CN104412724A - 电子部件安装构造体、ic卡、cof封装 - Google Patents

电子部件安装构造体、ic卡、cof封装 Download PDF

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Publication number
CN104412724A
CN104412724A CN201380033809.8A CN201380033809A CN104412724A CN 104412724 A CN104412724 A CN 104412724A CN 201380033809 A CN201380033809 A CN 201380033809A CN 104412724 A CN104412724 A CN 104412724A
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China
Prior art keywords
substrate
photo
wiring pattern
conductive wires
outside terminal
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Pending
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CN201380033809.8A
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English (en)
Inventor
和田义之
境忠彦
本村耕治
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of CN104412724A publication Critical patent/CN104412724A/zh
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    • H—ELECTRICITY
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    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
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Abstract

电子部件安装构造体包含基板；形成于基板表面上的、以Cu等高熔点金属为主体的导电性配线图案；将导电性配线图案的端子接合位置内包、搭载于所述基板表面的搭载位置上、具有外部端子的电子部件。外部端子在端子接合位置处以埋入到导电性配线图案的内部的状态与导电性配线图案相连接。因此，与仅在导电性配线图案的表面上将电子部件的外部端子与导电性配线图案连接的接合部相比，可以在强度更高的接合部处将外部端子与导电性配线图案连接。

Description

电子部件安装构造体、IC卡、COF封装
技术领域
本发明涉及利用了光固化性配线形成材料的电子部件安装构造体、IC卡、COF封装。
背景技术
手机、平板显示器、数字静态照相机(digital still camera)、DVD录音机等数码家电制品正在急速地普及，期待这些机器的小型化及薄型化。为了这些机器的小型化及薄型化，有效的是机器所含基板的柔性化，柔性印刷线路板(FPC：Flexible Printed Circuit)的使用急速地扩大。进而，FPC不仅作为单纯的线路板进行使用，作为安装有半导体设备、微小芯片部件、连接器等功能模块的用途也有所增加。
作为用于在含有FPC和刚性印刷线路板(RPC：Rigid Printed Circuit)的印刷线路板中安装IC芯片(裸芯片)、电子部件模块及无源元件(芯片部件)等各种电子部件的技术，多使用表面安装技术(SMT：Surface Mount Technology)。SMT中，一般来说将焊料糊印刷在印刷线路板上之后，将电子部件搭载在印刷线路板上。进而，最终通过回流工序使焊料熔融、将其固化，从而将电子部件的电极端子与基板的配线电连接(例如参照专利文献1)。
现有技术文献
专利文献
专利文献1:日本特开2010-245309号公报
发明内容
发明要解决的技术问题
但是，在上述现有技术中，为了提高电子部件与基板的连接可靠性，有时有必要使用底部填充材料、各向异性导电膏(ACP：Anisotropic Conductive Paste)及各向异性导电薄膜(ACF：Anisotropic Conductive Film)等强化材料。进而，此时在工时增大的同时，由于使用这些材料成本也增大。
鉴于上述情况，本发明的目的在于提供一种在能够减少制造成本及工时的同时能够提高电子部件的连接可靠性的电子部件安装构造体、IC卡及COF封装。
用于解决技术问题的方法
本发明的一方面涉及一种电子部件安装构造体，包括：基板；形成于所述基板表面上的导电性配线图案；将所述导电性配线图案的端子接合位置内包、搭载于所述基板表面的搭载位置上、具有外部端子的电子部件，所述外部端子在所述端子接合位置处以埋入到所述导电性配线图案内部的状态与所述导电性配线图案接合。
本发明的另一方面涉及一种IC卡，包括：基板；形成于所述基板表面上的天线电路；将所述天线电路的端子接合位置内包、搭载于所述基板表面的搭载位置上、具有外部端子的裸芯片部件，所述外部端子在所述端子接合位置处以埋入到所述天线电路内部的状态与所述天线电路相接合。
本发明的另一方面涉及一种COF封装，包括：薄膜状的基板；形成于所述基板表面上的导电性配线图案；将所述导电性配线图案的端子接合位置内包、搭载于所述基板表面的搭载位置上、具有外部端子的第1电子部件，通过所述导电性配线图案而与所述第1电子部件连接的第2电子部件，所述第1电子部件的所述外部端子在所述端子接合位置处以埋入到所述导电性配线图案内部的状态与所述导电性配线图案接合。
导电性配线图案优选的是，含有75质量％以上的Cu、Ag、Ni、Au、Pd、Pt、Al等的高熔点且导电性高的金属。
发明效果
本发明中，电子部件的外部端子以埋入到基板上的导电性配线图案中的状态与导电性配线图案相接合。因此，与仅在导电性配线图案的表面上将电子部件的外部端子与导电性配线图案接合的接合部相比时，能够在强度更高的接合部处将外部端子与导电性配线图案接合。结果，不使用底部填充剂等强化材料来对接合部进行加强，而可以以高的连接可靠性将电子部件与基板连接。
虽然将本发明的新特征记载于权利要求范围内，但本发明涉及构成及内容的双方，与本发明的其他目的及特征一起，通过参照了附图的以下的详细说明，能够得到更好的理解。
附图说明
图1是表示用于制造本发明一实施方式所涉及的电子部件安装构造体的制造系统即表面安装线路的整体图像的方块图。
图2A是表示在搬送器(carrier)搬送方式的表面安装线路中，利用作为移动机构的输送机而搬送基板的情况的主视图。
图2B是表示在搬送器搬送方式的表面安装线路中，利用作为移动机构的输送机而搬送基板的情况的俯视图。
图3是表示在天线电路基板上形成导电性配线图案之一例即与IC卡用天线电路相对应的光固化性配线图案的情况的俯视图。
图4是表示将电子部件一例即IC卡用的IC芯片(裸芯片部件)搭载于基板的搭载位置上的情况的侧面图。
图5是模式地表示使增大了前端直径的电子部件的外部端子贴触于形成有光固化性配线图案的基板的端子接合位置的状态的截面图。
图6是表示裸芯片部件搭载于天线电路基板的搭载位置的状态之一例的俯视图。
图7是示意地表示利用光照射单元来使光固化性配线图案固化的工序的图。
图8是表示通过使光固化性配线图案固化所形成的导电性配线图案与外部端子的接合部的详细情况的截面图。
图9是示意地表示配线形成材料之一例即导电性油墨的固化的过程的一部分截面图，(a)表示固化前的状态、(b)表示固化开始时的状态、(c)表示固化结束时的状态。
图10是表示使用电子部件安装构造体的最终制品之一例即非接触式IC卡的构造的截面图。
图11是表示用于制造本发明其他实施方式所涉及的电子部件安装构造体的制造系统即表面安装线路的整体图像的主视图。
图12A是含有COF封装用的多个基板的基板坯材之一例的俯视图。
图12B是含有IC卡用的多个基板的基板坯材的其他例子的俯视图。
图13A是表示在COF封装用的多个基板上分别形成与连接电路相对应的光固化性配线图案的情况的俯视图。
图13B是表示在IC卡用的多个基板上分别形成与天线电路相对应的光固化性配线图案的情况的俯视图。
图14A是表示在COF封装用的多个基板上分别搭载作为液晶驱动器的电子部件的情况的俯视图。
图14B是表示在IC卡用的多个基板上分别搭载作为IC卡用IC芯片的电子部件的情况的俯视图。
图15是表示电子部件的外部端子埋入到光固化性配线图案中的状态的截面图。
图16A是作为通过图11的表面安装线路而制造的电子部件安装构造体之一例的、包含液晶驱动器及液晶面板的COF封装(液晶显示模块)的一部分的俯视图。
图16B是包含液晶驱动器及液晶面板的COF封装的俯视图。
