JP5091916B2 - 配線基板及び半導体装置 - Google Patents

配線基板及び半導体装置 Download PDF

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Publication number
JP5091916B2
JP5091916B2 JP2009138835A JP2009138835A JP5091916B2 JP 5091916 B2 JP5091916 B2 JP 5091916B2 JP 2009138835 A JP2009138835 A JP 2009138835A JP 2009138835 A JP2009138835 A JP 2009138835A JP 5091916 B2 JP5091916 B2 JP 5091916B2
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JP
Japan
Prior art keywords
wiring
solder
pad
wiring pattern
substrate body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009138835A
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English (en)
Japanese (ja)
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JP2010287646A (ja
JP2010287646A5 (https=
Inventor
太 塚田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009138835A priority Critical patent/JP5091916B2/ja
Publication of JP2010287646A publication Critical patent/JP2010287646A/ja
Publication of JP2010287646A5 publication Critical patent/JP2010287646A5/ja
Application granted granted Critical
Publication of JP5091916B2 publication Critical patent/JP5091916B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP2009138835A 2009-06-10 2009-06-10 配線基板及び半導体装置 Expired - Fee Related JP5091916B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009138835A JP5091916B2 (ja) 2009-06-10 2009-06-10 配線基板及び半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009138835A JP5091916B2 (ja) 2009-06-10 2009-06-10 配線基板及び半導体装置

Publications (3)

Publication Number Publication Date
JP2010287646A JP2010287646A (ja) 2010-12-24
JP2010287646A5 JP2010287646A5 (https=) 2012-06-07
JP5091916B2 true JP5091916B2 (ja) 2012-12-05

Family

ID=43543154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009138835A Expired - Fee Related JP5091916B2 (ja) 2009-06-10 2009-06-10 配線基板及び半導体装置

Country Status (1)

Country Link
JP (1) JP5091916B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101740878B1 (ko) * 2011-03-22 2017-05-26 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치
JP2013236039A (ja) * 2012-05-11 2013-11-21 Renesas Electronics Corp 半導体装置
JP6251828B2 (ja) * 2017-01-30 2017-12-20 ルネサスエレクトロニクス株式会社 半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04255291A (ja) * 1991-02-07 1992-09-10 Nec Corp 印刷配線板
JP4150511B2 (ja) * 2001-05-16 2008-09-17 株式会社日立製作所 半導体レ−ザ装置
JP3877642B2 (ja) * 2002-05-21 2007-02-07 ローム株式会社 半導体チップを使用した半導体装置
JP2008047761A (ja) * 2006-08-18 2008-02-28 Ricoh Printing Systems Ltd 半導体レーザ装置
JP2008060159A (ja) * 2006-08-29 2008-03-13 Renesas Technology Corp 半導体装置およびその製造方法
JP5018155B2 (ja) * 2007-03-16 2012-09-05 富士通セミコンダクター株式会社 配線基板、電子部品の実装構造、及び半導体装置
JP2009105139A (ja) * 2007-10-22 2009-05-14 Shinko Electric Ind Co Ltd 配線基板及びその製造方法と半導体装置

Also Published As

Publication number Publication date
JP2010287646A (ja) 2010-12-24

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