CN101127348A - 具有模制盖连接件的塑料包覆成型的包装件 - Google Patents

具有模制盖连接件的塑料包覆成型的包装件 Download PDF

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CN101127348A
CN101127348A CNA2007101120354A CN200710112035A CN101127348A CN 101127348 A CN101127348 A CN 101127348A CN A2007101120354 A CNA2007101120354 A CN A2007101120354A CN 200710112035 A CN200710112035 A CN 200710112035A CN 101127348 A CN101127348 A CN 101127348A
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lid
overmolded
package
radiator
tightens
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CN101127348B (zh
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R·B·克里斯佩尔
R·S·基斯特勒
J·W·奥森巴赫
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Agere Systems LLC
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Abstract

说明书描述了具有烟囱式散热器并带有盖的包覆成型塑料的IC包装件。包装件在包装件盖上具有机械的固紧部结构，在施加包覆成型件时，所述固紧部结构与包覆成型件上的固紧部结构形成互补。

Description

具有模制盖连接件的塑料包覆成型的包装件
技术领域
本发明涉及用于集成电路(IC)和相关装置的塑料封装包装件，更具体地涉及需要主动热学管理的塑料封装包装件。
相关申请
本申请与同一日期提交的申请No.(Crispell et al.Case 8-2-60)相关。
背景技术
电子装置例如IC装置上广泛应用的包装形式是塑料外壳。通常，IC芯片被粘结在衬底上并且聚合物被模制在组件上以包覆成型(overmold)所述装置。对于两个或多个IC芯片常见的是组装成单一的包覆成型包装件。多芯片包装件被称为多芯片模件(MCM)。
随着在现有IC技术场合中芯片尺寸的减小，IC包装件过热的问题变得愈加严重。问题进一步加重是因为用于包覆成型的聚合物是性能差的热导体。因而，尽管塑料有效地封装了装置，但其依旧集留了由装置产生的热量。在IC芯片利用引线接合件与包装件的电气终端相连的包装件中，封装物的厚度必须足以容纳引线接合件的高度。这样就导致在装置上形成塑料的厚“盖”。由于在其它一切恒定时，任何给定材料的热阻都随厚度的增加而减小，因此厚度的增加进一步阻碍了热消散。
已经提出并采用多种散热器方案来解决热学管理问题。其中，为具有引线接合IC芯片这一类型的包装件定制的方案是采用与IC芯片顶部相连并形成为嵌入塑料包覆成型件内的导热“烟囱”。该导热烟囱穿过塑料包覆成型件的厚度且穿过烟囱本身而不是塑料包覆成型的材料，从IC芯片上将热量传导至包装件顶部。在一些包装件设计中，烟囱顶部固定于盖。该盖由金属制成，这样可有效地使热量散开并将热量传导到外部环境。在常规设计中，烟囱采用热界面材料(TIM)连接在盖上。尽管对于烟囱结构来讲可以采用任何导热材料，但硅因其与硅芯片的热机相容性、低成本、可用性、与现有IC组件设备的相容性以及良好的导热率而成为优选。
已经确认在这些包装件设计中存在装置失效。对包装件设计的改进需要克服这些失效。
发明内容
我们已经研究了具有烟囱式散热器的IC装置的失效模式并详细确定了失效的原因和影响。这些包装件中两种最常见的失效模式是起因于对总烟囱的机械完整性的破坏：i)由于TIM/盖或者TIM/烟囱界面的破坏而引起的盖对硅烟囱的连接的损失；以及ii)由于烟囱-IC粘合剂/烟囱或烟囱-IC粘合剂/IC装置界面的破坏而导致的硅烟囱对IC装置连接的损失。当这种连接失败时，失去了从IC芯片到外部环境的传热路径。在这些断开的原因中，主要原因是热机应力。当热机应力变得过大时，盖与烟囱分离或者烟囱与IC装置分离。我们已经研究了一种有效的方法以降低热机应力的不利影响，并提高这些IC包装件的热机稳定性。改进包装件设计的关键是认识到盖应该至少部分地与烟囱机械分离，同时保持密切的热连接。这是与通过使烟囱和盖之间形成的接合更机械加固并由此形成更大刚性的方法来解决问题的倾向在直觉上是相逆的。改进基本上依赖于向包覆成型件和盖提供机械结构，使得包覆成型件本身有助于将盖保持在适当位置，从而允许实现部分的机械分离和密切的热连接。