图17是表示用于制造本发明其他实施方式所涉及的电子部件安装构造体的制造系统即表面安装线路的整体图像的主视图。
图18是表示在图17的表面安装线路中使用的遮光板的变形例的主视图。
图19是表示图18的遮光板的工作原理的遮光板及基板坯材的主视图。
图20是表示将含有多层基板及玻璃插入器的电子部件安装构造体安装在其他基板上的情况的电子部件安装构造体及其他基板的主视图。
图21是概略地表示利用搬送器搬送方式的表面安装线路来制造图20的电子部件安装构造体时的制造顺序的输送机的俯视图。
具体实施方式
本发明的电子部件安装构造体包括：基板；形成于基板表面上的导电性配线图案；将导电性配线图案的端子接合位置内包、搭载于基板的表面的搭载位置上、具有外部端子的电子部件。而且，外部端子在端子接合位置处以埋入到导电性配线图案内部的状态与导电性配线图案接合。这里“导电性配线图案”是指配线其本身，不包括形成于配线上的端子接合用的电极(接地电极)或赋予到配线或电极上的焊料(例如预涂焊料)。即，本发明的电子部件安装构造体中，基板配线与电子部件的外部端子不介由其他物质直接地接合。
如上所述，本发明的电子部件安装构造体中，电子部件的外部端子以埋入到导电性配线图案内部的状态与导电性配线图案相接合。由此，与电子部件的外部端子与导电性配线图案仅在其表面进行接合的情况相比时，能够以更大的接触面积将外部端子与导电性配线图案接合。结果，可以增大电子部件的外部端子与导电性配线图案的接合强度、电子部件与基板的连接可靠性得到提高。
进而，由于电子部件的外部端子与导电性配线图案的接合强度很大，因此在外部端子的数目足够多的情况等，还能够以充分的强度将电子部件与基板接合。进而，此时不需要使用底部填充材料等强化材料，还可以减少制造成本。另外，这种情况下还可以省略强化材料的供给等强化工序，因此可以削减工时，可以提高电子部件安装构造体的生产性。进而，还可期待因工时削减所带来制造成本的减少。
本发明的一方式中，导电性配线图案由具有流动性的光固化性的配线形成材料形成。配线形成材料中可以含有平均粒径为1～10nm的Cu粒子等的导电体的微粒子。例如，使用这种导电体的微粒子被分散在液状介质中、通过照射光而进行固化的导电性油墨，在基板的表面上形成与导电性配线图案对应的光固化性配线图案。然后，按照电子部件的外部端子在导电性配线图案的端子接合位置处贴触于光固化性配线图案的方式，将电子部件搭载于基板表面的搭载位置。
此时，在光固化性配线图案中，使配线形成材料处于具有流动性或变形性的状态，由此可以使外部端子在端子接合位置处埋入到光固化性配线图案中。进而，在此状态下通过对光固化性配线图案照射光，配线形成材料发生固化，形成导电性配线图案。由此，在导电性配线图案形成的同时，可以使电子部件的外部端子以在端子接合位置处埋入到导电性配线图案的内部的状态与导电性配线图案接合。如此，通过使用上述配线形成材料，可以利用简单的方法来制造电子部件与基板的连接可靠性高的电子部件安装构造体。
进而，通过由上述配线形成材料形成导电性配线图案，在电子部件安装构造体的制造时，在不进行回流工序及热压接工序等加热工序的情况下，即可将电子部件的外部端子与导电性配线图案相接合。因此，没有必要对基板使用耐热性高的材料(例如聚酰亚胺树脂)，使用较为廉价、耐热性没那么高的材料，例如具有300℃以下熔点或热分解温度的热塑性树脂、更具体地例如PET(聚对苯二甲酸乙二醇酯)、PEN(聚萘二甲酸乙二醇酯)也可形成基板。因此，可以进一步减少电子部件安装构造体的制造成本。
另外，可以防止因加热导致的电子部件及基板的劣化。进而，当作为基板的材料而使用聚酰亚胺树脂时，由于聚酰亚胺树脂的颜色与铜箔的颜色类似，因此在由铜箔构成的配线图案中，难以识别其形状，发生安装故障的概率增加。本方式中由于使用聚酰亚胺树脂的必要性变小，因此易于提高成品率，进而可减少电子部件安装构造体的制造成本。
这里，一般来说，外部端子在可防止氧化覆膜的形成这一点上，优选至少最表面含有金。此点是由于在本方式的电子部件安装构造体中在制造时可以省略加热工序，因此可防止因加热导致的外部端子的氧化。因而，外部端子也可由铜、铜合金、锡及锡合金等形成。由此，可以进一步抑制制造成本。另外，当采取其他对氧化覆膜的对策时，在与基板对置面上具备焊料凸块(电极)的BGA(Ball grid Array)型电子部件中也可适用本发明。
另外，电子部件安装构造体中含有的电子部件的种类并无特别限定，例如在电子部件安装构造体中也可含有IC芯片等的裸芯片部件或具备插入器的封装部件、电子部件模块、无源元件等的芯片部件以及具有贯通电极的层叠半导体。本发明特别适于倒装芯片安装技术等的SMT。因此，电子部件可优选地使用在与基板的对置面上具有外部端子的电子部件。
电子部件的外部端子通常只要是裸芯片部件或封装部件，则为了确保与预先形成于基板的电极的接触，优选从电子部件的与基板的对置面突出。另一方面，在本方式中，配线形成材料在具有流动性且能够变形的状态下，通过将电子部件搭载于基板上，即便外部端子未从与基板的对置面突出，也由于配线形成材料的流动或变形，达成外部端子与光固化性配线图案的接触。因此，没有必要使外部端子突出、还可减少电子部件的制造成本。
本发明可优选地适用于在具有柔性的薄膜状基板上安装有电子部件的电子部件安装构造体。
进而，本发明中，当导电性配线图案由具有流动性的光固化性的配线形成材料形成时，特别是为了对配线形成材料进行光照射，优选基板具有透光性。由此，能够使光从部件安装面的相反侧的一面透过基板、照射于部件安装面的配线形成材料上。因此，可以使光也可靠地照射到大多利用电子部件或其外部端子等进行覆盖的端子接合位置。结果，在端子接合位置处，可使电子部件的外部端子可靠地接合于导电性配线图案，可以提高连接可靠性。
本发明涉及一种IC卡，其包含：基板；形成于基板表面上的天线电路；将天线电路的端子接合位置内包、搭载于所述基板表面的搭载位置上、具有外部端子的裸芯片部件，外部端子在端子接合位置处以埋入到天线电路的内部的状态与天线电路相接合。
如上所述，本发明的IC卡中，裸芯片部件的外部端子以埋入到天线电路的内部的状态与天线电路相接合。由此，与裸芯片部件的外部端子与天线电路仅在其表面处相接合的情况相比时，能够以更大的接触面积将外部端子与天线电路接合。结果，可以增大裸芯片部件的外部端子与天线电路的接合强度，IC卡中的裸芯片部件与基板的连接可靠性得以提高。
进而，由于裸芯片部件的外部端子与天线电路的接合强度很大，因此在外部端子的数量足够多的情况等，还能够以充分的强度将裸芯片部件与基板接合。进而，此时也不必使用底部填充材料等强化材料，还可减少制造成本。另外，此时由于可省略强化材料的供给等强化工序，因此可削减工时，提高IC卡的生产性。进而，还可期待工时削减所带来的制造成本降低。
本发明的IC卡的一方式中，天线电路由具有流动性的光固化性配线形成材料形成。配线形成材料中可以含有平均粒径为1～10nm的Cu粒子等导电体的微粒子。例如，使用这种导电体的微粒子被分散于液状介质中、通过照射光而发生固化的导电性油墨，在基板的表面上形成与天线电路相对应的光固化性配线图案。进而，按照裸芯片部件的外部端子在天线电路的端子接合位置处贴触于光固化性配线图案的方式，将裸芯片部件搭载于基板表面的搭载位置。
此时，在光固化性配线图案中，预先使配线形成材料处于具有流动性或变形性的状态。由此，可以使外部端子在端子接合位置处埋入到光固化性配线图案中。进而，通过在此状态下对光固化性配线图案照射光，配线形成材料发生固化、形成天线电路。由此，在形成天线电路的同时，能够使裸芯片部件的外部端子以在端子接合位置处埋入到天线电路中的状态与天线电路相接合。如此，通过使用上述这种配线形成材料，能够通过简单的方法来制造裸芯片部件与基板的连接可靠性高的IC卡。
进而，通过由上述配线形成材料形成天线电路，在IC卡的制造时不进行加热工序也可将裸芯片部件的外部端子与天线电路接合。因此，基板没有必要使用耐热性高的材料(例如聚酰亚胺树脂)，能够使用较为廉价、耐热性不那么高的材料等形成基板。因此，可以减少IC卡的制造成本。另外，可以防止因加热导致的电子部件及基板的劣化。进而，在作为基板的材料而使用例如聚酰亚胺树脂时，由于聚酰亚胺树脂的颜色与铜箔的颜色近似，因此在由铜箔构成的配线图案中，难以识别其形状，发生安装故障的概率提高。本方式中，由于使用聚酰亚胺树脂的必要性减小，因此易于提高成品率、进而可减少IC卡的制造成本。
从以上的观点出发，形成有天线电路的基板(以下也称作天线电路基板)的材料可以使用聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚乙烯、聚丙烯、聚对苯二甲酸丁二醇酯、聚苯硫醚、聚醚醚酮、聚碳酸酯、液晶聚合物、聚苯乙烯、丙烯酸树脂、聚乙缩醛、聚苯基醚、丙烯腈-苯乙烯共聚物及丙烯腈-丁二烯-苯乙烯共聚树脂等。天线电路基板可使用薄膜状的基板以及优选天线电路基板具有透光性的原因与上述相同。
本发明还涉及一种COF封装，其包含：薄膜状的基板；形成于基板表面上的导电性配线图案；将导电性配线图案的端子接合位置内包、搭载于基板的表面的搭载位置上、具有外部端子的第1电子部件；通过导电性配线图案而与第1电子部件连接的第2电子部件，第1电子部件的外部端子在端子接合位置处以埋入到导电性配线图案内部的状态与导电性配线图案接合。
