JP5099487B2 - 複数梁合成型接触子 - Google Patents

複数梁合成型接触子 Download PDF

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Publication number
JP5099487B2
JP5099487B2 JP2007223232A JP2007223232A JP5099487B2 JP 5099487 B2 JP5099487 B2 JP 5099487B2 JP 2007223232 A JP2007223232 A JP 2007223232A JP 2007223232 A JP2007223232 A JP 2007223232A JP 5099487 B2 JP5099487 B2 JP 5099487B2
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JP
Japan
Prior art keywords
probe
vertical
pad
horizontal beams
vertical probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007223232A
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English (en)
Japanese (ja)
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JP2009036744A (ja
JP2009036744A5 (enExample
Inventor
軍生 木本
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2007223232A priority Critical patent/JP5099487B2/ja
Priority to TW097127695A priority patent/TW200907351A/zh
Priority to KR1020080075285A priority patent/KR20090014107A/ko
Priority to CN2008101348153A priority patent/CN101358998B/zh
Priority to US12/184,617 priority patent/US7808261B2/en
Publication of JP2009036744A publication Critical patent/JP2009036744A/ja
Publication of JP2009036744A5 publication Critical patent/JP2009036744A5/ja
Application granted granted Critical
Publication of JP5099487B2 publication Critical patent/JP5099487B2/ja
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2007223232A 2007-08-03 2007-08-03 複数梁合成型接触子 Expired - Fee Related JP5099487B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007223232A JP5099487B2 (ja) 2007-08-03 2007-08-03 複数梁合成型接触子
TW097127695A TW200907351A (en) 2007-08-03 2008-07-21 Contact with plural beams
KR1020080075285A KR20090014107A (ko) 2007-08-03 2008-07-31 복수의 대들보 합성형 접촉자
CN2008101348153A CN101358998B (zh) 2007-08-03 2008-07-31 复数梁合成型接触端子
US12/184,617 US7808261B2 (en) 2007-08-03 2008-08-01 Contact with plural beams

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007223232A JP5099487B2 (ja) 2007-08-03 2007-08-03 複数梁合成型接触子

Publications (3)

Publication Number Publication Date
JP2009036744A JP2009036744A (ja) 2009-02-19
JP2009036744A5 JP2009036744A5 (enExample) 2010-10-07
JP5099487B2 true JP5099487B2 (ja) 2012-12-19

Family

ID=40331498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007223232A Expired - Fee Related JP5099487B2 (ja) 2007-08-03 2007-08-03 複数梁合成型接触子

Country Status (5)

Country Link
US (1) US7808261B2 (enExample)
JP (1) JP5099487B2 (enExample)
KR (1) KR20090014107A (enExample)
CN (1) CN101358998B (enExample)
TW (1) TW200907351A (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4859820B2 (ja) * 2007-12-05 2012-01-25 東京エレクトロン株式会社 プローブ
JP2011141126A (ja) * 2010-01-05 2011-07-21 Toshiba Corp プローブカード
JP2011242377A (ja) * 2010-05-19 2011-12-01 Kimoto Gunsei プローブ
JP4883215B1 (ja) * 2010-10-29 2012-02-22 オムロン株式会社 端子およびこれを用いたコネクタ
JP4811530B1 (ja) * 2010-11-04 2011-11-09 オムロン株式会社 端子およびこれを用いたコネクタ
JP5083426B2 (ja) * 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
JP5083427B2 (ja) * 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
US9702904B2 (en) * 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
CN104155491A (zh) * 2013-05-13 2014-11-19 木本军生 探针
JP6491409B2 (ja) * 2013-12-27 2019-03-27 富士電機株式会社 接触子及び半導体試験装置
TWI603090B (zh) * 2016-09-06 2017-10-21 Mpi Corp A vertical probe, a method of manufacturing the same, and a probe head and a probe card using the same
DE102017209510A1 (de) * 2017-06-06 2018-12-06 Feinmetall Gmbh Kontaktelementsystem
TWI783074B (zh) * 2017-11-09 2022-11-11 義大利商探針科技公司 用於測試高頻裝置的測試頭的接觸探針
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12181493B2 (en) 2018-10-26 2024-12-31 Microfabrica Inc. Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
JP2021028603A (ja) 2019-08-09 2021-02-25 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
US12196781B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US12196782B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
CN111579835B (zh) * 2020-05-18 2023-05-16 武汉精毅通电子技术有限公司 一种适用于大电流高速信号测试的探针及连接器
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
CN112147380A (zh) * 2020-09-03 2020-12-29 渭南高新区木王科技有限公司 一种弹片针
US12146898B2 (en) 2020-10-02 2024-11-19 Microfabrica Inc. Multi-beam probes with decoupled structural and current carrying beams and methods of making
US12038458B2 (en) * 2021-03-24 2024-07-16 Samsung Electronics Co., Ltd. Probe for testing a semiconductor device and a probe card including the same
JP2022176778A (ja) * 2021-05-17 2022-11-30 株式会社片岡製作所 充放電検査装置
CN114200278B (zh) * 2021-11-29 2022-12-27 强一半导体（苏州）有限公司 一种薄膜探针卡及其探针头

