CN101358998B - 复数梁合成型接触端子 - Google Patents

复数梁合成型接触端子 Download PDF

Info

Publication number
CN101358998B
CN101358998B CN2008101348153A CN200810134815A CN101358998B CN 101358998 B CN101358998 B CN 101358998B CN 2008101348153 A CN2008101348153 A CN 2008101348153A CN 200810134815 A CN200810134815 A CN 200810134815A CN 101358998 B CN101358998 B CN 101358998B
Authority
CN
China
Prior art keywords
probe
vertical
horizontal beams
contact
weld pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101348153A
Other languages
English (en)
Chinese (zh)
Other versions
CN101358998A (zh
Inventor
木本军生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CN101358998A publication Critical patent/CN101358998A/zh
Application granted granted Critical
Publication of CN101358998B publication Critical patent/CN101358998B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN2008101348153A 2007-08-03 2008-07-31 复数梁合成型接触端子 Expired - Fee Related CN101358998B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-223232 2007-08-03
JP2007223232A JP5099487B2 (ja) 2007-08-03 2007-08-03 複数梁合成型接触子
JP2007223232 2007-08-03

Publications (2)

Publication Number Publication Date
CN101358998A CN101358998A (zh) 2009-02-04
CN101358998B true CN101358998B (zh) 2011-10-05

Family

ID=40331498

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101348153A Expired - Fee Related CN101358998B (zh) 2007-08-03 2008-07-31 复数梁合成型接触端子

Country Status (5)

Country Link
US (1) US7808261B2 (enExample)
JP (1) JP5099487B2 (enExample)
KR (1) KR20090014107A (enExample)
CN (1) CN101358998B (enExample)
TW (1) TW200907351A (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4859820B2 (ja) * 2007-12-05 2012-01-25 東京エレクトロン株式会社 プローブ
JP2011141126A (ja) * 2010-01-05 2011-07-21 Toshiba Corp プローブカード
JP2011242377A (ja) * 2010-05-19 2011-12-01 Kimoto Gunsei プローブ
JP4883215B1 (ja) * 2010-10-29 2012-02-22 オムロン株式会社 端子およびこれを用いたコネクタ
JP4811530B1 (ja) * 2010-11-04 2011-11-09 オムロン株式会社 端子およびこれを用いたコネクタ
JP5083427B2 (ja) 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
JP5083426B2 (ja) * 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
US9702904B2 (en) 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
CN104155491A (zh) * 2013-05-13 2014-11-19 木本军生 探针
JP6491409B2 (ja) * 2013-12-27 2019-03-27 富士電機株式会社 接触子及び半導体試験装置
TWI603090B (zh) * 2016-09-06 2017-10-21 Mpi Corp A vertical probe, a method of manufacturing the same, and a probe head and a probe card using the same
DE102017209510A1 (de) * 2017-06-06 2018-12-06 Feinmetall Gmbh Kontaktelementsystem
TWI783074B (zh) * 2017-11-09 2022-11-11 義大利商探針科技公司 用於測試高頻裝置的測試頭的接觸探針
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12181493B2 (en) 2018-10-26 2024-12-31 Microfabrica Inc. Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
JP2021028603A (ja) * 2019-08-09 2021-02-25 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
US11802891B1 (en) 2019-12-31 2023-10-31 Microfabrica Inc. Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US12196781B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US12196782B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
CN111579835B (zh) * 2020-05-18 2023-05-16 武汉精毅通电子技术有限公司 一种适用于大电流高速信号测试的探针及连接器
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
CN112147380A (zh) * 2020-09-03 2020-12-29 渭南高新区木王科技有限公司 一种弹片针
US12146898B2 (en) 2020-10-02 2024-11-19 Microfabrica Inc. Multi-beam probes with decoupled structural and current carrying beams and methods of making
US12038458B2 (en) * 2021-03-24 2024-07-16 Samsung Electronics Co., Ltd. Probe for testing a semiconductor device and a probe card including the same
JP2022176778A (ja) * 2021-05-17 2022-11-30 株式会社片岡製作所 充放電検査装置
CN114200278B (zh) * 2021-11-29 2022-12-27 强一半导体（苏州）有限公司 一种薄膜探针卡及其探针头