如上所述，本发明的COF封装中，第1电子部件的外部端子以埋入到导电性配线图案内部的状态与导电性配线图案接合。由此，和第1电子部件的外部端子与导电性配线图案仅在其表面处接合的情况相比时，能够以更大的接触面积将外部端子与导电性配线图案接合。结果，可以增大第1电子部件的外部端子与导电性配线图案的接合强度、COF封装的第1电子部件与基板的连接可靠性得以提高。
进而，由于第1电子部件的外部端子与导电性配线图案的接合强度很大，因此在外部端子的数目足够多的情况等，能够以充分的强度将第1电子部件与基板接合。进而，此时也不必使用底部填充材料等强化材料，也可减少制造成本。另外，此时由于可省略强化材料的供给等强化工序，因此可削减工时，提高COF封装的生产性。进而，还可期待由工时削减带来的制造成本降低。作为第1电子部件的具体例子，可举出液晶驱动器。此时，作为第2电子部件的具体例子，可举出液晶面板。
本发明的COF封装的一方式中，导电性配线图案由具有流动性的光固化性配线形成材料形成。配线形成材料中可以含有平均粒径为1～10nm的Cu粒子等的导电体的微粒子。例如，使用这种导电体的微粒子被分散于液状介质中、通过照射光而发生固化的导电性油墨，在基板的表面上形成与导电性配线图案相对应的光固化性配线图案。进而，按照第1电子部件的外部端子在导电性配线图案的端子接合位置处贴触于光固化性配线图案的方式，将第1电子部件搭载于基板表面的搭载位置。
此时，在光固化性配线图案中，预先使配线形成材料处于具有流动性或变形性的状态。由此，可以使外部端子在端子接合位置处埋入到光固化性配线图案中。进而，通过在此状态下对光固化性配线图案照射光，配线形成材料发生固化，形成导电性配线图案。由此，在导电性配线图案形成的同时，能够使第1电子部件的外部端子以在端子接合位置处埋入到导电性配线图案中的状态与导电性配线图案相接合。如此，通过使用上述这种配线形成材料，能够通过简单的方法来制造第1电子部件与基板的连接可靠性高的COF封装。另外，同样能够使第2电子部件的外部端子以在导电性配线图案的连接位置处埋入到导电性配线图案内部的状态与导电性配线图案相接合。
进而，通过由上述配线形成材料形成导电性配线图案，在COF封装的制造时不进行加热工序也可将第1电子部件的外部端子与导电性配线图案相接合。因此，基板没有必要使用耐热性高的材料(例如聚酰亚胺树脂)，可使用较为廉价、耐热性不那么高的材料等可形成基板。因此，可以减少COF封装的制造成本。另外，可以防止因加热导致的电子部件及基板的劣化。进而，在作为基板的材料而使用例如聚酰亚胺树脂时，由于聚酰亚胺树脂的颜色与铜箔的颜色近似，因此在由铜箔构成的配线图案中，难以识别其形状，发生安装故障的概率提高。本方式中，由于使用聚酰亚胺树脂的必要性减小，因此易于提高成品率、进而可减少COF封装的制造成本。
从以上的观点出发，形成有导电性配线图案基板的材料可以使用聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚乙烯、聚丙烯、聚对苯二甲酸丁二醇酯、聚苯硫醚、聚醚醚酮、聚碳酸酯、液晶聚合物、聚苯乙烯、丙烯酸树脂、聚乙缩醛、聚苯基醚、丙烯腈-苯乙烯共聚物及丙烯腈-丁二烯-苯乙烯共聚树脂等。基板能够使用薄膜状的基板以及优选基板具有透光性的原因与上述相同。
接着，一边参照附图一边详细地说明本发明的实施方式。
(实施方式1)
图1通过方块图表示用于制造本发明一实施方式所涉及的电子部件安装构造体的制造系统、即表面安装线路。
图示例的线路10包含供给基板的基板供给单元1、配线形成材料供给单元2、搭载单元3、光照射单元4、电子部件安装构造体回收单元5、在各单元之间搬送或移动基板的移动装置6。
线路10可以是将安装有1组电子部件的1个基板分别载置于独立的承载板上，利用作为移动装置6的输送机而将其在各单元之间进行搬送的搬送器搬送方式的表面安装线路。此时，基板供给单元1例如可以使用料斗式(magazine)的基板装料机，电子部件安装构造体回收单元5例如可以使用料斗式的基板卸料机。
或者，线路10可以是在包含多个基板的、例如由长条的带状膜构成的基板坯材上，将多组电子部件隔开一定的间隔而对每个基板进行安装那样的表面安装线路。此时，基板供给单元1例如可以使用将基板坯材开卷(日语：巻出す)的开卷辊，电子部件安装构造体回收单元5例如可以使用将安装有电子部件的基板坯材卷绕的卷绕辊。即，线路10可以是辊对辊方式的表面安装线路。其中“基板坯材”是指通过对其进行裁剪而形成多个独立的基板的用语。即，本说明书中，基板坯材包括连接成一体的多个基板。
另外，实施方式1中，对利用搬送器搬送方式的表面安装线路来制造电子部件安装构造体的情况进行说明。
图2A及图2B分别利用主视图及俯视图表示在图1的线路10为搬送器搬送方式的表面安装线路时，利用作为移动机构的输送机6A来搬送基板14的情况。输送机6A具有平行设置的、长条状的、一对板支撑部7。基板14在多个承载板12上各安装有1个。多个承载板12分别由板支撑部7将与搬送方向(图中箭头所示)垂直的方向的两端部支撑，以规定的间隔设置在输送机6A上。通过利用一对的板支撑部7将承载板12的两端部支撑，承载板12的下面不会被输送机6A覆盖，至少与应该由基板14形成配线图案的部分(以下也称作配线形成区域)相对应的部分朝向下方露出。
承载板12上可通过耐热带(tape)将基板14固定。或者，通过将微粘接型的粘接材料涂敷在承载板12的与基板14对置的面，也可将基板14固定。此时，由于将基板14的整个背面(第2面)固定在承载板12上，因此即便是柔性的基板14，也可降低因基板14的起伏等所导致的高度差异。
基于后述的理由，承载板12可使用具有透光性的坯材。作为这种坯材的例子，可举出石英玻璃及透光性树脂等。但是，承载板12也可由不透光的Al等非透明的坯材形成。此时，通过在与光固化性配线图案相对应的部分上打开透光孔、将透明的构件嵌入其中，可以使光透过或者通过。另外，基于同样的理由，基板14也可使用具有透光性的坯材。作为透光性树脂，例如可举出聚乙烯、聚丙烯、聚对苯二甲酸丁二醇酯、聚苯硫醚、聚醚醚酮、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚碳酸酯、液晶聚合物、聚苯乙烯、丙烯酸树脂、聚乙缩醛、聚苯基醚、丙烯腈-苯乙烯共聚物、丙烯腈-丁二烯-苯乙烯共聚树脂。这些树脂可单独使用，也可组合使用多种。例如也可以是多种树脂的聚合物合金。
配线形成材料供给单元2可包含具备例如具有探针或喷嘴的涂敷头和分配器的涂敷装置。使用这种涂敷装置，在基板14的部件安装面(第1表面)上涂敷作为后述光固化性配线形成材料的油墨，以描绘所需的配线图案。由此，形成光固化性配线图案。或者，配线形成材料供给单元2可包含在基板14的第1表面上用上述油墨印刷光固化性配线图案的印刷装置。作为这种印刷装置，可使用丝网印刷装置、喷墨打印机等。
图3通过俯视图表示在天线电路基板上形成了作为导电性配线图案之一例的与IC卡用的天线电路相对应的光固化性配线图案的情况。光固化性配线图案16A是线圈状的图案、端子接合位置18配置在导线的两端部。端子接合位置18被包含在基板14A的第1表面(纸面中成为表侧的面)中的搭载电子部件的搭载位置20。
搭载单元3可包含带式供料器、散装式供料器(bulk feeder)及盘式供料器等电子部件供给装置、和将由这些电子部件供给装置供给的电子部件配置在基板上的例如具有吸附喷嘴的贴片机。
图4通过侧面图示意地表示通过搭载单元3将作为电子部件之一例的IC卡用的IC芯片22A(裸芯片部件)搭载于搭载位置20的情况。IC芯片22A在下面具有多个外部端子24A。外部端子24A在端子接合位置18处分别与光固化性配线图案16A相接触。
在图示例的状态下，由于光固化性配线图案16A仍未固化，因此外部端子24A埋入到具有流动性或变形性的光固化性配线图案16A中。由此，在通过后面的光照射工序、光固化性配线图案16A发生固化而形成导电性配线图案(天线电路)时，通过锚定效果，在端子接合位置处将外部端子24A牢固地结合到天线电路。
另外，通常设置在与基板的对置面上的电子部件的外部端子多是越朝向前端变得越细、或是前端被圆化。与其相对，图示例的外部端子24A可以按照从其根部至前端不改变截面形状的方式形成。由此，可获得充分的锚定效果，可更大地提高结合强度，同时可以容易地形成外部端子24A。
另外，如图5所示，为了获得更大的锚定效果和结合强度，作为电子部件的外部端子，还可使用仅增大了前端直径的外部端子24B。图6通过俯视图表示利用搭载单元将电子部件搭载于基板第1表面的搭载位置的状态的一例。图示例中，利用搭载单元3将IC芯片22A搭载在天线电路基板14A的部件安装面的搭载位置20上。
如图7所示，光照射单元4含有用于使光固化性配线图案16固化的光源26。作为光源26的例子，可举出闪光灯、短脉冲发光单元及脉冲激光振荡器。
