JP5122744B2 - フラッシュメモリ素子の製造方法 - Google Patents
フラッシュメモリ素子の製造方法 Download PDFInfo
- Publication number
- JP5122744B2 JP5122744B2 JP2005368367A JP2005368367A JP5122744B2 JP 5122744 B2 JP5122744 B2 JP 5122744B2 JP 2005368367 A JP2005368367 A JP 2005368367A JP 2005368367 A JP2005368367 A JP 2005368367A JP 5122744 B2 JP5122744 B2 JP 5122744B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- spacer
- forming
- flash memory
- memory device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 125000006850 spacer group Chemical group 0.000 claims description 54
- 150000004767 nitrides Chemical class 0.000 claims description 33
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 17
- 239000012535 impurity Substances 0.000 claims description 8
- 238000001039 wet etching Methods 0.000 claims description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- 238000005468 ion implantation Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000010354 integration Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3418—Disturbance prevention or evaluation; Refreshing of disturbed memory data
- G11C16/3427—Circuits or methods to prevent or reduce disturbance of the state of a memory cell when neighbouring cells are read or written
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
Landscapes
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Description
202:第1の接合領域
203:第1のスペーサ
204:第2のスペーサ
205:第2の接合領域
300:半導体基板
301:低濃度の不純物領域
302:バッファ窒化膜
303:酸化膜304:酸化膜スペーサ
305:ソース/ドレイン領域
306:コンタクトバッファ用酸化膜スペーサ
Claims (4)
- 多数のワードラインとセレクトラインが形成された半導体基板に低濃度の不純物領域を形成する段階、
上記ワードラインと上記セレクトラインを含む半導体基板の全面にバッファ窒化膜を形成する段階、
上記バッファ窒化膜上に酸化膜を形成した後、エッチング工程でセレクトラインの側壁に酸化膜スペーサを形成する段階、
上記酸化膜スペーサを用いたイオン注入工程で上記半導体基板の所定領域にソース/ドレインを形成する段階、
上記酸化膜スペーサ及び上記バッファ窒化膜を除去する段階、及び
上記セレクトラインの側壁にコンタクトバッファ用酸化膜スペーサを形成し、この時、上記多数のワードライン間が上記コンタクトバッファ用酸化膜で埋め込まれる段階を含むフラッシュメモリ素子の製造方法。 - 上記酸化膜スペーサは、H2OとHFを50:1〜100:1の比率で希釈したHF溶液を用いた湿式エッチング工程で除去する請求項1に記載のフラッシュメモリ素子の製造方法。
- 上記酸化膜スペーサは、H2OとBOEを20:1〜300:1の比率で希釈したBOE溶液を用いた湿式エッチング工程で除去する請求項1に記載のフラッシュメモリ素子の製造方法。
- 上記バッファ窒化膜をリン酸を用いた湿式エッチング工程で除去することを特徴とする請求項1に記載のフラッシュメモリ素子の製造方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0037105 | 2005-05-03 | ||
KR1020050037105A KR100672140B1 (ko) | 2005-05-03 | 2005-05-03 | 반도체 소자의 제조 방법 |
KR10-2005-0057270 | 2005-06-29 | ||
KR1020050057270A KR100739928B1 (ko) | 2005-06-29 | 2005-06-29 | 플래시 메모리 소자의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006313874A JP2006313874A (ja) | 2006-11-16 |
JP5122744B2 true JP5122744B2 (ja) | 2013-01-16 |
Family
ID=37394522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005368367A Expired - Fee Related JP5122744B2 (ja) | 2005-05-03 | 2005-12-21 | フラッシュメモリ素子の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7282420B2 (ja) |
JP (1) | JP5122744B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100660720B1 (ko) * | 2005-12-29 | 2006-12-21 | 동부일렉트로닉스 주식회사 | 수평 구조의 게이트 커패시터 및 그 제조 방법 |
US7692968B2 (en) * | 2007-04-25 | 2010-04-06 | Macronix International Co., Ltd. | Operation method of non-volatile memory and method of improving coupling interference from nitride-based memory |
US9773865B2 (en) | 2014-09-22 | 2017-09-26 | International Business Machines Corporation | Self-forming spacers using oxidation |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3114229B2 (ja) * | 1991-04-05 | 2000-12-04 | ソニー株式会社 | 不揮発性記憶装置 |
US5422504A (en) * | 1994-05-02 | 1995-06-06 | Motorola Inc. | EEPROM memory device having a sidewall spacer floating gate electrode and process |
US5882973A (en) * | 1997-01-27 | 1999-03-16 | Advanced Micro Devices, Inc. | Method for forming an integrated circuit having transistors of dissimilarly graded junction profiles |
TW340958B (en) * | 1997-02-25 | 1998-09-21 | Winbond Electronics Corp | The producing method for self-aligned isolating gate flash memory unit |
TW363230B (en) * | 1997-12-26 | 1999-07-01 | Taiwan Semiconductor Mfg Co Ltd | Manufacturing method for the flash memory cell with split-gate |
KR20020003269A (ko) | 2000-07-03 | 2002-01-12 | 권영식 | 인터넷을 이용한 설문조사 및 분석시스템 |
KR20020032697A (ko) | 2000-10-26 | 2002-05-04 | 박종섭 | 반도체 소자의 측벽 스페이서 형성 방법 |
TW455933B (en) * | 2000-11-02 | 2001-09-21 | Winbond Electronics Corp | Manufacture method of floating gate in flash memory |
JP2002280463A (ja) * | 2001-03-16 | 2002-09-27 | Toshiba Corp | 半導体装置及びその製造方法 |
KR20030001954A (ko) | 2001-06-28 | 2003-01-08 | 주식회사 하이닉스반도체 | 반도체 소자의 제조방법 |
JP2003068889A (ja) | 2001-08-23 | 2003-03-07 | Matsushita Electric Ind Co Ltd | 不揮発性半導体記憶装置の製造方法 |
KR20040019191A (ko) | 2002-08-26 | 2004-03-05 | 삼성전자주식회사 | 플래시 메모리 소자 제조 방법 |
US20050045939A1 (en) * | 2003-08-27 | 2005-03-03 | Eungjoon Park | Split-gate memory cell, memory array incorporating same, and method of manufacture thereof |
JP2005109236A (ja) * | 2003-09-30 | 2005-04-21 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
-
2005
- 2005-12-13 US US11/301,866 patent/US7282420B2/en not_active Expired - Fee Related
- 2005-12-21 JP JP2005368367A patent/JP5122744B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20060252204A1 (en) | 2006-11-09 |
JP2006313874A (ja) | 2006-11-16 |
US7282420B2 (en) | 2007-10-16 |
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