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618821A (en) * 1983-09-19 1986-10-21 Lenz Seymour S Test probe assembly for microelectronic circuits
CN1936596A (zh) * 2005-09-19 2007-03-28 木本军生 接点组装体及其lsi芯片检查装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5599194A (en) * 1992-08-18 1997-02-04 Enplas Corporation IC socket and its contact pin
JP3762444B2 (ja) * 1993-08-24 2006-04-05 信昭 鈴木 回路基板の検査用プローブとその取付構造
KR100212169B1 (ko) * 1996-02-13 1999-08-02 오쿠보 마사오 프로브, 프로브의 제조, 그리고 프로브를 사용한 수직동작형 프로브 카드 어셈블리
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
US7063541B2 (en) * 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
US6127832A (en) * 1998-01-06 2000-10-03 International Business Machines Corporation Electrical test tool having easily replaceable electrical probe
JP3346279B2 (ja) * 1998-05-18 2002-11-18 三菱マテリアル株式会社 コンタクトプローブおよびそれを備えたプローブ装置並びにコンタクトプローブの製造方法
JP2000338133A (ja) * 1999-05-31 2000-12-08 Isao Kimoto 接触子
JP4579361B2 (ja) * 1999-09-24 2010-11-10 軍生 木本 接触子組立体
US7254889B1 (en) * 2000-09-08 2007-08-14 Gabe Cherian Interconnection devices
US20040051541A1 (en) * 2002-09-04 2004-03-18 Yu Zhou Contact structure with flexible cable and probe contact assembly using same
SG124273A1 (en) * 2004-03-08 2006-08-30 Tan Yin Leong Non-abrasive electrical test contact
EP1650837A4 (en) * 2003-07-29 2007-12-26 Advantest Corp BASE AND TEST UNIT
TWI286606B (en) * 2004-03-16 2007-09-11 Gunsei Kimoto Electric signal connecting device, and probe assembly and prober device using it
JP4571511B2 (ja) * 2005-01-07 2010-10-27 株式会社日本マイクロニクス 通電試験用プローブ
TWI397696B (zh) * 2006-02-19 2013-06-01 Gunsei Kimoto Probe assembly
JP4522975B2 (ja) * 2006-06-19 2010-08-11 東京エレクトロン株式会社 プローブカード
JP5077735B2 (ja) * 2006-08-07 2012-11-21 軍生 木本 複数梁合成型接触子組立
JP2008122356A (ja) * 2006-10-18 2008-05-29 Isao Kimoto プローブ
JP5030060B2 (ja) * 2007-08-01 2012-09-19 軍生 木本 電気信号接続装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618821A (en) * 1983-09-19 1986-10-21 Lenz Seymour S Test probe assembly for microelectronic circuits
CN1936596A (zh) * 2005-09-19 2007-03-28 木本军生 接点组装体及其lsi芯片检查装置

Also Published As

Publication number Publication date
JP5099487B2 (ja) 2012-12-19
KR20090014107A (ko) 2009-02-06
TW200907351A (en) 2009-02-16
CN101358998A (zh) 2009-02-04
US20090045831A1 (en) 2009-02-19
TWI375035B (enExample) 2012-10-21
US7808261B2 (en) 2010-10-05
JP2009036744A (ja) 2009-02-19

Similar Documents

Publication Publication Date Title
CN101358998B (zh) 复数梁合成型接触端子
CN101165494B (zh) 探针
US6771084B2 (en) Single-sided compliant probe apparatus
TWI425215B (zh) A probe card, a semiconductor inspection apparatus, and a semiconductor device
US8347720B2 (en) MEMS tunneling accelerometer
US7733101B2 (en) Knee probe having increased scrub motion
US6774654B2 (en) Semiconductor-device inspecting apparatus and a method for manufacturing the same
TW200804814A (en) Capacitive sensor
CN101261287B (zh) 探针组装体
US20110285417A1 (en) Probe
WO2003062837A1 (fr) Carte sonde
CN101358999B (zh) 探针组合体
JP2009521696A (ja) 半導体検査用プローブカード
KR101525238B1 (ko) 프로브 구조체
WO2018089659A1 (en) Probe card assembly having die-level and pin-level compliance, and associated systems and methods
US7511524B1 (en) Contact tip structure of a connecting element
KR102745939B1 (ko) 다층 구조를 갖는 캔틸레버 타입의 프로브 핀 및 이를 제조하는 방법
CN103134961A (zh) 探针卡
EP2770332A1 (en) Contact probe
JP6373011B2 (ja) プローブカード
KR100638105B1 (ko) 수직형 프로브
Lai et al. A claw type of MEMS probe card for the electrical testing of micro-solder ball
Hsu et al. Design and fabrication of anisotropic conductive film for application of probe card
JP3218484U (ja) 弾力のあるプローブ装置
JPH10148646A (ja) コンタクター及びその製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111005

Termination date: 20140731

EXPY Termination of patent right or utility model