光源26可以配置在输送机6A的下方。即，光源26A可以配置在基板的第2表面侧。此时，通过使用具有透光性(或光通过性)的承载板12及基板14，从而自光源26发出的光从输送机6A的下方透过承载板12及基板14而到达搭载有IC芯片或芯片部件等电子部件22的基板14的上表面(第1表面)。由此，向光固化性配线图案16照射光，如图8所示，光固化性配线图案16发生固化、形成导电性配线图案28。此时，各电子部件22的外部端子24同时地在端子接合位置处以将前端埋入到导电性配线图案28的内部的状态与导电性配线图案28相接合。
接着，说明光固化性配线形成材料。光固化性配线形成材料优选使用含有金属纳米粒子、聚合物分散剂和溶剂的导电性油墨。导电性油墨中根据需要可含有粘接促进剂、表面张力调整剂、消泡剂、调平添加剂、流变调整剂及离子强度调整剂等。金属纳米粒子可以在油墨中含有约10～60质量％。聚合物分散剂可以在油墨中含有约0.5～20质量％。油墨优选在发生固化时形成具有小于约200μΩ·cm的电阻率的膜。
金属纳米粒子中例如可单独使用或者组合使用铜、银、镍、铁、钴、铝、钯、金、锡、锌及镉。特别优选铜。纳米粒子的直径可以约为0.1μm(100nm)以下。作为分散剂，例如可单独使用或组合使用聚胺、聚乙烯基吡咯烷酮、聚乙二醇、异硬脂基乙基咪唑啉乙基硫酸盐及油基乙基咪唑啉乙基硫酸盐。或者，分散剂还可单独使用或组合使用磷酸改性磷酸盐聚酯共聚物、及磺化苯乙烯马来酸酐酯。溶剂可以使用水或各种有机溶剂。
上述导电性油墨中，如图9(a)所示，金属纳米粒子32以通过分散剂34覆盖表面的状态浮游在溶剂(或液状媒介)中。分散剂34通过照射适当量的光、温度提高。由此，分散剂34通过例如进行软化，从金属纳米粒子32的表面脱离。结果，金属纳米粒子32变成彼此直接接触的状态，在此状态下金属纳米粒子32如图9(b)所示以相互接触的方式聚集，从而烧结加工自动地进行。由此，多个金属纳米粒子32通过结合，生成图9(c)所示的块状金属36。
导电性油墨在含有Cu纳米填充剂时，外部端子24优选至少在最表面上含有Au。由此，外部端子24与导电性配线图案28的金属结合变得容易，可获得更大的结合强度。
接着，说明利用图1的制造系统来制作电子部件安装构造体即IC卡用的IC芯片安装构造体的情况。
图10通过截面图示意地表示非接触式的IC卡的构造。图示例的IC卡40具有层状构造。另外，图10中为了确保视觉辨认性，在厚度方向上放大IC卡40的各层。另外，图10所示各层的厚度与实际各层的厚度之比未必一致。另外，图10中电子部件并非截面、而是将轮廓单纯地显示。
图示例的IC卡40含有安装有IC芯片22A的树脂制的天线电路基板14A、覆盖天线电路基板14A的安装面的树脂制的包覆层42；覆盖包覆层42的上表面的树脂制的第1表层43；覆盖天线电路基板14A的背面(安装面的相反侧的面)的树脂制的第2表层44。天线电路基板14A的IC芯片安装面上形成有作为天线电路28A的导电性配线图案。在包覆层42的与IC芯片22A相对应的部分上形成收纳IC芯片22A的孔状的芯片收纳部45。以下，对在图示例的IC卡40的天线电路基板14A上安装IC芯片22A的情况进行说明。
(1)在基板供给单元1中，利用未图示的基板装料机将仍未形成天线电路28A的天线电路基板14A载置在设置于输送机6A上的承载板12上。此时，按照至少天线电路基板14A的配线形成区域(图3及图6的光固化性配线图案16A的外形)的投影形状不与输送机6A的板支撑部7重叠的方式，将天线电路基板14A载置于承载板12上。
(2)利用输送机6A，将天线电路基板14A从基板供给单元1搬送至配线形成材料供给单元2，在天线电路基板14A的IC芯片安装面上形成与天线电路28A相对应的光固化性配线图案16A。此时，可根据需要，通过相机图像等来检测承载板12上的天线电路基板14A的位置及姿态。
光固化性配线图案16A可通过使用上述涂敷装置，将配线形成材料(例如上述导电性油墨)涂敷在天线电路基板14A的芯片安装面上来形成。或者，光固化性配线图案16A可通过使用上述各种印刷装置、用配线形成材料进行印刷来形成。由此，在天线电路基板14A的芯片安装面上形成图3所示的光固化性配线图案16A。此时，基于通过相机图像等而检测到的天线电路基板14A的位置及姿态，可以进行涂敷装置的探针的定位、丝网印刷装置的掩模的定位、喷墨打印机的喷嘴的定位。
(3)利用输送机6A将形成有光固化性配线图案16A的天线电路基板14A从配线形成材料供给单元2搬送至搭载单元3，通过例如未图示的贴片机，按照外部端子24A在端子接合位置18处位于光固化性配线图案16A上的方式，将IC芯片22A搭载于天线电路基板14A的芯片安装面的搭载位置20(参照图6)。由此，如图4所示，将IC芯片22A的各外部端子24A的至少前端埋入到光固化性配线图案16A中。此时，可根据需要，利用照相机图像等来检测承载板12上的天线电路基板14A的位置及姿态、或光固化性配线图案16A的形状及姿态，根据其检测结果可以进行贴片机的搭载头的定位。
(4)利用输送机6A将搭载有IC芯片22A的天线电路基板14A从搭载单元3搬送至光照射单元4，通过利用光照射单元4对光固化性配线图案16A照射光而使其固化。由此，在形成天线电路28A的同时，将天线电路28A与外部端子24A接合。此时，如图7所示，通过配置于输送机6A的下方的光源26，从天线电路基板14A的下面(第2表面)侧，使透过承载板12及天线电路基板14A的光照射于光固化性配线图案16A。
通过以上的制造方法，由于利用1个工序(光照射工序)同时进行天线电路28A的形成和天线电路28A与外部端子24A的接合，因此可以缩短电子部件安装构造体(例如IC卡用的IC芯片安装构造体)的制造时间，可以提高生产性。
进而，天线电路28A与外部端子24A的接合由于不进行加热工序地进行，因此没有必要对天线电路基板14A使用耐热性高的材料。结果，作为天线电路基板14A的坯材，可以使用虽然耐热性低但其他方面具有优异特性的各种材料。例如，作为IC卡用的天线电路基板14A的坯材，可以使用聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯及聚碳酸酯等较为廉价的材料。因此，可以降低IC卡的制造成本。或者，作为IC卡用的天线电路基板14A的坯材，可以适当使用透光率高且绝缘破坏电压高的丙烯酸树脂及聚苯乙烯等材料。
进而，光固化性配线图案16A以埋入了外部端子24A的状态进行固化，因此通过锚定效果，可以使外部端子24A与天线电路28A在端子接合位置处牢固地结合。由此，例如没有必要执行向IC芯片22A与天线电路基板14A之间供给底部填充材料、各向异性导电膏(ACP：Anisotropic Conductive Paste)及各向异性导电薄膜(ACF：AnisotropicConductive Film)而强化接合的强化工序。由此，可以进一步提高生产性。
另外，当IC芯片22A的外部端子24A的个数少、无法获得充分的接合强度时，如图10所示，在IC芯片22A的基板对置面设置适当个数的虚拟电极24D，在使其埋入到光固化性配线图案16A中的状态下使光固化性配线图案16A固化，从而也可获得所需的接合强度。此时，特别是工序的数量不会增加，因此可容易地提高生产性。
(实施方式2)
图11通过简化的主视图表示用于制造本发明一实施方式所涉及的电子部件安装构造体的制造系统即表面安装线路。
图示例的线路10A包含供给基板的基板供给单元1A、配线形成材料供给单元2A、搭载单元3A、光照射单元4A、电子部件安装构造体回收单元5A、在各单元之间移动基板的作为移动机构6的输送装置6B。
线路10A是在长条的薄膜状的基板坯材50上将多组电子部件22隔开一定的间隔地进行安装的表面安装线路。图11中的光固化性配线图案16、电子部件22及外部端子24与图7所示相同。此时，基板供给单元1A可以含有将薄膜状的基板坯材50开卷的开卷辊52。另一方面，电子部件安装构造体回收单元5A可以含有将安装有电子部件的薄膜状的基板坯材50卷绕的卷绕辊54。此时，线路10A作为辊对辊方式的表面安装线路构成。
输送装置6B可以含有一对链轮(sprocket)56。与其相对应地，可以在基板坯材50的宽度方向的两侧以规定的间隔形成多个链轮孔。一对链轮56通过一边与链轮孔啮合一边向图中箭头的方向旋转，从而将基板坯材50从基板供给单元1A经由配线形成材料供给单元2A、搭载单元3A及光照射单元4A送至电子部件安装构造体回收单元5A。
基板坯材50通过与实施方式1相同的理由，优选由透光性树脂形成。作为透光性树脂，可举出与实施方式1中所举者相同的树脂，即聚乙烯、聚丙烯、聚对苯二甲酸丁二醇酯、聚苯硫醚、聚醚醚酮、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚碳酸酯、液晶聚合物、聚苯乙烯、丙烯酸树脂、聚乙缩醛、聚苯基醚、丙烯腈-苯乙烯共聚物、丙烯腈-丁二烯-苯乙烯共聚树脂。这些树脂可单独使用，也可组合使用多种。例如，也可是多种树脂的聚合物合金。
图12A通过俯视图表示由带状的薄膜构成的基板坯材的一例。图示例的基板坯材50A是含有液晶驱动器及液晶面板的电子部件安装构造体(COF(Chip On Film)封装)用的基板坯材，在宽度方向(与X轴平行的方向)的两端部上，按照在长度方向(与Y轴平行的方向)以规定间隔排列的方式形成多个链轮孔51。按照基板坯材50A保持一定的张力的方式，使链轮孔51与一对链轮56啮合，在此状态下使一对链轮56旋转，从而将基板坯材50从基板供给单元1A经由配线形成材料供给单元2A、搭载单元3A及光照射单元4A而在长度方向上输送至电子部件安装构造体回收单元5A。
