JP5121354B2 - オーバーモールドｍｃｍｉｃパッケージおよびその作製方法 - Google Patents

オーバーモールドｍｃｍｉｃパッケージおよびその作製方法 Download PDF

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Publication number
JP5121354B2
JP5121354B2 JP2007212211A JP2007212211A JP5121354B2 JP 5121354 B2 JP5121354 B2 JP 5121354B2 JP 2007212211 A JP2007212211 A JP 2007212211A JP 2007212211 A JP2007212211 A JP 2007212211A JP 5121354 B2 JP5121354 B2 JP 5121354B2
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JP
Japan
Prior art keywords
lid
overmold
package
heat sink
chimney
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007212211A
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English (en)
Japanese (ja)
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JP2008047920A5 (https=
JP2008047920A (ja
Inventor
ビー．クリスペル ロバート
スコット キストラー ロバート
ダブリュ．オーゼンバッハ ジョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agere Systems LLC
Original Assignee
Agere Systems LLC
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Publication date
Application filed by Agere Systems LLC filed Critical Agere Systems LLC
Publication of JP2008047920A publication Critical patent/JP2008047920A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2007212211A 2006-08-16 2007-08-16 オーバーモールドｍｃｍｉｃパッケージおよびその作製方法 Expired - Fee Related JP5121354B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/504989 2006-08-16
US11/504,989 US20080042302A1 (en) 2006-08-16 2006-08-16 Plastic overmolded packages with molded lid attachments

Publications (3)

Publication Number Publication Date
JP2008047920A JP2008047920A (ja) 2008-02-28
JP2008047920A5 JP2008047920A5 (https=) 2010-07-22
JP5121354B2 true JP5121354B2 (ja) 2013-01-16

Family

ID=39095324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007212211A Expired - Fee Related JP5121354B2 (ja) 2006-08-16 2007-08-16 オーバーモールドｍｃｍｉｃパッケージおよびその作製方法

Country Status (4)

Country Link
US (1) US20080042302A1 (https=)
JP (1) JP5121354B2 (https=)
KR (1) KR20080015724A (https=)
CN (1) CN101127348B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8049313B2 (en) * 2006-09-20 2011-11-01 Freescale Semiconductor, Inc. Heat spreader for semiconductor package
JP2008305937A (ja) * 2007-06-07 2008-12-18 Panasonic Corp 電子部品内蔵モジュールおよびその製造方法
US8801463B2 (en) 2012-01-13 2014-08-12 Hon Hai Precision Industry Co., Ltd. Waterproof electrical connector
US9093563B2 (en) 2013-07-11 2015-07-28 International Business Machines Corporation Electronic module assembly with patterned adhesive array
US9337119B2 (en) 2014-07-14 2016-05-10 Micron Technology, Inc. Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems
JP6897056B2 (ja) * 2016-10-20 2021-06-30 富士電機株式会社 半導体装置及び半導体装置製造方法
KR102617088B1 (ko) 2019-09-18 2023-12-26 삼성전자주식회사 반도체 패키지
JP7247124B2 (ja) * 2020-01-07 2023-03-28 三菱電機株式会社 半導体モジュール
JP2024127170A (ja) * 2023-03-09 2024-09-20 三菱電機株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758254A (ja) * 1993-08-19 1995-03-03 Fujitsu Ltd マルチチップモジュール及びその製造方法
JPH10242355A (ja) * 1997-02-25 1998-09-11 Hitachi Ltd 半導体集積回路装置
US6507116B1 (en) * 1997-04-24 2003-01-14 International Business Machines Corporation Electronic package and method of forming
TW411595B (en) * 1999-03-20 2000-11-11 Siliconware Precision Industries Co Ltd Heat structure for semiconductor package device
US6784541B2 (en) * 2000-01-27 2004-08-31 Hitachi, Ltd. Semiconductor module and mounting method for same
TW454321B (en) * 2000-09-13 2001-09-11 Siliconware Precision Industries Co Ltd Semiconductor package with heat dissipation structure
US6849940B1 (en) * 2000-11-20 2005-02-01 Ati Technologies, Inc. Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same
JP4479121B2 (ja) * 2001-04-25 2010-06-09 株式会社デンソー 半導体装置の製造方法
JP3640625B2 (ja) * 2001-07-02 2005-04-20 新光電気工業株式会社 半導体装置と半導体装置用フイルムキャリア
US6734552B2 (en) * 2001-07-11 2004-05-11 Asat Limited Enhanced thermal dissipation integrated circuit package
US6987032B1 (en) * 2002-07-19 2006-01-17 Asat Ltd. Ball grid array package and process for manufacturing same
US6800948B1 (en) * 2002-07-19 2004-10-05 Asat Ltd. Ball grid array package
US6979594B1 (en) * 2002-07-19 2005-12-27 Asat Ltd. Process for manufacturing ball grid array package
KR100632459B1 (ko) * 2004-01-28 2006-10-09 삼성전자주식회사 열방출형 반도체 패키지 및 그 제조방법

Also Published As

Publication number Publication date
KR20080015724A (ko) 2008-02-20
CN101127348B (zh) 2011-07-13
JP2008047920A (ja) 2008-02-28
US20080042302A1 (en) 2008-02-21
CN101127348A (zh) 2008-02-20

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