TWI359719B - - Google Patents

Download PDF

Info

Publication number
TWI359719B
TWI359719B TW097121414A TW97121414A TWI359719B TW I359719 B TWI359719 B TW I359719B TW 097121414 A TW097121414 A TW 097121414A TW 97121414 A TW97121414 A TW 97121414A TW I359719 B TWI359719 B TW I359719B
Authority
TW
Taiwan
Prior art keywords
insert
workpiece
opening
carrier
locking groove
Prior art date
Application number
TW097121414A
Other languages
English (en)
Chinese (zh)
Other versions
TW200914199A (en
Inventor
Shinzou Nishikawa
Original Assignee
Speedfam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Co Ltd filed Critical Speedfam Co Ltd
Publication of TW200914199A publication Critical patent/TW200914199A/zh
Application granted granted Critical
Publication of TWI359719B publication Critical patent/TWI359719B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW097121414A 2007-07-02 2008-06-09 Workpiece carrier TW200914199A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007173987A JP5114113B2 (ja) 2007-07-02 2007-07-02 ワークキャリア

Publications (2)

Publication Number Publication Date
TW200914199A TW200914199A (en) 2009-04-01
TWI359719B true TWI359719B (enExample) 2012-03-11

Family

ID=40092746

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097121414A TW200914199A (en) 2007-07-02 2008-06-09 Workpiece carrier

Country Status (4)

Country Link
JP (1) JP5114113B2 (enExample)
KR (1) KR20090004521A (enExample)
DE (1) DE102008030067A1 (enExample)
TW (1) TW200914199A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010179375A (ja) * 2009-02-03 2010-08-19 Sumco Corp 被研磨物キャリア及び研磨製品の製造方法
JP5452984B2 (ja) * 2009-06-03 2014-03-26 不二越機械工業株式会社 ウェーハの両面研磨方法
JP5233888B2 (ja) * 2009-07-21 2013-07-10 信越半導体株式会社 両面研磨装置用キャリアの製造方法、両面研磨装置用キャリア及びウェーハの両面研磨方法
JP4605564B1 (ja) * 2009-09-28 2011-01-05 株式会社白崎製作所 脆性薄板研磨装置用ホルダ、およびその製造方法
KR101135744B1 (ko) * 2010-09-20 2012-04-16 주식회사 엘지실트론 웨이퍼 수용장치 및 이를 포함하는 웨이퍼 연마장치
JP2012111001A (ja) * 2010-11-25 2012-06-14 Nikon Corp ワークキャリア及び該ワークキャリアを備えた研磨装置
JP5847789B2 (ja) 2013-02-13 2016-01-27 信越半導体株式会社 両面研磨装置用キャリアの製造方法およびウエーハの両面研磨方法
JP6443370B2 (ja) * 2016-03-18 2018-12-26 信越半導体株式会社 両面研磨装置用のキャリアの製造方法およびウェーハの両面研磨方法
JP6673772B2 (ja) * 2016-07-27 2020-03-25 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法
JP6800402B2 (ja) * 2016-10-06 2020-12-16 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法
KR200484471Y1 (ko) * 2017-01-26 2017-09-08 (주)엔티에스엘 반도체 웨이퍼의 연마 공정에 사용되는 캐리어
JP6840639B2 (ja) * 2017-03-06 2021-03-10 信越半導体株式会社 両面研磨装置用キャリア
WO2018163721A1 (ja) * 2017-03-06 2018-09-13 信越半導体株式会社 両面研磨装置用キャリア
JP6792106B2 (ja) * 2017-03-30 2020-11-25 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法
JP2019034357A (ja) * 2017-08-10 2019-03-07 住友電工焼結合金株式会社 ワークキャリア、両頭平面研削盤及びワークの両面研磨加工方法
KR101864155B1 (ko) * 2018-01-19 2018-06-04 (주)엔티에스엘 반도체 웨이퍼의 연마 공정에 사용되는 캐리어
JP2020191376A (ja) 2019-05-22 2020-11-26 信越半導体株式会社 両面研磨装置用キャリアおよびその製造方法
KR102199135B1 (ko) * 2019-06-27 2021-01-06 주식회사 이포스 기판 연마용 캐리어 및 이를 포함하는 기판 연마 장치
JP7276246B2 (ja) * 2020-05-19 2023-05-18 信越半導体株式会社 両面研磨装置用キャリアの製造方法及びウェーハの両面研磨方法
JP7565591B2 (ja) * 2021-01-06 2024-10-11 不二越機械工業株式会社 ウェハ研磨用キャリアおよびウェハ研磨装置
CN113510614A (zh) * 2021-08-03 2021-10-19 菲特晶(南京)电子有限公司 一种双面研磨机用游轮结构
CN115071045A (zh) * 2022-06-20 2022-09-20 王达 一种研抛载具的制作方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01114264U (enExample) * 1988-01-29 1989-08-01
JP2000288922A (ja) 1999-03-31 2000-10-17 Hoya Corp 研磨用キャリア及び研磨方法並びに情報記録媒体用基板の製造方法
JP3439726B2 (ja) * 2000-07-10 2003-08-25 住友ベークライト株式会社 被研磨物保持材及びその製造方法
JP2003305637A (ja) 2002-04-15 2003-10-28 Shirasaki Seisakusho:Kk 脆性薄板の研磨用ホルダ
JP2006068895A (ja) 2004-08-02 2006-03-16 Showa Denko Kk 研磨用キャリア及び磁気記録媒体用シリコン基板の製造方法並びに磁気記録媒体用シリコン基板