另外，在基板坯材50A上以规定的间隔设置基板轮廓58A，该基板轮廓58A用于裁剪基板坯材50A而从基板坯材50A中剪切出安装有液晶驱动器的COF封装。基板坯材50的被基板轮廓58A包围的部分分别为电路基板14B。基板轮廓58A可以预先利用涂料印刷在基板坯材50A上来形成。配线形成材料供给单元2A中的配线形成材料的供给(涂敷、印刷)可通过利用照相机图像等识别例如基板轮廓58A来进行定位。
图12B通过俯视图表示由带状薄膜构成的基板坯材的其他一例。图示例的基板坯材50B是IC卡的天线电路用的基板坯材，在宽度方向(与X轴平行的方向)的两端部上，按照在长度方向(与Y轴平行的方向)上以规定的间隔排列的方式来形成多个链轮孔51。按照基板坯材50B也保持一定的张力的方式，使链轮孔51与一对链轮56啮合，在此状态下使一对链轮56旋转，从而从基板供给单元1A经由配线形成材料供给单元2A、搭载单元3A及光照射单元4A输送至电子部件安装构造体回收单元5A。
另外，在基板坯材50B上也以规定的间隔设置基板轮廓58B，该基板轮廓58B用于裁剪基板坯材50B而从基板坯材50B中剪切出安装有IC芯片的天线电路基板。基板坯材50B的被基板轮廓58B包围的部分分别为图3等所示的天线电路基板14A。基板轮廓58B可以预先利用涂料印刷在基板坯材50B上来形成。配线形成材料供给单元2A中的配线形成材料的供给(涂敷、印刷)可通过利用照相机图像等识别例如基板轮廓58B来进行定位。
配线形成材料供给单元2A可含有与实施方式1同样的涂敷装置或印刷装置。
图13A通过俯视图表示利用配线形成材料供给单元在基板坯材的一例中以规定间隔将光固化性配线图案按照每个基板形成的情况，所述光固化性配线图案与用于将1个电子部件(裸芯片部件)与另1个电子部件(第2电子部件)连接的连接电路相对应。光固化性配线图案16B是具有相互绝缘的靠近基板14B的中央的端部和外周侧端部的、与多个连接线路相对应的图案。各连接线路的端子接合位置18A配置于靠近连接线路的中央的端部。端子接合位置18A被包含在基板14B的第1表面(纸面中成为表侧的面)中搭载电子部件的搭载位置20A。
另外，如图13A所示，也可在基板坯材50A的各基板14B的内部中与光固化性配线图案16B不同地，通过配线形成材料供给单元2A形成与用于将上述1个电子部件和外部机器连接的连接电路相对应的光固化性配线图案16C。
图13B通过俯视图表示利用配线形成材料供给单元在基板坯材的另一例中以规定间隔、将光固化性配线图案按照每个基板形成的情况。图13B中的基板14A、光固化性配线图案16A、端子接合位置18及搭载位置20与图3所示者相同，光固化性配线图案16A形成在基板14A的第1表面(纸面中成为表侧的面)上。
搭载单元3A中可含有与实施方式1相同的电子部件供给装置和将电子部件配置在基板上的贴片机。
图14A通过俯视图表示利用搭载单元3A将作为电子部件的一例的液晶驱动器22B搭载到基板坯材50A的各搭载位置20A的情况。
此时，如图15所示，设置在液晶驱动器22B的下面的多个外部端子24C在各端子接合位置18A处分别与光固化性配线图案16B或这里未图示的光固化性配线图案16C接触。
在图示例的状态下，由于光固化性配线图案16B(及光固化性配线图案16C、以下相同)仍未固化，因此外部端子24C埋入到具有流动性或变形性的光固化性配线图案16B中。由此，光固化性配线图案16B通过之后的光照射工序发生固化而形成导电性配线图案(连接电路)时，通过锚定效果，外部端子24C与导电性配线图案在端子接合位置18A处牢固地结合。
另外，如上所述的那样，通过按照从外部端子24C的根部起到前端不改变截面形状的方式形成，能够获得充分的锚定效果，以及，为了获得更大的锚定效果和结合强度，可使用仅增大了前端直径的外部端子。
图14B通过俯视图表示利用搭载单元3A将与图6所示相同的IC芯片22A搭载到基板坯材50B的各搭载位置20的情况。此时，设置于IC芯片22A的下面的多个外部端子24A在各端子接合位置18处分别与光固化性配线图案16A接触。进而，由于光固化性配线图案16A仍未固化，因此外部端子24A埋入到具有流动性或变形性的光固化性配线图案16A中。
另外，与实施方式1同样，通过按照从外部端子24A的根部起到前端不改变截面形状的方式形成，能够获得充分的锚定效果，以及，为了获得更大的锚定效果和结合强度，可使用仅增大了前端直径的外部端子。
图11的光照射单元4A也含有与实施方式1同样的光源26A。光源26A可以配置在通过输送装置6B输送的基板坯材50的下方(第2表面侧)。此时，使用具有透光性的基板坯材50，从而自光源26A发出的光透过基板坯材50而到达设置于基板坯材50的上表面的光固化性配线图案16。由此，光固化性配线图案16发生固化，形成连接电路。此时，同时将外部端子24与连接电路在端子接合位置处接合。配线形成材料可以使用与实施方式1同样的导电性油墨。
接着，说明利用上述制造系统来制造电子部件安装构造体的制造方法之一例。以下的例子中，制造含有液晶驱动器及液晶面板的COF封装(液晶显示模块)。
图16A通过俯视图示意地表示含有液晶驱动器及液晶面板的COF封装(液晶显示模块)的一部分(以下为了方便将其一部分称作“COF封装40A”)。图16B表示含有液晶驱动器及液晶面板的COF封装(COF封装40B)的整体。图16A所示的COF封装40A含有由树脂薄膜构成的电路基板14B和包覆电路基板14B的安装面的树脂制的包覆层42A。另外，包覆层42A可以省略。在电路基板14B的液晶驱动器22B的安装面上形成有将液晶驱动器22B和未图示的液晶面板连接的由多个连接线路构成的连接电路28B。进而，在电路基板14B的液晶驱动器22B的安装面上形成有用于将液晶驱动器22B和外部机器连接的由多个较粗的连接线路构成的连接电路28C。
液晶驱动器22B的周围不被包覆层42A覆盖，露出电路基板14B的安装面。以下，对制造图示例的COF封装40A的情况进行说明。
(1)在基板供给单元1A中，以卷绕在开卷辊52上的状态配置尚未形成连接电路28B及28C的基板坯材50A。进而，一边赋予充分的张力一边将从开卷辊52开卷的基板坯材50A架设在一对链轮56上，在此状态下进一步一边使一对链轮56旋转，一边将基板坯材50的前端仅以一定的长度卷绕在卷绕辊54上。
(2)在配线形成材料供给单元2A中通过照相机图像等识别基板坯材50的1个基板轮廓58A，当该基板轮廓58A到达配线形成材料供给单元2A中的材料供给位置时，停止基板坯材50A的输送。
在配线形成材料供给单元2A中，可以使用上述涂敷装置或各种印刷装置来形成光固化性配线图案16B及16C。由此，将图13A所示的光固化性配线图案16B及16C按照每个基板14B形成在配置于基板坯材50A的安装面的基板轮廓58A的内部。当形成光固化性配线图案16B及16C时，再次开始基板坯材50A的输送。此时，基于通过照相机图像等检测到的基板轮廓58A的位置及姿态，可以进行涂敷装置的探针的定位、丝网印刷装置的掩模的定位、喷墨打印机的喷嘴的定位。
另外，光固化性配线图案16B及16C也可以1组1组地形成，例如当利用丝网印刷装置时，也可对应于多个基板14B，通过1次的印刷同时地形成多组的光固化性配线图案16B及16C。或者，也可在通过涂敷装置或喷墨打印机依次形成规定组的光固化性配线图案16B及16C之后，再次开始基板坯材50A的输送。
(3)当光固化性配线图案16B及16C的1组或多组的形成结束时，通过使一对链轮56旋转，将基板坯材50A的形成有光固化性配线图案16B及16C的部分输送至搭载单元3A。进而，例如通过未图示的贴片机，按照外部端子24C在端子接合位置18A处位于光固化性配线图案16B及16C上的方式，将液晶驱动器22B搭载在基板坯材50A的芯片安装面的搭载位置20A(参照图14A及图15)。此时，可以依次将液晶驱动器22B搭载在多组光固化性配线图案16B及16C的搭载位置20A。
由此，使液晶驱动器22B的各外部端子24C的至少前端埋入到光固化性配线图案16B及16C中。此时，可根据需要，通过照相机图像等检测基板轮廓58A的位置及姿态或光固化性配线图案16B及16C的形状及姿态，通过该检测结果可以进行贴片机的搭载头的定位。
(4)当1个或多个液晶驱动器22B的向基板坯材50A的搭载结束时，通过使一对链轮56旋转，将基板坯材50A的形成有光固化性配线图案16B及16C的部分输送至光照射单元4。在光照射单元4中通过对1组或多组的光固化性配线图案16B及16C照射光，从而使1组或多组的光固化性配线图案16B及16C固化。由此，在形成连接电路28B及28C的同时，将连接电路28B及28C与外部端子24C接合。此时，如图11所示，使透过基板坯材50A的光从在一对链轮56之间延伸(日语：張り渡された)的基板坯材50A下面(第2表面)侧照射至光固化性配线图案16B及16C。