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618821A (en) * 1983-09-19 1986-10-21 Lenz Seymour S Test probe assembly for microelectronic circuits
US5599194A (en) * 1992-08-18 1997-02-04 Enplas Corporation IC socket and its contact pin
JP3762444B2 (ja) * 1993-08-24 2006-04-05 信昭 鈴木 回路基板の検査用プローブとその取付構造
KR100212169B1 (ko) * 1996-02-13 1999-08-02 오쿠보 마사오 프로브, 프로브의 제조, 그리고 프로브를 사용한 수직동작형 프로브 카드 어셈블리
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
US7063541B2 (en) * 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
US6127832A (en) * 1998-01-06 2000-10-03 International Business Machines Corporation Electrical test tool having easily replaceable electrical probe
JP3346279B2 (ja) * 1998-05-18 2002-11-18 三菱マテリアル株式会社 コンタクトプローブおよびそれを備えたプローブ装置並びにコンタクトプローブの製造方法
JP2000338133A (ja) * 1999-05-31 2000-12-08 Isao Kimoto 接触子
JP4579361B2 (ja) * 1999-09-24 2010-11-10 軍生 木本 接触子組立体
US7254889B1 (en) * 2000-09-08 2007-08-14 Gabe Cherian Interconnection devices
US20040051541A1 (en) * 2002-09-04 2004-03-18 Yu Zhou Contact structure with flexible cable and probe contact assembly using same
SG124273A1 (en) * 2004-03-08 2006-08-30 Tan Yin Leong Non-abrasive electrical test contact
JP4021457B2 (ja) * 2003-07-29 2007-12-12 株式会社アドバンテスト ソケット、及び試験装置
TWI286606B (en) * 2004-03-16 2007-09-11 Gunsei Kimoto Electric signal connecting device, and probe assembly and prober device using it
JP4571511B2 (ja) * 2005-01-07 2010-10-27 株式会社日本マイクロニクス 通電試験用プローブ
TWI398640B (zh) * 2005-09-19 2013-06-11 Gunsei Kimoto Contact assembly and its LSI wafer inspection device
TWI397696B (zh) * 2006-02-19 2013-06-01 Gunsei Kimoto Probe assembly
JP4522975B2 (ja) * 2006-06-19 2010-08-11 東京エレクトロン株式会社 プローブカード
JP5077735B2 (ja) * 2006-08-07 2012-11-21 軍生 木本 複数梁合成型接触子組立
JP2008122356A (ja) * 2006-10-18 2008-05-29 Isao Kimoto プローブ
JP5030060B2 (ja) * 2007-08-01 2012-09-19 軍生 木本 電気信号接続装置

Also Published As

Publication number Publication date
US7808261B2 (en) 2010-10-05
CN101358998B (zh) 2011-10-05
CN101358998A (zh) 2009-02-04
TW200907351A (en) 2009-02-16
KR20090014107A (ko) 2009-02-06
JP2009036744A (ja) 2009-02-19
US20090045831A1 (en) 2009-02-19
TWI375035B (enExample) 2012-10-21

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