JP5128275B2 - 導電性ペースト及び回路基板並びに回路物品及びその製造方法 - Google Patents

導電性ペースト及び回路基板並びに回路物品及びその製造方法 Download PDF

Info

Publication number
JP5128275B2
JP5128275B2 JP2007512921A JP2007512921A JP5128275B2 JP 5128275 B2 JP5128275 B2 JP 5128275B2 JP 2007512921 A JP2007512921 A JP 2007512921A JP 2007512921 A JP2007512921 A JP 2007512921A JP 5128275 B2 JP5128275 B2 JP 5128275B2
Authority
JP
Japan
Prior art keywords
circuit board
circuit
electrode
resin
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007512921A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2006109627A1 (ja
Inventor
誠 今堀
隆 中谷
雅典 秋田
高正 野上
照郎 多賀井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toagosei Co Ltd
Toray Engineering Co Ltd
Kyoritsu Chemical and Co Ltd
Original Assignee
Toagosei Co Ltd
Toray Engineering Co Ltd
Kyoritsu Chemical and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co Ltd, Toray Engineering Co Ltd, Kyoritsu Chemical and Co Ltd filed Critical Toagosei Co Ltd
Priority to JP2007512921A priority Critical patent/JP5128275B2/ja
Publication of JPWO2006109627A1 publication Critical patent/JPWO2006109627A1/ja
Application granted granted Critical
Publication of JP5128275B2 publication Critical patent/JP5128275B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29075—Plural core members
    • H01L2224/29076—Plural core members being mutually engaged together, e.g. through inserts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29075—Plural core members
    • H01L2224/2908—Plural core members being stacked
    • H01L2224/29082—Two-layer arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP2007512921A 2005-04-06 2006-04-04 導電性ペースト及び回路基板並びに回路物品及びその製造方法 Expired - Fee Related JP5128275B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007512921A JP5128275B2 (ja) 2005-04-06 2006-04-04 導電性ペースト及び回路基板並びに回路物品及びその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005110369 2005-04-06
JP2005110369 2005-04-06
JP2007512921A JP5128275B2 (ja) 2005-04-06 2006-04-04 導電性ペースト及び回路基板並びに回路物品及びその製造方法
PCT/JP2006/307133 WO2006109627A1 (ja) 2005-04-06 2006-04-04 導電性ペースト及び回路基板並びに回路物品及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2006109627A1 JPWO2006109627A1 (ja) 2008-11-06
JP5128275B2 true JP5128275B2 (ja) 2013-01-23

Family

ID=37086906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007512921A Expired - Fee Related JP5128275B2 (ja) 2005-04-06 2006-04-04 導電性ペースト及び回路基板並びに回路物品及びその製造方法

Country Status (5)

Country Link
US (1) US20090071703A1 (enExample)
JP (1) JP5128275B2 (enExample)
CN (1) CN101133462A (enExample)
TW (1) TW200707468A (enExample)
WO (1) WO2006109627A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101551758B1 (ko) 2012-12-11 2015-09-09 제일모직주식회사 이방 도전성 필름용 조성물 및 이방 도전성 필름

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5114846B2 (ja) * 2006-02-02 2013-01-09 東レ・ファインケミカル株式会社 酸化亜鉛分散ペーストの製造方法
WO2009054236A1 (ja) * 2007-10-26 2009-04-30 Toray Industries, Inc. 平面アンテナおよびその製造方法
WO2010113581A1 (ja) * 2009-03-31 2010-10-07 東レ株式会社 感光性導電ペーストおよびそれを用いたディスプレイの製造方法、ならびにディスプレイ
JP2011014656A (ja) * 2009-06-30 2011-01-20 Toshiba Corp 電子機器およびフレキシブルプリント配線板
JP5410176B2 (ja) * 2009-07-02 2014-02-05 株式会社フジクラ メンブレン配線板の製造方法
JP5580701B2 (ja) * 2010-09-13 2014-08-27 日東電工株式会社 ダイシング・ダイボンドフィルム
KR102713298B1 (ko) * 2010-11-03 2024-10-04 알파 어셈블리 솔루션스 인크. 소결 재료 및 이를 이용한 부착 방법
JP5780147B2 (ja) * 2011-01-06 2015-09-16 スリーボンドファインケミカル株式会社 導電性塗料
KR102011477B1 (ko) * 2011-03-29 2019-08-16 썬 케미칼 코포레이션 왁스 요변체를 함유하는 고-종횡비 스크린 인쇄성 후막 페이스트 조성물
EP2571341A4 (en) * 2011-04-27 2013-12-11 Panasonic Corp REUSE PULP, AND METHOD FOR MANUFACTURING THE SAME
US8502391B2 (en) * 2011-12-08 2013-08-06 Stats Chippac, Ltd. Semiconductor device and method of making single layer substrate with asymmetrical fibers and reduced warpage
CN104412724A (zh) * 2012-07-04 2015-03-11 松下知识产权经营株式会社 电子部件安装构造体、ic卡、cof封装
US11695195B2 (en) * 2016-06-21 2023-07-04 3M Innovative Properties Company Self-supporting antenna
US20190355277A1 (en) 2018-05-18 2019-11-21 Aidmics Biotechnology (Hk) Co., Limited Hand-made circuit board
EP4427948A4 (en) * 2021-11-02 2025-02-19 Bridgestone Corporation RFID TAG COATING RUBBER COMPOSITION AND TIRES