(5)利用卷绕辊54卷绕按照每个基板14B形成有连接电路28B及28C并安装有液晶驱动器22B的基板坯材50A。进而，当对一卷的基板坯材50A的处理结束时，将基板坯材50A从未图示的剪切装置的开卷辊开卷、利用各基板轮廓58A将基板坯材50A剪切，从而获得多个的COF封装40A。
(6)利用未图示的安装装置，如图16B所示，通过将液晶面板22C连接于多个COF封装40A的各个连接电路28B，完成多个COF封装40B。
如上所述，根据上述制造方法，由于能够利用1个工序(光照射工序)同时地进行连接电路28B及28C的形成和连接电路28B及28C与外部端子24C的接合，因此可以缩短含有液晶驱动器及液晶面板的COF封装(或电子部件安装构造体)的制造时间，可以提高生产性。
进而，连接电路28B及28C与外部端子24C的接合由于无加热工序地进行，因此电路基板14B没有必要使用耐热性高的材料。结果，作为电路基板14B的坯材可以使用虽然耐热性低、但其他方面具有优异特性的各种材料。例如，作为COF封装用的电路基板14B的坯材可以使用聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯及聚碳酸酯等较为廉价的材料。或者，作为COF封装用的电路基板14B的坯材可以优选地使用透光率高且绝缘破坏电压高的丙烯酸树脂及聚苯乙烯等材料。
进而，光固化性配线图案16B及16C以埋入有外部端子24C的状态进行固化，因此通过锚定效果，可以使外部端子24C在端子接合位置处与连接电路28B及28C牢固地结合。由此，也没有必要执行例如向液晶驱动器22B与电路基板14B之间供给底部填充材料或各向异性导电膏(ACP：Anisotropic Conductive Paste)及各向异性导电薄膜(ACF：Anisotropic Conductive Film)以强化接合的强化工序。由此，可以进一步提高生产性。
另外，当液晶驱动器22B的外部端子24C的个数少、无法获得充分的接合强度时，在液晶驱动器22B的基板对置面上设置适当个数的虚拟电极，在使其埋入到光固化性配线图案16B及16C中的状态下，使光固化性配线图案16B及16C固化，从而也可获得所需的接合强度。此时，特别是工序的数量不会增加，因此可容易地提高生产性。
进而，与搬送器搬送方式相比较时，由于可以在不使用承载板的情况下制造COF封装(或电子部件安装构造体)，因此可以抑制制造成本。另外，由于可以省略在承载板12上一个一个地地固定基板的工序及从承载板12上将基板一个一个地剥离的工序，因此可以削减工时，可以容易地缩短制造时间和降低制造成本。进而，在发生故障时可以立即停止线路，因此没有部件的损失、可以提高成品率。
接着，对利用上述制造系统来制造其他电子部件安装构造体的情况进行说明。以下的例子中，制造安装有IC芯片的天线电路基板即IC芯片安装构造体。
(1)在基板供给单元1A中，将尚未形成天线电路28A的基板坯材50B以卷绕在开卷辊52上的状态进行配置。进而，一边赋予充分的张力一边将从开卷辊52开卷的基板坯材50B架设在一对链轮56上，在此状态下进而一边使一对链轮56旋转，一边将基板坯材50B的前端仅以一定的长度卷绕在卷绕辊54上。
(2)在配线形成材料供给单元2A中通过照相机图像等识别基板坯材50B的1个基板轮廓58B，当该基板轮廓58B到达配线形成材料供给单元2A中的材料供给位置时，停止基板坯材50B的输送。
在配线形成材料供给单元2A中，可以使用上述涂敷装置或各种印刷装置来形成光固化性配线图案16A。由此，将图13B所示的光固化性配线图案16A按照每个基板14A而形成在配置于基板坯材50B安装面的基板轮廓58B的内部。当形成光固化性配线图案16A时，再次开始基板坯材50B的输送。此时，基于通过照相机图像等检测的基板轮廓58B的位置及姿态，可以进行涂敷装置的探针的定位、丝网印刷装置的掩模的定位、喷墨打印机的喷嘴的定位。
另外，光固化性配线图案16A也可以1组1组地形成，例如当利用丝网印刷装置时，也可对应于多个基板14A，通过1次的印刷同时地形成多组的光固化性配线图案16A。或者，也可在通过涂敷装置或喷墨打印机依次形成了规定组的光固化性配线图案16A之后，再次开始基板坯材50B的输送。
(3)当光固化性配线图案16A的1组或多组的形成结束时，通过使一对链轮56旋转，将基板坯材50B的形成有光固化性配线图案16A的部分输送至搭载单元3A。进而，例如通过未图示的贴片机，按照外部端子24A在端子接合位置18处位于光固化性配线图案16A上的方式，将IC芯片22A搭载在基板坯材50B的芯片安装面的搭载位置20。此时，可以依次将IC芯片22A搭载在多组光固化性配线图案16A的搭载位置20。
由此，使IC芯片22A的各外部端子24A的至少前端埋入到光固化性配线图案16A中。此时，可根据需要，通过照相机图像等检测基板轮廓58B的位置及姿态或光固化性配线图案16A的形状及姿态，通过该检测结果可以进行贴片机的搭载头的定位。
(4)当1个或多个IC芯片22A向基板坯材50B的搭载结束时，通过使一对链轮56旋转，将基板坯材50B的形成有光固化性配线图案16A的部分输送至光照射单元4。在光照射单元4中通过对1组或多组的光固化性配线图案16A照射光，使1组或多组光固化性配线图案16A固化。由此，在形成天线电路28A的同时，将天线电路28A与外部端子24A接合。此时，如图11所示，使透过基板坯材50B的光从在一对链轮56之间延伸的基板坯材50B的下面(第2表面)侧照射至光固化性配线图案16A。
(5)利用卷绕辊54对按照每个基板14A形成有天线电路28A、安装有IC芯片22A的基板坯材50B进行卷绕。进而，当对一卷的基板坯材50B的处理结束时，将基板坯材50B从未图示的剪切装置的开卷辊开卷、利用各基板轮廓58B将基板坯材50B剪切，从而获得多个的IC芯片安装构造体。
如上所述，根据上述制造方法，由于能够利用1个工序(光照射工序)同时地进行天线电路28A的形成和天线电路28A与外部端子24A的接合，因此可以缩短IC卡用的IC芯片安装构造体的制造时间，可以提高生产性。
进而，天线电路28A与外部端子24A的接合由于无加热工序地进行，因此天线电路基板14A没有必要使用耐热性高的材料。结果，作为天线电路基板14A的坯材可以使用虽然耐热性低、但其他方面具有优异特性的各种材料。例如，作为IC卡用的天线电路基板14A的坯材可以使用聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯及聚碳酸酯等较为廉价的材料。或者，作为IC卡用的天线电路基板14A的坯材可以优选地使用透光率高且绝缘破坏电压高的丙烯酸树脂及聚苯乙烯等材料。
进而，光固化性配线图案16A以埋入有外部端子24A的状态进行固化，因此通过锚定效果，可以使外部端子24A在端子接合位置处与天线电路28A牢固地结合。由此，也没有必要执行例如向IC芯片22A与天线电路基板14A之间供给底部填充材料或各向异性导电膏(ACP：Anisotropic Conductive Paste)及各向异性导电薄膜(ACF：AnisotropicConductive Film)而强化接合的强化工序。由此，可以进一步提高生产性。
另外，当IC芯片22A的外部端子24A的个数少、无法获得充分的接合强度时，在IC芯片22A的基板对置面上设置适当个数的虚拟电极，在使其埋入到光固化性配线图案16A中的状态下，使光固化性配线图案16A固化，从而也可获得所需的接合强度。此时，特别是工序的数量不会增加，因此可容易地提高生产性。
进而，与搬送器搬送方式相比较时，由于可以在不使用承载板的情况下制造电子部件安装构造体，因此可以抑制制造成本。另外，由于可以省略在承载板12上1个1个地固定基板的工序及从承载板12上将基板1个1个地剥离的工序，因此可以削减工时，缩短制造时间和降低制造成本变得容易。进而，在发生故障时可以立即停止线路，因此没有部件的损失、可以提高成品率。
(实施方式3)
图17通过简化的主视图表示用于制造本发明一实施方式所涉及的电子部件安装构造体的制造系统即表面安装线路。
图示例的线路10B在一对的遮光板60A及60B配置于搭载单元3A与光照射单元4A之间这一点上与图11的线路10A不同。以下，主要使用实施例1及2中参照的附图及符号来说明该不同点。
线路10B作为在由长条带状的薄膜构成的基板坯材上将多组电子部件隔开一定的间隔地进行安装的辊对辊方式的表面安装线路构成。基板坯材基于与实施方式1相同的理由，优选利用与实施方式2相同的透光性树脂形成。另外，配线形成材料可以使用与上述相同的导电性油墨。另外，图17示例的基板坯材、光固化性配线图案及电子部件是与图11等所示相同的基板坯材50、光固化性配线图案16以及电子部件22。
在配线形成材料供给单元2A、搭载单元3A及光照射单元4A分别具备将内部与外部在光学上完全地分离的框体时，可以不对仍未搭载电子部件的基板的光固化性配线图案照射光而使基板移动至光照射单元4A。但是，各单元中具备这种框体可成为成本增加的要因。因此，不按照每个单元设置框体、而是在例如搭载单元3A与光照射单元4A之间设置遮光机构，从而可以防止光照射到尚未搭载电子部件的基板的光固化性配线图案上。由此，可以在抑制成本增加的同时，同时执行导电性配线图案的形成以及导电性配线图案与电子部件的外部端子的接合。
