORESCENT
CN201310125018XA CN103254894A (zh) 2005-04-01 2006-03-31 无机功能材料原料用合金粉末及荧光体
KR1020137008922A KR101422046B1 (ko) 2005-04-01 2006-03-31 무기 기능재 원료용 합금 분말 및 형광체
KR1020137000182A KR101346580B1 (ko) 2005-04-01 2006-03-31 무기 기능재 원료용 합금 분말 및 형광체
KR1020137033409A KR101471883B1 (ko) 2005-04-01 2006-03-31 무기 기능재 원료용 합금 분말 및 형광체
CN201310188892.8A CN103361046B (zh) 2005-04-01 2006-03-31 无机功能材料原料用合金粉末及荧光体
EP14169080.0A EP2781575A3 (en) 2005-04-01 2006-03-31 Alloy powder for inorganic funtional material precursor and phosphor
CN2006800158625A CN101171321B (zh) 2005-04-01 2006-03-31 无机功能材料原料用合金粉末及荧光体
KR1020147011854A KR20140063899A (ko) 2005-04-01 2006-03-31 무기 기능재 원료용 합금 분말 및 형광체
PCT/JP2006/306903 WO2006106948A1 (ja) 2005-04-01 2006-03-31 無機機能材原料用合金粉末及び蛍光体
TW104109173A TWI522446B (zh) 2005-04-01 2006-04-03 螢光體及其應用
TW102125508A TWI597348B (zh) 2005-04-01 2006-04-03 螢光體及其應用
TW095111732A TWI433908B (zh) 2005-04-01 2006-04-03 螢光體及其應用
US12/615,002 US8460580B2 (en) 2005-04-01 2009-11-09 Alloy powder for raw material of inorganic functional material and phosphor
US13/834,110 US8801970B2 (en) 2005-04-01 2013-03-15 Europium- and strontium-based phosphor

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005106285 2005-04-01
JP2005106285 2005-04-01
JP2006086850A JP5130640B2 (ja) 2005-04-01 2006-03-28 蛍光体の製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2010097614A Division JP4548549B1 (ja) 2005-04-01 2010-04-21 蛍光体の製造方法
JP2011276918A Division JP2012057173A (ja) 2005-04-01 2011-12-19 蛍光体の製造方法

Publications (3)

Publication Number Publication Date
JP2006307182A JP2006307182A (ja) 2006-11-09
JP2006307182A5 JP2006307182A5 (enExample) 2010-07-01
JP5130640B2 true JP5130640B2 (ja) 2013-01-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006086850A Expired - Fee Related JP5130640B2 (ja) 2005-04-01 2006-03-28 蛍光体の製造方法

Country Status (1)

Country Link
JP (1) JP5130640B2 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090134359A1 (en) * 2006-02-28 2009-05-28 Mitsubishi Chemical Corporation Phosphor raw material and method for producing alloy for phosphor raw material
JP4948015B2 (ja) * 2006-03-30 2012-06-06 スタンレー電気株式会社 アルミン酸系青色蛍光体およびそれを用いた発光装置
JP5292724B2 (ja) * 2006-05-19 2013-09-18 三菱化学株式会社 窒化物を母体とする蛍光体の製造方法
TWI422667B (zh) 2006-05-19 2014-01-11 Mitsubishi Chem Corp 含有氮之合金及使用其之螢光體之製造方法
JP5332136B2 (ja) * 2006-09-29 2013-11-06 三菱化学株式会社 窒素含有合金、及びそれを使用した蛍光体の製造方法
JP5378644B2 (ja) * 2006-09-29 2013-12-25 Ｄｏｗａホールディングス株式会社 窒化物蛍光体または酸窒化物蛍光体の製造方法
JP5594924B2 (ja) * 2006-11-22 2014-09-24 三菱化学株式会社 蛍光体、蛍光体含有組成物、発光装置、画像表示装置、照明装置、及び蛍光体の製造方法
JP2008208238A (ja) * 2007-02-27 2008-09-11 Showa Denko Kk 蛍光体及びその製造方法、並びにそれを備えた照明器具と画像表示装置
US20100213822A1 (en) * 2007-08-01 2010-08-26 Satoshi Shimooka Phosphor and production method thereof, crystalline silicon nitride and production method thereof, phosphor-containing composition, and light emitting device, display and illuminating device using the phosphor
JP5644112B2 (ja) 2008-01-21 2014-12-24 日亜化学工業株式会社 発光装置
JP5429731B2 (ja) * 2008-03-14 2014-02-26 国立大学法人東京工業大学 蛍光体の製造方法、蛍光体含有組成物、発光装置、並びに画像表示装置及び照明装置
JP5832713B2 (ja) * 2008-04-14 2015-12-16 日亜化学工業株式会社 蛍光体及びこれを用いた発光装置並びに蛍光体の製造方法
US20120019127A1 (en) * 2009-03-26 2012-01-26 Naoto Hirosaki Phosphor, method for producing same, light-emitting device, and image display apparatus
CN102443391B (zh) * 2010-09-30 2014-07-16 奇美实业股份有限公司 控制烧成的荧光体结构成分比例的方法、荧光体及发光装置
US20140015400A1 (en) * 2012-07-13 2014-01-16 Rohm And Haas Electronic Materials Llc Phosphor and light emitting devices comprising same
US20140062287A1 (en) * 2012-08-29 2014-03-06 Lightscape Materials, Inc. Oxycarbidonitride phosphor and devices using same
JP6528418B2 (ja) 2014-01-29 2019-06-12 日亜化学工業株式会社 蛍光体及びこれを用いた発光装置
CN109219646B (zh) * 2016-06-02 2023-03-07 通用电气公司 发射红光的磷光体及相关装置
JP6902368B2 (ja) * 2017-03-15 2021-07-14 デンカ株式会社 赤色蛍光体の製造方法
JP7155507B2 (ja) * 2017-10-25 2022-10-19 三菱ケミカル株式会社 蛍光体、発光装置、照明装置及び画像表示装置
JP7310977B2 (ja) * 2017-10-25 2023-07-19 三菱ケミカル株式会社 蛍光体、発光装置、照明装置及び画像表示装置
CN113651531B (zh) * 2021-09-22 2022-11-22 烟台希尔德材料科技有限公司 一种第二相玻璃增强的荧光体化合物及其制备方法和组合物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10147040A1 (de) * 2001-09-25 2003-04-24 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
JP4979187B2 (ja) * 2003-07-24 2012-07-18 東洋アルミニウム株式会社 窒化アルミニウム系蛍光体及びその製造方法
JP4362625B2 (ja) * 2004-02-18 2009-11-11 独立行政法人物質・材料研究機構 蛍光体の製造方法
JP3931239B2 (ja) * 2004-02-18 2007-06-13 独立行政法人物質・材料研究機構 発光素子及び照明器具
JP4511849B2 (ja) * 2004-02-27 2010-07-28 Ｄｏｗａエレクトロニクス株式会社 蛍光体およびその製造方法、光源、並びにｌｅｄ

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