JP5060935B2 - 撮像素子モジュール及びそれを用いた携帯用電子機器 - Google Patents

撮像素子モジュール及びそれを用いた携帯用電子機器 Download PDF

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Publication number
JP5060935B2
JP5060935B2 JP2007321138A JP2007321138A JP5060935B2 JP 5060935 B2 JP5060935 B2 JP 5060935B2 JP 2007321138 A JP2007321138 A JP 2007321138A JP 2007321138 A JP2007321138 A JP 2007321138A JP 5060935 B2 JP5060935 B2 JP 5060935B2
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JP
Japan
Prior art keywords
heat
heat radiating
image sensor
flexible printed
radiating member
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Expired - Fee Related
Application number
JP2007321138A
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English (en)
Japanese (ja)
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JP2008219861A5 (enExample
JP2008219861A (ja
Inventor
国雄 山宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Imaging Corp
Original Assignee
Olympus Imaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Imaging Corp filed Critical Olympus Imaging Corp
Priority to JP2007321138A priority Critical patent/JP5060935B2/ja
Priority to US12/025,188 priority patent/US7928358B2/en
Priority to CN200810008690XA priority patent/CN101241924B/zh
Priority to CN2010102424240A priority patent/CN101916766B/zh
Publication of JP2008219861A publication Critical patent/JP2008219861A/ja
Publication of JP2008219861A5 publication Critical patent/JP2008219861A5/ja
Application granted granted Critical
Publication of JP5060935B2 publication Critical patent/JP5060935B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
JP2007321138A 2007-02-08 2007-12-12 撮像素子モジュール及びそれを用いた携帯用電子機器 Expired - Fee Related JP5060935B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007321138A JP5060935B2 (ja) 2007-02-08 2007-12-12 撮像素子モジュール及びそれを用いた携帯用電子機器
US12/025,188 US7928358B2 (en) 2007-02-08 2008-02-04 Imaging device module and portable electronic apparatus utilizing the same
CN200810008690XA CN101241924B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备
CN2010102424240A CN101916766B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007029337 2007-02-08
JP2007029337 2007-02-08
JP2007321138A JP5060935B2 (ja) 2007-02-08 2007-12-12 撮像素子モジュール及びそれを用いた携帯用電子機器

Publications (3)

Publication Number Publication Date
JP2008219861A JP2008219861A (ja) 2008-09-18
JP2008219861A5 JP2008219861A5 (enExample) 2010-12-24
JP5060935B2 true JP5060935B2 (ja) 2012-10-31

Family

ID=39839292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007321138A Expired - Fee Related JP5060935B2 (ja) 2007-02-08 2007-12-12 撮像素子モジュール及びそれを用いた携帯用電子機器

Country Status (2)

Country Link
JP (1) JP5060935B2 (enExample)
CN (2) CN101916766B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010243634A (ja) * 2009-04-02 2010-10-28 Sony Corp 撮像装置
CN102129110B (zh) * 2010-01-20 2014-05-14 智宝科技股份有限公司 光学变焦系统
JP5574776B2 (ja) * 2010-03-26 2014-08-20 キヤノン株式会社 レンズ鏡筒および撮像装置
JP5820607B2 (ja) * 2011-04-25 2015-11-24 株式会社シグマ 撮像装置及び撮像システム
JP6193753B2 (ja) * 2013-06-27 2017-09-06 京セラ株式会社 撮像素子搭載用基板及び撮像装置
CN207799306U (zh) * 2016-10-20 2018-08-31 台湾东电化股份有限公司 光学系统
CN109427264A (zh) * 2017-08-30 2019-03-05 深圳市奥拓电子股份有限公司 一种光控板及led显示屏
CN110896435B (zh) * 2018-09-13 2021-07-20 三赢科技（深圳）有限公司 相机模组
JP6756357B2 (ja) * 2018-11-29 2020-09-16 株式会社ニコン 撮像装置
CN114740674B (zh) * 2022-02-28 2023-12-08 广东安达智能装备股份有限公司 一种微型工业ccd模组及其组装方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2665441B2 (ja) * 1993-05-21 1997-10-22 オリンパス光学工業株式会社 内視鏡
JPH08107526A (ja) * 1994-10-05 1996-04-23 Olympus Optical Co Ltd 電子的撮像装置
JP3875505B2 (ja) * 2001-03-29 2007-01-31 オリンパス株式会社 撮像装置
US20040061799A1 (en) * 2002-09-27 2004-04-01 Konica Corporation Image pickup device and portable terminal equipped therewith
US6956272B2 (en) * 2004-03-10 2005-10-18 Micron Technology, Inc. Support frame for semiconductor packages
JP2006174226A (ja) * 2004-12-17 2006-06-29 Konica Minolta Photo Imaging Inc 撮像ユニット及び撮像装置

Also Published As

Publication number Publication date
CN101916766A (zh) 2010-12-15
CN101241924B (zh) 2010-09-22
CN101241924A (zh) 2008-08-13
JP2008219861A (ja) 2008-09-18
CN101916766B (zh) 2013-04-10

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