更具体地说，线路10B具备按照在中间夹持被输送装置6B输送的基板坯材50的方式与基板坯材50输送方向垂直而配置的一对遮光板60A及60B、和使一个遮光板60A垂直于基板坯材50的输送方向而移动的遮光板移动装置62。一对的遮光板60A及60B配置在搭载单元3A与光照射单元4A之间。
遮光板60A配置在基板坯材50的电子部件安装面侧，遮光板60B配置在其相反侧。遮光板移动装置62例如可以由在中间夹持遮光板60A而旋转的1对或多对辊构成。通过遮光板移动装置62使遮光板60A在图中双点划线所示的切断位置与图中实线所示的开放位置之间移动。另一方面，遮光板60B可以固定在上端部与基板坯材50的下表面接触的位置。
以下，说明利用线路10B来制造图16A所示COF封装40A的情况。
(1)在基板供给单元1A中，将尚未形成有连接电路28B及28C的基板坯材50A以卷绕在开卷辊52上的状态进行配置。进而，一边赋予充分的张力一边将从开卷辊52开卷的基板坯材50A架设在一对链轮56上，在此状态下进而一边使一对链轮56旋转，一边将基板坯材50A的前端仅以一定的长度卷绕在卷绕辊54上。
(2)在配线形成材料供给单元2A中通过照相机图像等识别基板坯材50A的1个基板轮廓58A，当该基板轮廓58A到达配线形成材料供给单元2A的材料供给位置时，停止基板坯材50A的输送。
在配线形成材料供给单元2A中，可以使用上述涂敷装置或各种印刷装置形成光固化性配线图案16B及16C。由此，将图13A所示的光固化性配线图案16B及16C按照每个基板14B而形成在配置于基板坯材50A安装面的基板轮廓58A的内部。当形成光固化性配线图案16B及16C时，再次开始基板坯材50A的输送。此时，基于通过照相机图像等检测的基板轮廓58A的位置及姿态，可以进行涂敷装置的探针的定位、丝网印刷装置的掩模的定位、喷墨打印机的喷嘴的定位。
另外，光固化性配线图案16B及16C也可以1组1组地形成，例如当利用丝网印刷装置时，也可对应于多个基板14B，通过1次的印刷同时地形成多组的光固化性配线图案16B及16C。或者，也可在通过涂敷装置或喷墨打印机依次形成了规定组的光固化性配线图案16B及16C之后，再次开始基板坯材50A的输送。
(3)当光固化性配线图案16B及16C的1组或多组的形成结束时，通过使一对链轮56旋转，将基板坯材50A的形成有光固化性配线图案16B及16C的部分输送至搭载单元3A。进而，例如通过未图示的贴片机，按照外部端子24C在端子接合位置18A处位于光固化性配线图案16B及16C上的方式，将液晶驱动器22B搭载在基板坯材50A的芯片安装面的搭载位置20A(参照图14A及图15)。此时，可以依次将液晶驱动器22B搭载在多组光固化性配线图案16B及16C的搭载位置20A。
由此，使液晶驱动器22B的各外部端子24C的至少前端埋入到光固化性配线图案16B及16C中。此时，可根据需要，通过照相机图像等检测基板轮廓58A的位置及姿态或光固化性配线图案16B及16C的形状及姿态，通过该检测结果可以进行贴片机的搭载头的定位。在利用搭载单元3A进行液晶驱动器22B的搭载的期间，同时在配线形成材料供给单元2A中进行上述光固化性配线图案的形成工序。
(4)当1个或多个液晶驱动器22B的向基板坯材50A的搭载结束时，当遮光板60A处于遮光位置时，通过遮光板移动装置62将遮光板60A从遮光位置移动至开放位置。之后，通过使一对链轮56旋转，将基板坯材50A的形成有光固化性配线图案16B及16C的部分输送至光照射单元4。另外，当遮光板60A处于开放位置时，在此状态下输送基板坯材50B。
接着，通过遮光板移动装置62使遮光板60A从开放位置移动至遮光位置。之后，通过在光照射单元4中对1组或多组光固化性配线图案16B及16C照射光，使1组或多组的光固化性配线图案16B及16C固化。由此，在形成连接电路28B及28C的同时，将连接电路28B及28C与外部端子24C接合。
此时，如图17所示，使透过基板坯材50A的光从在一对链轮56之间延伸的基板坯材50A的下面(第2表面)侧照射至光固化性配线图案16B及16C。在利用光照射单元4形成连接电路28B及28C的期间，同时利用搭载单元3A进行上述液晶驱动器22B的搭载工序。
(5)当上述1组或多组的连接电路28B及28C的形成以及外部端子24A的接合结束时，停止利用光源26A进行的光的照射。之后，利用遮光板移动装置62将遮光板60A从遮光位置移动至开放位置。在此状态下，使一对链轮56旋转，将形成有天线电路28A的1个或多个基板14A向电子部件安装构造体回收单元5A的方向输送。以下的工序与实施方式2中说明的相同。
如上所述，在线路10B中，在搭载单元3A与光照射单元4A之间设置有遮光机构，以使光不照射到尚未搭载有电子部件的基板的光固化性配线图案，因此可以抑制成本提高，同时执行导电性配线图案的形成以及导电性配线图案与电子部件的外部端子的接合。
以下，对制造图10所示的IC卡用的IC芯片安装构造体的情况进行说明。
(1)在基板供给单元1A中，将尚未形成连接电路28A的基板坯材50B以卷绕在开卷辊52上的状态进行配置。进而，一边赋予充分的张力一边将从开卷辊52开卷的基板坯材50B架设在一对链轮56上，在此状态下进而一边使一对链轮56旋转，一边将基板坯材50B的前端仅以一定的长度卷绕在卷绕辊54上。
(2)在配线形成材料供给单元2A中通过照相机图像等识别基板坯材50B的1个基板轮廓58B，当该基板轮廓58B到达配线形成材料供给单元2A中的材料供给位置时，停止基板坯材50B的输送。
在配线形成材料供给单元2A中，可以使用上述涂敷装置或各种印刷装置来形成光固化性配线图案16A。由此，将图13B所示的光固化性配线图案16A按照每个基板14A而形成在配置于基板坯材50B的安装面的基板轮廓58B的内部。当形成光固化性配线图案16A时，再次开始基板坯材50B的输送。此时，基于通过照相机图像等检测的基板轮廓58B的位置及姿态，可以进行涂敷装置的探针的定位、丝网印刷装置的掩模的定位、喷墨打印机的喷嘴的定位。
另外，光固化性配线图案16A也可以1组1组地形成，例如当利用丝网印刷装置时，也可对应于多个基板14A，通过1次的印刷同时地形成多组的光固化性配线图案16A。或者，也可在通过涂敷装置或喷墨打印机依次形成规定组的光固化性配线图案16A之后，再次开始基板坯材50B的输送。
(3)当光固化性配线图案16A的1组或多组的形成结束时，通过使一对链轮56旋转，将基板坯材50B的形成有光固化性配线图案16A的部分输送至搭载单元3A。进而，例如通过未图示的贴片机，按照外部端子24A在端子接合位置18处位于光固化性配线图案16A上的方式，将IC芯片22A搭载在基板坯材50B的芯片安装面的搭载位置20(参照图14B)。此时，可以依次将IC芯片22A搭载在多组光固化性配线图案16A的搭载位置20。
由此，使IC芯片22A的各外部端子24A的至少前端埋入到光固化性配线图案16A中。此时，可根据需要通过照相机图像等检测基板轮廓58B的位置及姿态或光固化性配线图案16A的形状及姿态，通过该检测结果可以进行贴片机的搭载头的定位。在利用搭载单元3A进行IC芯片22A的搭载的期间，同时利用配线形成材料供给单元2A进行上述光固化性配线图案的形成工序。
(4)当1个或多个IC芯片22A的向基板坯材50B的搭载结束时，当遮光板60A处于遮光位置时，通过遮光板移动装置62将遮光板60A从遮光位置移动至开放位置。之后，通过使一对链轮56旋转，将基板坯材50B的形成有光固化性配线图案16A的部分输送至光照射单元4。另外，当遮光板60A处于开放位置时，在此状态下输送基板坯材50B。
接着，通过遮光板移动装置62使遮光板60A从开放位置移动至遮光位置。之后，通过利用光照射单元4A对1组或多组光固化性配线图案16A照射光，使1组或多组的光固化性配线图案16A固化。由此，在形成天线电路28A的同时，将天线电路28A与外部端子24A接合。
此时，如图17所示，使透过基板坯材50B的光从在一对链轮56之间延伸的基板坯材50B的下面(第2表面)侧照射至光固化性配线图案16A。在利用光照射单元4形成天线电路28A的期间，同时利用搭载单元3A进行上述IC芯片22A的搭载工序。
(5)当上述1组或多组的天线电路28A的形成以及外部端子24A的接合结束时，停止利用光源26A进行的光的照射。之后，利用遮光板移动装置62将遮光板60A从遮光位置移动至开放位置。在此状态下，使一对链轮56旋转，将形成有天线电路28A的1个或多个基板14A向电子部件安装构造体回收单元5A的方向输送。以下的工序与实施方式2中说明的相同。
如上所述，根据线路10B，在搭载单元3A与光照射单元4A之间设置有遮光机构，以使光不对尚未搭载有裸芯片部件的基板的光固化性配线图案照射，因此可以抑制成本提高，同时地执行天线电路的形成以及天线电路与裸芯片部件的外部端子的接合。
