JP5074549B2 - 回路基板およびその製造方法 - Google Patents
回路基板およびその製造方法 Download PDFInfo
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- JP5074549B2 JP5074549B2 JP2010081079A JP2010081079A JP5074549B2 JP 5074549 B2 JP5074549 B2 JP 5074549B2 JP 2010081079 A JP2010081079 A JP 2010081079A JP 2010081079 A JP2010081079 A JP 2010081079A JP 5074549 B2 JP5074549 B2 JP 5074549B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Description
Claims (11)
- 脱膜領域が設けられた回路基板であって、前記回路基板は、
第1誘電体層と、
前記第1誘電体層の前記脱膜領域に向いた第1主面上に配置されているとともに前記脱膜領域の周縁部に位置している第1レーザーレジスト構造と、
前記第1誘電体層の上に配置されているとともに前記第1レーザーレジスト構造を被覆している第2誘電体層と、
前記第2誘電体層の前記脱膜領域に向いた第2主面上に少なくとも1個の切欠きを有する環状構造体として配置されているとともに前記脱膜領域の前記周縁部に位置した第2レーザーレジスト構造と、
前記第2主面上に配置されている回路層であって、前記第2レーザーレジスト構造とは絶縁状態であり、その一部は前記第2レーザーレジスト構造の切欠きを通して前記脱膜領域の外側から脱膜領域の内側まで延びている回路層と、
前記第2主面上に配置されているとともに前記脱膜領域の前記周縁部に位置しており、前記回路層の一部とは接続されているが前記第2レーザーレジスト構造とは絶縁状態にある第3レーザーレジスト構造と、
前記第2誘電体層上に配置されているとともに前記脱膜領域に一致して開口が設けられている第3誘電体層と、
前記第2レジスト構造と前記第3レジスト構造との間に形成された少なくとも1つの空隙とを備えており、前記回路層は前記第2レーザーレジスト構造の前記切欠きから前記脱膜領域の内部まで延在し、前記開口は脱膜領域の範囲内に位置している前記回路層の一部を露出させ、前記第3誘電体層は前記第2レーザーレジスト構造の一部を被覆し、前記第1主面の真上の前記空隙の垂直方向投射部が前記第1レーザーレジスト構造に重畳していることを特徴とする、回路基板。 - 前記第2レーザーレジスト構造と前記回路層との間に多数の空隙が存在している場合には、前記第1レーザーレジスト構造には複数の点構造が互いに無関係に設けられていることを特徴とする、請求項1に記載の回路基板。
- 前記第1レーザーレジスト構造として帯状構造または環状構造があり、前記帯状構造または環状構造は前記第1主面上の前記第2レーザーレジスト構造の垂直方向投射部に重畳していることを特徴とする、請求項1または2に記載の回路基板。
- 前記第2誘電体層は前記空隙の真下の位置に少なくとも1個の空洞が設けられており、前記空洞は前記第1レーザーレジスト構造を露出させていることを特徴とする、請求項1から請求項3のいずれかに記載の回路基板。
- 前記脱膜領域の内側に位置している回路層の前記一部を被覆している保護層を更に備えている、請求項1から請求項4のいずれかに記載の回路基板。
- 前記開口は前記脱膜領域の内側に位置している前記第2レーザーレジスト構造の一部を露出させていることを特徴とする、請求項1から請求項5のいずれかに記載の回路基板。
- 回路基板の製造方法であって、前記方法は、
(I)予備脱膜領域が設けられた基板を準備する工程であって、
(i)第1誘電体層と、
(ii)前記第1誘電体層の前記予備脱膜領域に向いた第1主面上に配置されているとともに前記予備脱膜領域の周縁部に位置している第1レーザーレジスト構造と、
(iii)前記第1誘電体層の上に配置されているとともに前記第1レーザーレジスト構造を被覆している第2誘電体層と、
(iv)前記第2誘電体層の前記脱膜領域に向いた第2主面上に少なくとも1個の切欠きを有する環状構造体として配置されているとともに前記予備脱膜領域の前記周縁部に位置した第2レーザーレジスト構造と、
(v)前記第2主面上に配置されている回路層であって、前記第2レーザーレジスト構造とは絶縁状態であり、その一部は前記第2レーザーレジスト構造の切欠きを通して前記予備脱膜領域の外側から予備脱膜領域の内側まで延びている回路層と、
(vi)前記第2主面上に配置されているとともに予備脱膜領域の前記周縁部に位置しており、前記回路層の一部とは接続されているが前記第2レーザーレジスト構造とは絶縁状態にある第3レーザーレジスト構造と、
(vii)前記第2誘電体層上に配置されているとともに前記回路層および前記第2レーザーレジスト構造を被覆している第3誘電体層と、
(viii)前記第2レジスト構造と前記第3レジスト構造との間に形成された少なくとも1つの空隙とを備え、前記第1主面の真上の前記空隙の垂直方向投射部が前記第1レーザーレジスト構造に重畳している基板を準備する工程と、
(II)予備脱膜領域の前記周縁部に位置している前記第3誘電体層をエッチングするようにレーザー加工プロセスを実施する工程と、
(III)前記予備脱膜領域の範囲内に位置している前記第3誘電体層の一部を除去する工程とを含んでいる、回路基板の製造方法。 - 前記レーザー加工プロセスは前記空隙の真下に位置している前記第2誘電体層の一部をエッチングする工程を更に含んでいることを特徴とする、請求項7に記載の製造方法。
- 前記第1レーザーレジスト構造として帯状構造または環状構造があり、前記帯状構造または環状構造は前記第1主面上の前記第2レーザーレジスト構造の垂直方向投射部に重畳していることを特徴とする、請求項7または8に記載の製造方法。
- 前記基板は保護層を更に備えており、前記保護層は前記予備脱膜領域の範囲内に位置し
ている回路層の一部を被覆していることを特徴とする、請求項7から請求項9のいずれかに記載の製造方法。 - 前記第2レーザーレジスト構造を除去するためにエッチングプロセスまたは機械加工プロセスを実施する工程と、
前記第1レーザーレジスト構造を除去するためにエッチングプロセスまたは機械加工プロセスを実施する工程とを更に含んでいる、請求項7から請求項10のいずれかに記載の製造方法。
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Application Number | Priority Date | Filing Date | Title |
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TW098111066 | 2009-04-02 | ||
TW098111066A TWI392404B (zh) | 2009-04-02 | 2009-04-02 | 線路板及其製作方法 |
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JP2010245530A JP2010245530A (ja) | 2010-10-28 |
JP5074549B2 true JP5074549B2 (ja) | 2012-11-14 |
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-
2009
- 2009-04-02 TW TW098111066A patent/TWI392404B/zh active
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2010
- 2010-03-31 JP JP2010081079A patent/JP5074549B2/ja active Active
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US20100252303A1 (en) | 2010-10-07 |
TW201038144A (en) | 2010-10-16 |
TWI392404B (zh) | 2013-04-01 |
US9084342B2 (en) | 2015-07-14 |
US20130212877A1 (en) | 2013-08-22 |
JP2010245530A (ja) | 2010-10-28 |
US8450616B2 (en) | 2013-05-28 |
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