JP5094834B2 - 銅箔の製造方法、銅箔及び銅張積層板 - Google Patents

銅箔の製造方法、銅箔及び銅張積層板 Download PDF

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Publication number
JP5094834B2
JP5094834B2 JP2009297461A JP2009297461A JP5094834B2 JP 5094834 B2 JP5094834 B2 JP 5094834B2 JP 2009297461 A JP2009297461 A JP 2009297461A JP 2009297461 A JP2009297461 A JP 2009297461A JP 5094834 B2 JP5094834 B2 JP 5094834B2
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Prior art keywords
copper
copper foil
less
oil film
oxygen
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JP2009297461A
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Japanese (ja)
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JP2011136357A5 (ja
JP2011136357A (ja
Inventor
嘉一郎 中室
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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Priority to JP2009297461A priority Critical patent/JP5094834B2/ja
Priority to KR1020127016529A priority patent/KR101396214B1/ko
Priority to PCT/JP2010/072852 priority patent/WO2011081044A1/ja
Priority to CN201080059783.0A priority patent/CN102655956B/zh
Priority to TW099146067A priority patent/TWI402165B/zh
Publication of JP2011136357A publication Critical patent/JP2011136357A/ja
Publication of JP2011136357A5 publication Critical patent/JP2011136357A5/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/02Alloys based on copper with tin as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metal Rolling (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
JP2009297461A 2009-12-28 2009-12-28 銅箔の製造方法、銅箔及び銅張積層板 Active JP5094834B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009297461A JP5094834B2 (ja) 2009-12-28 2009-12-28 銅箔の製造方法、銅箔及び銅張積層板
KR1020127016529A KR101396214B1 (ko) 2009-12-28 2010-12-20 동박 및 그것을 사용한 동장 적층판
PCT/JP2010/072852 WO2011081044A1 (ja) 2009-12-28 2010-12-20 銅箔及びそれを用いた銅張積層板
CN201080059783.0A CN102655956B (zh) 2009-12-28 2010-12-20 铜箔及使用其而成的覆铜层叠板
TW099146067A TWI402165B (zh) 2009-12-28 2010-12-27 Copper foil and the use of its copper clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009297461A JP5094834B2 (ja) 2009-12-28 2009-12-28 銅箔の製造方法、銅箔及び銅張積層板

Publications (3)

Publication Number Publication Date
JP2011136357A JP2011136357A (ja) 2011-07-14
JP2011136357A5 JP2011136357A5 (ja) 2012-03-22
JP5094834B2 true JP5094834B2 (ja) 2012-12-12

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ID=44226453

Family Applications (1)

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JP2009297461A Active JP5094834B2 (ja) 2009-12-28 2009-12-28 銅箔の製造方法、銅箔及び銅張積層板

Country Status (5)

Country Link
JP (1) JP5094834B2 (ko)
KR (1) KR101396214B1 (ko)
CN (1) CN102655956B (ko)
TW (1) TWI402165B (ko)
WO (1) WO2011081044A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104755979A (zh) * 2012-10-24 2015-07-01 Jx日矿日石金属株式会社 照相机模块和钛铜箔