附图说明
当结合附图考虑时将会更清楚地理解本发明，其中：
图1-4是用于制造具有烟囱式散热器的包覆成型IC装置包装件的典型步骤顺序的示意图；
图5和6是在说明书中采用的说明申请人对所述装置失效模式认知的具有四个IC芯片和四个烟囱的MCM包装件的平面图；
图7和8是MCM包装件的侧视图，表示盖与烟囱分离或在烟囱与IC芯片之间的接合上引起失效的断开模式；
图9和10表示改进的包装件设计，其中在盖边缘处采用机械特征有助于使盖连接在包装件上；
图11-13是表示改进的包装件设计的类似图示，其中机械特征遍布盖的面积。
具体实施方式
图1表示包括接合在具有模片连接材料16的衬底11上的IC芯片14的IC芯片包装件。衬底可以是任何适当的衬底材料，但通常是印刷电路板(PCB)。引线接合垫12和13通过已知方式形成在衬底上。参照图2，引线接合件21和22示出使接合的IC芯片14与PCB电连接。在操作过程中多个IC芯片产生大量的热，并需要特定类型的散热以避免过热和失效。例如，微处理器通常是利用现有技术设计准则制成的大型IC芯片并具有非常密集的装置包装。它们具有严重的热学管理问题，并因此通常设有特殊的散热配置。其中之一在图3中示出具有硅烟囱32形式的散热器。在这种类型的包装件中，IC芯片通常安装在PCB上，并且得到引线接合以通电互连。引线接合件与IC芯片上的接合垫(为了表示清楚未示出)的边缘陈列相连。这样在芯片的中心留出了安装硅烟囱的空间。该硅烟囱可以采用适当的连接材料33与IC芯片相连。连接材料包括但不局限于粘合剂、例如环氧树脂或者其它粘合剂聚合物材料或焊料。优选的是，粘合剂材料为导热性粘合剂。许多标准和市售导电性粘合剂也是有效的热导体。
所示实例是模片接合和引线接合装置。备选地可以采用其它形式的IC装置，例如倒焊芯片IC装置。IC芯片通常得到封装，但可以包括裸模片。IC芯片所涉及的意味着包括任意形式。在所示的引线接合实例中，硅烟囱的高度足以容纳引线接合件的高度。烟囱高度可以较高，或者在装置不具有引线接合件的情况下较短。硅烟囱通常被设计成用于引线接合的IC芯片包装件。
参照图4，组件随后被封装在聚合物包覆成型件43中。这样可以保护IC芯片、PCB表面上的印刷电路以及引线连接件。热界面材料(TIM)45随后施加在包覆成型件上，并连接盖41以完成所述装置。TIM用作从硅烟囱32向盖41传热的传导介质，以及用于将盖保持在适当位置的粘合剂。用于本申请的适当的TIM是可以从AblestickCorp得到的Ablebond 2000TR。盖41作为热分散器并将热量横向传导到远离硅烟囱定位的盖的较冷部分，以及向环境或被设计成热消散结构的其它系统进行热传导和辐射。盖由导热材料例如铜构成。盖通常的厚度范围在0.1mm至1.0mm。
图5示意性表示具有如图所示布置在正方形四角的四个IC装置和四个硅烟囱53，54，55，56的MCM51的平面图。该图仅是多种具有更少或更多装置和烟囱的MCM装置构造及配置的一个示例。
烟囱53和54以标称距离a-b为中心距地分隔开。当MCM模件运转，并且在不同操作条件下、例如开和关时热循环，距离a-b将因IC包装件中的多个构件的膨胀/收缩而改变。当盖例如61如图6所示连接在烟囱的顶部时，烟囱的顶部与盖和衬底都相连，使得由总烟囱和烟囱/盖界面承受因任何改变距离a-b的移动而产生的不同应力。例如，如果盖61是铜制的，通常用于这种包装件中的盖的材料，并且包装件承受明显的温度变化，则铜盖将会经受由铜的热膨胀系数Tc所规定的膨胀/收缩。通过通常与确定距离a-b的属性不同的属性确定距离a’-b’。因此，根据在包装件构造中采用的材料的热机属性，在a-b与a’-b’之间的不匹配会在包装件上导致明显的剪应力和弯曲应力。这些往往影响烟囱与盖以及烟囱与IC装置之间的界面。在严重的情况下会导致盖与包装件分开，或者烟囱与IC分开。
分开经常发生在TIM与盖之间。TIM牢固地粘结在硅烟囱上，但不太牢固地粘结在盖上。图7表示在盖71与TIM74之间形成的空间75。
通过平面应变的相异输出以及弯曲力矩产生的应变导致盖失效以及烟囱与IC装置连接失效中的任一种或二者。这些在图8中示出。在盖失效中，图左侧的硅烟囱84相对于图右侧的硅烟囱85升高。该不一致是烟囱或包装件的其它构件膨胀不同的结果。平面应变的输出会足以促使盖81完全或部分与封装物83分离(为了表示清楚该图省去了TIM)。与图8所示相同的平面应变的输出还会在硅烟囱上产生弯曲力矩。直觉上会认识到当盖在图中左侧升高时(其中盖可以与硅烟囱84分离)，其发生倾斜。这就向烟囱85施加了弯曲力矩，并且会促使在33处的连接、也就是烟囱与IC芯片之间的连接失效。