图18表示实施方式3的遮光机构的变形例。图18(a)表示配置于安装面侧的一方的遮光板60A的变形例，图示例的遮光板60C在下端部(基板坯材侧端部)设有与基板坯材50的输送方向平行地突出的突出部64A。图18(b)表示另一方的遮光板60B的变形例，图示例的遮光板60D在上端部(基板坯材侧端部)设有与基板坯材50的输送方向平行地突出的突出部64B。
如图19(a)所示，可以认为在遮光板60A及60B中相对于基板坯材50的主面倾斜地入射的光66通过折射而泄露到搭载单元3A侧(图的左侧)。这一点通过在遮光板60A及60B的至少一者中设置突出部64A及64B，像如图19(b)所示的遮光板60C及60D那样，相对于基板坯材50的主面倾斜地入射的光也可有效地遮光。此时，突部64A及64B的与基板坯材50的对置面68A及68B为了避免光的反射，优选的是，进行消光、设为黑色。
(实施方式4)
以下参照图20及图21，对本发明的其他实施方式进行说明。
图20是表示将本实施方式所涉及的电子部件安装构造体安装在母基板等其他基板的情况的主视图。
图20的例子中，将作为电子部件安装构造体的电子部件封装40C安装在其他的基板即母基板70上。电子部件封装40C含有作为电子部件的2个层叠半导体22D及22E和玻璃插入器14C。
层叠半导体22D是分别将作为裸芯片部件的CPU(Central Processing Unit：中央演算装置)72A和2个存储器72B及72C层叠并将它们之间利用多个贯通电极74连接的部件。同样，层叠半导体22E是分别将作为裸芯片部件的GPU(Graphics Processing Unit：图形处理单元)72D和2个存储器72E及72F层叠并将它们之间利用多个贯通电极74连接的部件。
层叠半导体22D及22E的各个贯通电极74的一端(图中为下端)与突出设置于层叠半导体22D及22E的各个下表面(或玻璃插入器14C侧的面)的外部端子24F相连接。
玻璃插入器14C具有例如形成为矩阵状的多个厚度方向的贯通孔，在各个贯通孔中形成中继电极82。各中继电极82的一端(图中为下端)与突出设置于玻璃插入器14C的下表面(或母基板70侧的面)的焊料凸块84相连接。中继电极82中的至少一部分其他端(图中为上端)分别与多个接地电极28D相连接，所述接地电极28D与外部端子24F相对应地形成在玻璃插入器14C的上表面(或电子部件封装40C的安装面)。各外部端子24F以至少一部分埋入到接地电极28D内部的状态，与接地电极28D接合。
图21通过输送机的俯视图表示在与图2A及图2B所示相同的输送机6A上以一定间隔放置与实施方式1相同的承载板12、在各个承载板上放置玻璃插入器的情况。图示例的承载板12与实施方式1同样，具有透光性。在图21的左端(a)状态下，在玻璃插入器14C的上表面应该形成多个接地电极28D的位置上形成电极前体(日语：前駆体)16D。这里，电极前体16D可以使用上述的配线形成材料(例如导电性油墨)来形成。电极前体16D的形成可以使用图1的配线形成材料供给单元2来执行。在这种配线形成材料供给单元2中可包含上述的涂覆装置或印刷装置。
在图21的中央的状态(b)下，通过与实施方式1相同的搭载单元3，将具有外部端子24F的作为电子部件的层叠半导体22F搭载于玻璃插入器14C的上表面的搭载位置20，以使外部端子24F贴触在电极前体16D上。此时，与图4所示的相同，外部端子24F的一部分被埋入到电极前体16D的内部。
在图21的右端(c)的状态下，通过与实施方式1相同的光照射单元4对电极前体16D照射光使其固化，从而形成接地电极28D。此时，同时外部端子24F以埋入到接地电极28D内部的状态与接地电极28D相接合。由此，可以提高部件安装基板的生产性，同时可获得很高的连接可靠性。结果，还可以省略上述底部填充材料等的使用。另外，当将外部端子和基板电极接合时，由于不对电子部件或玻璃插入器进行加热或施加很高的压力，因此玻璃插入器例如还可以使用厚度为0.1mm左右的薄板玻璃，部件安装基板的小型化及薄型化变得容易。
这里，图3及图6所示的天线电路基板14A可以使用与玻璃插入器14C相同的玻璃插入器。在这种玻璃插入器的一方的主面上，以与实施方式1相同的顺序形成天线电路用的光固化性配线图案16A，同时在端子接合位置处将外部端子24A与天线电路28A接合，从而与实施方式1同样，可以提高生产性和连接可靠性。此时，玻璃插入器中还能够不安装层叠半导体而安装单层的IC芯片。
产业实用性
通过本发明，以电子部件的外部端子埋入到基板表面的导电性配线图案的状态下使其接合。由此，可获得电子部件与导电性配线图案之间的高连接可靠性。由此，本发明可优选适用于液晶显示模块、IC卡等。
就目前优选的实施方式对本发明进行了说明，但并非限定地解释这种公开内容。各种变形及改变通过读取上述公开内容，属于本发明技术领域的从业者当然会没有错误地理解。因此，附带的权利要求范围应该解释为包含不脱离本发明的真正精神及范围的所有变形及改变。
符号说明
1…基板供给单元、2…配线形成材料供给单元、3…搭载单元、4…光照射单元、5…电子部件安装基板回收单元、6…移动机构、6A…输送机、6B…输送装置、7…板支撑部、10、10A…线路、12…承载板、14…基板、14A…天线电路基板、14B…电路基板、14C…玻璃插入器、16、16A～16C…光固化性配线图案、18、18A…端子接合位置、20、20A…搭载位置、22A…IC芯片、22B…液晶驱动器、22D、22E…层叠半导体、24、24A～24C…外部端子、24D…虚拟电极、26、26A…光源、28…导电性配线图案、28A…天线电路、28B…连接电路、28D…接地电极、32…金属纳米粒子、34…分散剂、40…IC卡、40A…COF封装

Claims (15)

1.一种电子部件安装构造体，包括：
基板；
导电性配线图案，形成于所述基板的表面；以及
电子部件，搭载于所述基板的表面的搭载位置，具有外部端子，所述搭载位置包含所述导电性配线图案的端子接合位置，
所述外部端子在所述端子接合位置处以埋入到所述导电性配线图案的内部的状态与所述导电性配线图案接合。
2.根据权利要求1所述的电子部件安装构造体，
所述导电性配线图案由具有流动性的光固化性的配线形成材料形成，
所述配线形成材料含有平均粒径为1～10nm的Cu粒子。
3.根据权利要求1或2所述的电子部件安装构造体，
所述电子部件的所述外部端子至少在最表面含有Cu。
4.根据权利要求1～3中任一项所述的电子部件安装构造体，
所述基板是薄膜状的基板。
5.根据权利要求1～4中任一项所述的电子部件安装构造体，
所述基板具有透光性。
6.一种IC卡，包括：
基板；
天线电路，形成于所述基板的表面；以及
裸芯片部件，搭载于所述基板的表面的搭载位置，具有外部端子，所述搭载位置包含所述天线电路的端子接合位置，
所述外部端子在所述端子接合位置处以埋入到所述天线电路的内部的状态与所述天线电路接合。
7.根据权利要求6所述的IC卡，
所述导电性配线图案由具有流动性的光固化性的配线形成材料形成，
所述配线形成材料含有平均粒径为1～10nm的Cu粒子。
8.根据权利要求6或7所述的IC卡，
所述基板含有选自聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚乙烯、聚丙烯、聚对苯二甲酸丁二醇酯、聚苯硫醚、聚醚醚酮、聚碳酸酯、液晶聚合物、聚苯乙烯、丙烯酸树脂、聚乙缩醛、聚苯基醚、丙烯腈-苯乙烯共聚物、及丙烯腈-丁二烯-苯乙烯共聚树脂中的至少1种。
9.根据权利要求6～8中任一项所述的IC卡，
所述基板是薄膜状的基板。
10.根据权利要求6～9中任一项所述的IC卡，
所述基板具有透光性。
11.一种COF封装，包括：
薄膜状的基板；
导电性配线图案，形成于所述基板的表面；
第1电子部件，搭载于所述基板的表面的搭载位置，具有外部端子，所述搭载位置包含所述导电性配线图案的端子接合位置；以及
第2电子部件，通过所述导电性配线图案与所述第1电子部件连接，
所述第1电子部件的所述外部端子在所述端子接合位置处以埋入到所述导电性配线图案的内部的状态与所述导电性配线图案接合。
12.根据权利要求11所述的COF封装，
所述第1电子部件为液晶驱动器，
所述第2电子部件为液晶面板。
13.根据权利要求11或12所述的COF封装，
所述导电性配线图案由具有流动性的光固化性的配线形成材料形成，
所述配线形成材料含有平均粒径为1～10nm的Cu粒子。
14.根据权利要求11～13中任一项所述的COF封装，
所述基板含有选自聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚乙烯、聚丙烯、聚对苯二甲酸丁二醇酯、聚苯硫醚、聚醚醚酮、聚碳酸酯、液晶聚合物、聚苯乙烯、丙烯酸树脂、聚乙缩醛、聚苯基醚、丙烯腈-苯乙烯共聚物、及丙烯腈-丁二烯-苯乙烯共聚树脂中的至少1种。
15.根据权利要求11～14中任一项所述的COF封装，
所述基板具有透光性。
CN201380033809.8A 2012-07-04 2013-02-21 电子部件安装构造体、ic卡、cof封装 Pending CN104412724A (zh)

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