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822669B2 (ja) 2011-02-18 2015-11-24 Jx日鉱日石金属株式会社 グラフェン製造用銅箔及びそれを用いたグラフェンの製造方法
JP5850720B2 (ja) 2011-06-02 2016-02-03 Jx日鉱日石金属株式会社 グラフェン製造用銅箔、及びグラフェンの製造方法
JP5752536B2 (ja) * 2011-08-23 2015-07-22 Jx日鉱日石金属株式会社 圧延銅箔
JP5676401B2 (ja) * 2011-09-21 2015-02-25 Jx日鉱日石金属株式会社 フレキシブルプリント配線板用銅箔
JP5679580B2 (ja) * 2011-11-07 2015-03-04 Jx日鉱日石金属株式会社 圧延銅箔
JP5721609B2 (ja) * 2011-11-15 2015-05-20 Jx日鉱日石金属株式会社 グラフェン製造用銅箔、及びグラフェンの製造方法
JP5650099B2 (ja) * 2011-11-22 2015-01-07 Jx日鉱日石金属株式会社 超電導膜形成用圧延銅箔
KR101540508B1 (ko) * 2012-02-28 2015-07-29 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 압연 구리박
JP5546571B2 (ja) * 2012-03-29 2014-07-09 Jx日鉱日石金属株式会社 銅箔、銅張積層体、フレキシブル配線板及び立体成型体
JP5826160B2 (ja) * 2012-04-10 2015-12-02 Jx日鉱日石金属株式会社 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法
JP5298225B1 (ja) * 2012-06-29 2013-09-25 Jx日鉱日石金属株式会社 圧延銅箔及びその製造方法、並びに、積層板
JP5261595B1 (ja) * 2012-06-29 2013-08-14 Jx日鉱日石金属株式会社 圧延銅箔及びその製造方法、並びに、積層板
JP5723849B2 (ja) * 2012-07-19 2015-05-27 Jx日鉱日石金属株式会社 高強度チタン銅箔及びその製造方法
JP5882932B2 (ja) * 2012-11-06 2016-03-09 Jx金属株式会社 圧延銅箔、表面処理銅箔及び積層板
JP6206195B2 (ja) * 2014-01-10 2017-10-04 東レ株式会社 複合体、複合体にシーラント層を積層した構成体。
JP6078024B2 (ja) 2014-06-13 2017-02-08 Jx金属株式会社 2次元六角形格子化合物製造用圧延銅箔、及び2次元六角形格子化合物の製造方法
JP2016036829A (ja) * 2014-08-07 2016-03-22 Jx日鉱日石金属株式会社 圧延銅箔及びそれを用いた二次電池用集電体
JP6612168B2 (ja) * 2016-03-30 2019-11-27 Jx金属株式会社 銅箔、銅張積層板、並びにフレキシブルプリント基板及び電子機器
JP6647253B2 (ja) * 2017-08-03 2020-02-14 Jx金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
JP6790153B2 (ja) * 2019-03-04 2020-11-25 Jx金属株式会社 二次電池負極集電体用圧延銅箔、それを用いた二次電池負極集電体及び二次電池並びに二次電池負極集電体用圧延銅箔の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362728A (ja) * 1986-09-03 1988-03-19 昭和アルミニウム株式会社 冷間成形性に優れた樹脂・アルミニウム複合材
JP3009383B2 (ja) * 1998-03-31 2000-02-14 日鉱金属株式会社 圧延銅箔およびその製造方法
JP3856582B2 (ja) * 1998-11-17 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP3797882B2 (ja) * 2001-03-09 2006-07-19 株式会社神戸製鋼所 曲げ加工性が優れた銅合金板
TWI263461B (en) * 2003-12-26 2006-10-01 Ind Tech Res Inst Enhanced flexible copper foil structure and fabrication method thereof
JP4401998B2 (ja) * 2005-03-31 2010-01-20 日鉱金属株式会社 銅張積層基板用高光沢圧延銅箔及びその製造方法
JP4522972B2 (ja) * 2005-04-28 2010-08-11 日鉱金属株式会社 銅張積層基板用高光沢圧延銅箔
JP4224082B2 (ja) * 2006-06-13 2009-02-12 三井金属鉱業株式会社 フレキシブルプリント配線基板および半導体装置
JP5320638B2 (ja) * 2008-01-08 2013-10-23 株式会社Shカッパープロダクツ 圧延銅箔およびその製造方法
JP2009280855A (ja) * 2008-05-21 2009-12-03 Hitachi Cable Ltd 圧延銅箔及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104755979A (zh) * 2012-10-24 2015-07-01 Jx日矿日石金属株式会社 照相机模块和钛铜箔
CN104755979B (zh) * 2012-10-24 2017-06-13 Jx日矿日石金属株式会社 照相机模块和钛铜箔

Also Published As

Publication number Publication date
TW201124269A (en) 2011-07-16
WO2011081044A1 (ja) 2011-07-07
KR20120086740A (ko) 2012-08-03
CN102655956B (zh) 2014-11-26
TWI402165B (zh) 2013-07-21
JP2011136357A (ja) 2011-07-14
KR101396214B1 (ko) 2014-05-19
CN102655956A (zh) 2012-09-05

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