在烟囱散热器与盖之间形成更坚固连接的方法似乎增加了这些构件之间粘合连接的完整性。然而，我们已经发现更有效的办法却正好相反。这些构件之间的刚性连接被发现至少部分地是造成盖失效问题的原因。因此，已经设计了新包装件结构，其中包覆成型件具有有助于盖连接的机械特征。盖具有互补的机械特征。在图1-4所示的包装件设计中，将会认识到如果存在粘合连接失效，则没有任何机械构件可用于将盖固紧(hold-down)在包装件上。机械的盖固紧部是下文描述的设计中的特征。
图9表示沿盖的边缘形成的槽口94。包覆成型件93具有支承在槽口92上以固紧盖91的机械固紧特征94。为了形成这一结构，在施加包覆成型件93之前将盖连接在烟囱上是有效的。然而，这种连接仅需是暂时连接，直至包覆成型件93形成。优选施加在烟囱与盖之间的连接材料是相对较软的导电聚合物。同样优选的是在散热器与盖之间的导电聚合物不是粘结聚合物，或是相对较弱的粘结聚合物。因此，与通常的环氧树脂相比硅树脂是优选的。用于本申请的适当材料是可以从Lord Thermoset得到的Gelease MG 121。
如果需要，可以在所述的盖固紧部之外采用常规的TIM连接盖。在这种情况下将会认识到TIM仅施加在烟囱上，而不像图4所示那样施加在包覆成型件上。实际上，刚刚描述的步骤顺序排除了直接向包覆成型件施加TIM。如果TIM优选在盖与包覆成型件之间的界面上，则可以在将盖连接在烟囱上之前向盖表面施加TIM。
应该指出，对于适应盖、模制化合物、硅烟囱、IC装置、烟囱模片连接件、IC模片连接件以及衬底材料的热机属性的设计，可以不需要TIM以确保通过盖与烟囱的实体接触在烟囱与盖之间形成高热连接的界面。然而，在组装过程中的工序控制会使这些设计不如包括TIM材料的那些设计坚固。
由于在模制步骤中形成盖固紧特征94，因此它们变为包覆成型件的一部分并与包覆成型件的其余部分结合成一体。盖固紧部可以被设计成许多形式，在此仅示出了它们中的几个。在图10中示出了盖固紧部的选择形式，其中盖固紧特征105通过绕盖101中的凹腔侧壁102模制包覆成型件103而形成。应该指出在包覆成型件上的固紧特征在形状上与盖中的固紧特征102互补。
在图9和10所示的实施方式中，沿盖的边缘形成盖固紧部。然而，因上述机械应力而产生的应变同样会发生在盖的中心部。这些应变会在盖的中间引起分离问题。为了增加更大的固紧动力，盖固紧部可以形成在跨越整个盖面积的位置。这些可以被描述为面积陈列的盖固紧部。
在图11中示出了面积陈列的固紧部的一个示例。凹槽112形成在盖11上。当施加封装物123时，其填充凹槽112，从而增大了盖与包覆成型件之间的接触表面面积。应该认识到该图以及在此提供的其它图不是按比例绘制的。为了表示清楚而使特征具有所示的尺寸。实际采用的特征可能更大或更小。
图12中所示的凹槽是V形。可以选择多种形状。例如，凹槽可以是榫槽形、具有凹腔侧壁的V形凹槽、T形、W形等等。
在图12和13中示出了面积陈列的盖固紧部的四个另外的示例。两个图都以两个独立的实施方式表示具有烟囱式散热器的装置。为了方便对它们分组，但它们表示四个不同的装置结构，其中以124，125，134和135表示四个不同的盖固紧特征。以124表示的固紧部是穿过盖121形成的孔。这些孔的功能与榫槽接头类似。在图12中以125表示的固紧部与燕尾形接头的功能类似。在图13中以134和135表示的固紧部类似于铆钉。应该认识到所有这些结构都具有用于有效提供将包装件盖保持在包覆成型件上的力的固紧部。应该显而易见的是示为面积陈列的固紧部的固紧构造可以作为边缘固紧部、也就是沿以上结合图9和10所述的盖边缘的边缘固紧部。
如上所述，遵循本发明的原理可以设计多种结构。这些原理之一是在包覆成型件主体上设置盖固紧部。术语“固紧部”已在上文得到详细描述，并且示出的几种实施方式有助于限定其含义。其指的是在模主体中形成并与模主体一体形成的任何形状，其与包装件的盖的一个或多个结构形状组合，施加力以将盖保持在包装件上。因而，尽管其可能是本领域在前未制定的术语，但在描述本发明时采用该术语是清楚和适当的。
如上所述，盖固紧部包括在盖和包覆成型件中的固紧结构。这些分别在盖和包覆成型件中的固紧结构的形状实质上互补。也就是说，盖中的固紧特征的形状与包覆成型件主体中的固紧特征的形状互补。
如上所述，本发明主要适用于MCM包装件，这往往意味着每个包装件包含N个IC装置，其中N至少是2，每个IC装置具有散热器。
本领域技术人员将会对本发明做出多种另外的改变。基本上依赖于使本领域进步的上述原理和它们的等效理论的所有偏离说明书的具体教导的内容严格地被认为是处于所描述和要求的本发明的范围内。