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10188670A (ja) * 1996-12-27 1998-07-21 Hitachi Chem Co Ltd 扁平状導電性金属粉及びその製造法並びに扁平状導電性金属粉を用いた導電性ペースト
WO2001086716A1 (en) * 2000-05-12 2001-11-15 Matsushita Electric Industrial Co., Ltd. Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same
JP2002072468A (ja) * 2000-09-04 2002-03-12 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP2002094211A (ja) * 2000-07-13 2002-03-29 Ngk Spark Plug Co Ltd 埋め込み樹脂及びそれを用いた配線基板並びにその埋め込み樹脂を用いた配線基板の製造方法
JP2002203427A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路板の製造方法、回路板
JP2002204052A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路端子の接続方法、接続構造
JP2002226807A (ja) * 2001-01-31 2002-08-14 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続方法、接続構造体
WO2004038793A1 (ja) * 2002-10-24 2004-05-06 Toray Engineering Company,Limited 非接触ｉｄカード類及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101753A (ja) * 1988-10-11 1990-04-13 Hitachi Chem Co Ltd 半導体チップの取付構造
JP2001115127A (ja) * 1999-10-19 2001-04-24 Hitachi Chem Co Ltd 導電性接着剤とそれを用いた配線板
JP2001176326A (ja) * 1999-12-21 2001-06-29 Shin Etsu Polymer Co Ltd 異方導電性接着剤、ヒートシールコネクタ及びヒートシールコネクタの製造方法
JP3823828B2 (ja) * 2000-01-28 2006-09-20 株式会社日立製作所 無溶剤型熱硬化性樹脂組成物とその製造方法及び製品
JP2004520465A (ja) * 2001-01-18 2004-07-08 クレイトン・ポリマーズ・リサーチ・ベー・ベー 接着剤組成物
US7160946B2 (en) * 2004-04-01 2007-01-09 National Starch And Chemical Investment Holding Corporation Method to improve high temperature cohesive strength with adhesive having multi-phase system
US7312261B2 (en) * 2004-05-11 2007-12-25 International Business Machines Corporation Thermal interface adhesive and rework
JP4595471B2 (ja) * 2004-09-30 2010-12-08 住友電気工業株式会社 導電性ペースト、及びそれを用いた多層プリント配線板の製造方法
JPWO2006070652A1 (ja) * 2004-12-27 2008-06-12 日本電気株式会社 半導体装置およびその製造方法と、配線基板およびその製造方法と、半導体パッケージ並びに電子機器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10188670A (ja) * 1996-12-27 1998-07-21 Hitachi Chem Co Ltd 扁平状導電性金属粉及びその製造法並びに扁平状導電性金属粉を用いた導電性ペースト
WO2001086716A1 (en) * 2000-05-12 2001-11-15 Matsushita Electric Industrial Co., Ltd. Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same
JP2002094211A (ja) * 2000-07-13 2002-03-29 Ngk Spark Plug Co Ltd 埋め込み樹脂及びそれを用いた配線基板並びにその埋め込み樹脂を用いた配線基板の製造方法
JP2002072468A (ja) * 2000-09-04 2002-03-12 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP2002203427A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路板の製造方法、回路板
JP2002204052A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路端子の接続方法、接続構造
JP2002226807A (ja) * 2001-01-31 2002-08-14 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続方法、接続構造体
WO2004038793A1 (ja) * 2002-10-24 2004-05-06 Toray Engineering Company,Limited 非接触ｉｄカード類及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101551758B1 (ko) 2012-12-11 2015-09-09 제일모직주식회사 이방 도전성 필름용 조성물 및 이방 도전성 필름

Also Published As

Publication number Publication date
TWI319579B (enExample) 2010-01-11
WO2006109627A1 (ja) 2006-10-19
CN101133462A (zh) 2008-02-27
US20090071703A1 (en) 2009-03-19
TW200707468A (en) 2007-02-16
JPWO2006109627A1 (ja) 2008-11-06

Similar Documents

Publication Publication Date Title
JP5128275B2 (ja) 導電性ペースト及び回路基板並びに回路物品及びその製造方法
KR102048696B1 (ko) 점착성 시트
KR101380454B1 (ko) 도전 재료 및 접속 구조체
KR101344965B1 (ko) 이방성 도전 필름, 접합체, 및 접합체의 제조 방법
KR101464353B1 (ko) 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 이를 이용한 반도체 장치
JP6516473B2 (ja) 導電性粘着テープ、および導電性粘着テープ付表示装置
KR20160113168A (ko) 전기 전도성 접착 테이프 및 그로부터의 물품
CN102295897A (zh) 导电性粘合带
KR20150102694A (ko) 도전성 점착 테이프 및 도전성 점착 테이프가 부착된 표시 장치
WO2019131904A1 (ja) 接続構造体及びその製造方法
KR20050024404A (ko) 이방성 도전 필름
JP3741841B2 (ja) 異方導電性接着剤
JPH05279644A (ja) 異方導電性接着シート
JPH11209714A (ja) 異方導電接着剤
JP4635287B2 (ja) 異方性導電フィルム
JP2019218417A (ja) 粘着剤層及び積層体
JP7225505B2 (ja) 導電性接着剤組成物
JP2001035248A (ja) 導電性付与粒子及びこれを用いた異方導電性接着剤
KR102395930B1 (ko) 이방성 도전 필름, 접속 방법 및 접합체
JP7771733B2 (ja) 配線シート
CN112105699B (zh) 导电性粘合片
JP2012079927A (ja) 半田付け可能な導電性構造物
CN113330082B (zh) 导电性胶粘剂组合物
JP2022098708A (ja) 導電性粘着シート
JP4834928B2 (ja) 異方性導電フィルム

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110607

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110728

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120424

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120611

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121009

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121031

R150 Certificate of patent or registration of utility model

Ref document number: 5128275

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151109

Year of fee payment: 3

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313117

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees