JP5075611B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5075611B2
JP5075611B2 JP2007329505A JP2007329505A JP5075611B2 JP 5075611 B2 JP5075611 B2 JP 5075611B2 JP 2007329505 A JP2007329505 A JP 2007329505A JP 2007329505 A JP2007329505 A JP 2007329505A JP 5075611 B2 JP5075611 B2 JP 5075611B2
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JP
Japan
Prior art keywords
resin layer
semiconductor device
sealing resin
metal post
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007329505A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009152423A5 (https=
JP2009152423A (ja
Inventor
晋吾 樋口
弘守 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2007329505A priority Critical patent/JP5075611B2/ja
Priority to US12/339,218 priority patent/US7928583B2/en
Publication of JP2009152423A publication Critical patent/JP2009152423A/ja
Publication of JP2009152423A5 publication Critical patent/JP2009152423A5/ja
Application granted granted Critical
Publication of JP5075611B2 publication Critical patent/JP5075611B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/283—Reinforcing structures, e.g. bump collars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2007329505A 2007-12-21 2007-12-21 半導体装置 Expired - Fee Related JP5075611B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007329505A JP5075611B2 (ja) 2007-12-21 2007-12-21 半導体装置
US12/339,218 US7928583B2 (en) 2007-12-21 2008-12-19 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007329505A JP5075611B2 (ja) 2007-12-21 2007-12-21 半導体装置

Publications (3)

Publication Number Publication Date
JP2009152423A JP2009152423A (ja) 2009-07-09
JP2009152423A5 JP2009152423A5 (https=) 2010-12-09
JP5075611B2 true JP5075611B2 (ja) 2012-11-21

Family

ID=40787634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007329505A Expired - Fee Related JP5075611B2 (ja) 2007-12-21 2007-12-21 半導体装置

Country Status (2)

Country Link
US (1) US7928583B2 (https=)
JP (1) JP5075611B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9524945B2 (en) 2010-05-18 2016-12-20 Taiwan Semiconductor Manufacturing Company, Ltd. Cu pillar bump with L-shaped non-metal sidewall protection structure
US8198133B2 (en) * 2009-07-13 2012-06-12 International Business Machines Corporation Structures and methods to improve lead-free C4 interconnect reliability
US8766438B2 (en) * 2009-09-01 2014-07-01 Advanpack Solutions Pte Ltd. Package structure
JP5226639B2 (ja) * 2009-10-09 2013-07-03 株式会社テラミクロス 半導体装置およびその製造方法
JP2010268010A (ja) * 2010-08-31 2010-11-25 Sony Chemical & Information Device Corp 電子部品、並びに、接合体及びその製造方法
JP5966330B2 (ja) * 2011-11-24 2016-08-10 ローム株式会社 半導体チップおよび半導体パッケージ
US9627290B2 (en) * 2011-12-07 2017-04-18 Taiwan Semiconductor Manufacturing Company, Ltd. Bump structure design for stress reduction
US9159686B2 (en) * 2012-01-24 2015-10-13 Taiwan Semiconductor Manufacturing Company, Ltd. Crack stopper on under-bump metallization layer
JP6182309B2 (ja) * 2012-11-28 2017-08-16 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP7157783B2 (ja) * 2020-09-07 2022-10-20 富士電機株式会社 半導体モジュールの製造方法及び半導体モジュール

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3496569B2 (ja) * 1999-04-23 2004-02-16 カシオ計算機株式会社 半導体装置及びその製造方法並びにその実装構造
JP3450238B2 (ja) * 1999-11-04 2003-09-22 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
JP2001339012A (ja) * 2000-05-30 2001-12-07 Nec Kyushu Ltd 半導体装置およびその製造方法
JP3998564B2 (ja) 2002-11-13 2007-10-31 株式会社巴川製紙所 半導体封止用硬化性接着剤組成物および接着シート
JP4360873B2 (ja) * 2003-09-18 2009-11-11 ミナミ株式会社 ウエハレベルｃｓｐの製造方法
US7294929B2 (en) * 2003-12-30 2007-11-13 Texas Instruments Incorporated Solder ball pad structure
TWI295498B (en) * 2005-09-30 2008-04-01 Siliconware Precision Industries Co Ltd Semiconductor element with conductive bumps and fabrication method thereof

Also Published As

Publication number Publication date
JP2009152423A (ja) 2009-07-09
US20090160063A1 (en) 2009-06-25
US7928583B2 (en) 2011-04-19

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