Claims (18)

1.一种包覆成型MCM IC包装件，包括：
a.衬底，
b.至少两个与衬底相连的半导体IC装置，
c.至少两个散热器，并且散热器与每个IC装置相连，所述散热器具有顶部和底部，所述底部与IC装置相连，
d.用于封装半导体装置和散热器的聚合物包覆成型件，所述包覆成型件利用散热器暴露的顶部形成上表面，所述聚合物包覆成型件在上表面上具有多个盖固紧部，
e.与包覆成型件相连的盖，所述盖具有多个盖固紧部，包覆成型件中的盖固紧部与盖中的盖固紧部接合。
2.如权利要求1所述的包装件，其特征在于，包覆成型件和盖中的盖固紧部的每一个都具有形状，并且包覆成型件中的固紧部的形状与盖中的盖固紧部的形状互补。
3.如权利要求2所述的包装件，其特征在于，所述IC装置利用引线接合件与衬底电连接。
4.如权利要求2所述的包装件，其特征在于，第一导电聚合物选择性地布置在散热器与盖之间。
5.如权利要求4所述的包装件，其特征在于，第二导电聚合物选择性地布置在包覆成型件与盖之间，并且所述第一导电聚合物不同于第二导电聚合物。
6.如权利要求4所述的包装件，其特征在于，第一导电聚合物不是粘结聚合物。
7.如权利要求2所述的包装件，其特征在于，散热器是硅制的。
8.如权利要求2所述的包装件，其特征在于，盖是铜制的。
9.如权利要求2所述的包装件，其特征在于，具有至少四个IC装置。
10.一种用于制造包覆成型MCM IC包装件的方法，包括：
a.将N个半导体IC装置连接在衬底上，其中N至少为2，
b.将N个散热器连接在IC装置上，每个IC装置都设有散热器，所述散热器具有与IC装置相连的底部以及顶部，
c.将盖连接在散热器顶部，所述盖具有多个盖固紧部，
d.模制封装IC装置和散热器的包覆成型件，其中模制包覆成型件的步骤包括形成与包覆成型件一体的多个盖固紧部，所述包覆成型件中的盖固紧部填充所述盖中的盖固紧部。
11.如权利要求10所述的方法，其特征在于，包覆成型件和盖中的盖固紧部的每一个都具有形状，并且包覆成型件中的固紧部的形状与盖中的盖固紧部的形状互补。
12.如权利要求11所述的方法，其特征在于，所述IC装置利用引线接合件与衬底电连接。
13.如权利要求11所述的方法，其特征在于，所述盖利用第一导电聚合物连接在散热器上。
14.如权利要求13所述的方法，其特征在于，在将盖连接在散热器上之前，向盖施加第二导电聚合物，并且第一导电聚合物不同于第二导电聚合物。
15.如权利要求13所述的方法，其特征在于，第一导电聚合物不是粘结聚合物。
16.如权利要求11所述的方法，其特征在于，散热器是硅制的。
17.如权利要求11所述的方法，其特征在于，盖是铜制的。
18.如权利要求11所述的方法，其特征在于，N至少为4。
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JP5121354B2 (ja) 2013-01-16
CN101127348B (zh) 2011-07-13

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