JP5114113B2 - ワークキャリア - Google Patents

ワークキャリア Download PDF

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Publication number
JP5114113B2
JP5114113B2 JP2007173987A JP2007173987A JP5114113B2 JP 5114113 B2 JP5114113 B2 JP 5114113B2 JP 2007173987 A JP2007173987 A JP 2007173987A JP 2007173987 A JP2007173987 A JP 2007173987A JP 5114113 B2 JP5114113 B2 JP 5114113B2
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JP
Japan
Prior art keywords
insert
opening
groove
work
locking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007173987A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009012086A (ja
Inventor
真三 西川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP2007173987A priority Critical patent/JP5114113B2/ja
Priority to TW097121414A priority patent/TW200914199A/zh
Priority to KR1020080057302A priority patent/KR20090004521A/ko
Priority to DE102008030067A priority patent/DE102008030067A1/de
Publication of JP2009012086A publication Critical patent/JP2009012086A/ja
Application granted granted Critical
Publication of JP5114113B2 publication Critical patent/JP5114113B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2007173987A 2007-07-02 2007-07-02 ワークキャリア Active JP5114113B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007173987A JP5114113B2 (ja) 2007-07-02 2007-07-02 ワークキャリア
TW097121414A TW200914199A (en) 2007-07-02 2008-06-09 Workpiece carrier
KR1020080057302A KR20090004521A (ko) 2007-07-02 2008-06-18 워크 캐리어
DE102008030067A DE102008030067A1 (de) 2007-07-02 2008-06-27 Werkstückträger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007173987A JP5114113B2 (ja) 2007-07-02 2007-07-02 ワークキャリア

Publications (2)

Publication Number Publication Date
JP2009012086A JP2009012086A (ja) 2009-01-22
JP5114113B2 true JP5114113B2 (ja) 2013-01-09

Family

ID=40092746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007173987A Active JP5114113B2 (ja) 2007-07-02 2007-07-02 ワークキャリア

Country Status (4)

Country Link
JP (1) JP5114113B2 (enExample)
KR (1) KR20090004521A (enExample)
DE (1) DE102008030067A1 (enExample)
TW (1) TW200914199A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200484471Y1 (ko) * 2017-01-26 2017-09-08 (주)엔티에스엘 반도체 웨이퍼의 연마 공정에 사용되는 캐리어
KR20180012690A (ko) 2016-07-27 2018-02-06 스피드팸 가부시키가이샤 워크 캐리어 및 워크 캐리어의 제조 방법

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010179375A (ja) * 2009-02-03 2010-08-19 Sumco Corp 被研磨物キャリア及び研磨製品の製造方法
JP5452984B2 (ja) * 2009-06-03 2014-03-26 不二越機械工業株式会社 ウェーハの両面研磨方法
JP5233888B2 (ja) * 2009-07-21 2013-07-10 信越半導体株式会社 両面研磨装置用キャリアの製造方法、両面研磨装置用キャリア及びウェーハの両面研磨方法
JP4605564B1 (ja) * 2009-09-28 2011-01-05 株式会社白崎製作所 脆性薄板研磨装置用ホルダ、およびその製造方法
KR101135744B1 (ko) * 2010-09-20 2012-04-16 주식회사 엘지실트론 웨이퍼 수용장치 및 이를 포함하는 웨이퍼 연마장치
JP2012111001A (ja) * 2010-11-25 2012-06-14 Nikon Corp ワークキャリア及び該ワークキャリアを備えた研磨装置
JP5847789B2 (ja) 2013-02-13 2016-01-27 信越半導体株式会社 両面研磨装置用キャリアの製造方法およびウエーハの両面研磨方法
JP6443370B2 (ja) * 2016-03-18 2018-12-26 信越半導体株式会社 両面研磨装置用のキャリアの製造方法およびウェーハの両面研磨方法
JP6800402B2 (ja) * 2016-10-06 2020-12-16 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法
WO2018163721A1 (ja) * 2017-03-06 2018-09-13 信越半導体株式会社 両面研磨装置用キャリア
JP6840639B2 (ja) * 2017-03-06 2021-03-10 信越半導体株式会社 両面研磨装置用キャリア
JP6792106B2 (ja) * 2017-03-30 2020-11-25 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法
JP2019034357A (ja) * 2017-08-10 2019-03-07 住友電工焼結合金株式会社 ワークキャリア、両頭平面研削盤及びワークの両面研磨加工方法
KR101864155B1 (ko) * 2018-01-19 2018-06-04 (주)엔티에스엘 반도체 웨이퍼의 연마 공정에 사용되는 캐리어
JP2020191376A (ja) 2019-05-22 2020-11-26 信越半導体株式会社 両面研磨装置用キャリアおよびその製造方法
KR102199135B1 (ko) * 2019-06-27 2021-01-06 주식회사 이포스 기판 연마용 캐리어 및 이를 포함하는 기판 연마 장치
JP7276246B2 (ja) * 2020-05-19 2023-05-18 信越半導体株式会社 両面研磨装置用キャリアの製造方法及びウェーハの両面研磨方法
JP7565591B2 (ja) * 2021-01-06 2024-10-11 不二越機械工業株式会社 ウェハ研磨用キャリアおよびウェハ研磨装置
CN113510614A (zh) * 2021-08-03 2021-10-19 菲特晶(南京)电子有限公司 一种双面研磨机用游轮结构
CN115071045A (zh) * 2022-06-20 2022-09-20 王达 一种研抛载具的制作方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01114264U (enExample) * 1988-01-29 1989-08-01
JP2000288922A (ja) 1999-03-31 2000-10-17 Hoya Corp 研磨用キャリア及び研磨方法並びに情報記録媒体用基板の製造方法
JP3439726B2 (ja) * 2000-07-10 2003-08-25 住友ベークライト株式会社 被研磨物保持材及びその製造方法
JP2003305637A (ja) 2002-04-15 2003-10-28 Shirasaki Seisakusho:Kk 脆性薄板の研磨用ホルダ
JP2006068895A (ja) 2004-08-02 2006-03-16 Showa Denko Kk 研磨用キャリア及び磁気記録媒体用シリコン基板の製造方法並びに磁気記録媒体用シリコン基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180012690A (ko) 2016-07-27 2018-02-06 스피드팸 가부시키가이샤 워크 캐리어 및 워크 캐리어의 제조 방법
KR200484471Y1 (ko) * 2017-01-26 2017-09-08 (주)엔티에스엘 반도체 웨이퍼의 연마 공정에 사용되는 캐리어

Also Published As

Publication number Publication date
KR20090004521A (ko) 2009-01-12
TWI359719B (enExample) 2012-03-11
JP2009012086A (ja) 2009-01-22
TW200914199A (en) 2009-04-01
DE102008030067A1 (de) 2009-01-08

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