Also Published As

Publication number Publication date
KR20090004521A (ko) 2009-01-12
JP2009012086A (ja) 2009-01-22
JP5114113B2 (ja) 2013-01-09
TW200914199A (en) 2009-04-01
DE102008030067A1 (de) 2009-01-08

Similar Documents

Publication Publication Date Title
TWI359719B (enExample)
KR101565026B1 (ko) 양면 연마 장치용 캐리어 및 이를 이용한 양면 연마 장치, 및 양면 연마 방법
TWI697383B (zh) 晶圓之兩面研磨方法
TW200819242A (en) Carrier for double side polishing device, and double side polishing device and double side polishing method using the carrier
US20090149118A1 (en) Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method
US20090258587A1 (en) Polishing pad having groove structure for avoiding the polishing surface stripping
US20090247057A1 (en) Polishing platen and polishing apparatus
TWI706456B (zh) 工件遊星輪及工件遊星輪之製造方法
JP2005515904A5 (enExample)
JPH10329013A (ja) 両面研磨及び両面ラッピング用キャリア
CN108687656B (zh) 工件游星轮及工件游星轮的制造方法
US20130316627A1 (en) Wafer carrier for batch wafer polishing in wafer polishing machines
JP5057325B2 (ja) 研磨パッド
US20070141958A1 (en) Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method
JP2003019660A (ja) 両面研磨方法および両面研磨装置
JP6840639B2 (ja) 両面研磨装置用キャリア
JP6800402B2 (ja) ワークキャリア及びワークキャリアの製造方法
KR20210008995A (ko) 기판의 연마 장치용 캐리어 헤드의 리테이너 링
JP4241164B2 (ja) 半導体ウェハ研磨機
CN104379302B (zh) 用于塑料眼镜镜片的抛光薄膜和用于制造这种抛光薄膜的方法
JP2009141384A (ja) ウエハ載置台のクリーニング方法
JP2007083337A (ja) 平面研磨装置
KR20190018312A (ko) 캐리어 및 이를 포함하는 웨이퍼의 양면 연마 장치
JPH11226861A (ja) 研磨布及び平面研磨装置
JP2002066909A (ja) 研磨機用キャリア