CN101916766B - 成像装置模块和采用该成像装置模块的便携式电子设备 - Google Patents

成像装置模块和采用该成像装置模块的便携式电子设备 Download PDF

Info

Publication number
CN101916766B
CN101916766B CN2010102424240A CN201010242424A CN101916766B CN 101916766 B CN101916766 B CN 101916766B CN 2010102424240 A CN2010102424240 A CN 2010102424240A CN 201010242424 A CN201010242424 A CN 201010242424A CN 101916766 B CN101916766 B CN 101916766B
Authority
CN
China
Prior art keywords
imaging device
radiation
heat
radiation component
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010102424240A
Other languages
English (en)
Chinese (zh)
Other versions
CN101916766A (zh
Inventor
山宫国雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Imaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Imaging Corp filed Critical Olympus Imaging Corp
Publication of CN101916766A publication Critical patent/CN101916766A/zh
Application granted granted Critical
Publication of CN101916766B publication Critical patent/CN101916766B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
CN2010102424240A 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备 Expired - Fee Related CN101916766B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007029337 2007-02-08
JP2007-029337 2007-02-08
JP2007321138A JP5060935B2 (ja) 2007-02-08 2007-12-12 撮像素子モジュール及びそれを用いた携帯用電子機器
JP2007-321138 2007-12-12

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN200810008690XA Division CN101241924B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备

Publications (2)

Publication Number Publication Date
CN101916766A CN101916766A (zh) 2010-12-15
CN101916766B true CN101916766B (zh) 2013-04-10

Family

ID=39839292

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2010102424240A Expired - Fee Related CN101916766B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备
CN200810008690XA Expired - Fee Related CN101241924B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200810008690XA Expired - Fee Related CN101241924B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备

Country Status (2)

Country Link
JP (1) JP5060935B2 (enExample)
CN (2) CN101916766B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010243634A (ja) * 2009-04-02 2010-10-28 Sony Corp 撮像装置
CN102129110B (zh) * 2010-01-20 2014-05-14 智宝科技股份有限公司 光学变焦系统
JP5574776B2 (ja) * 2010-03-26 2014-08-20 キヤノン株式会社 レンズ鏡筒および撮像装置
JP5820607B2 (ja) * 2011-04-25 2015-11-24 株式会社シグマ 撮像装置及び撮像システム
JP6193753B2 (ja) * 2013-06-27 2017-09-06 京セラ株式会社 撮像素子搭載用基板及び撮像装置
CN207799306U (zh) * 2016-10-20 2018-08-31 台湾东电化股份有限公司 光学系统
CN109427264A (zh) * 2017-08-30 2019-03-05 深圳市奥拓电子股份有限公司 一种光控板及led显示屏
CN110896435B (zh) * 2018-09-13 2021-07-20 三赢科技（深圳）有限公司 相机模组
JP6756357B2 (ja) * 2018-11-29 2020-09-16 株式会社ニコン 撮像装置
CN114740674B (zh) * 2022-02-28 2023-12-08 广东安达智能装备股份有限公司 一种微型工业ccd模组及其组装方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1501696A (zh) * 2002-09-27 2004-06-02 ������������ʽ���� 摄像装置以及便携式终端设备
US6956272B2 (en) * 2004-03-10 2005-10-18 Micron Technology, Inc. Support frame for semiconductor packages

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2665441B2 (ja) * 1993-05-21 1997-10-22 オリンパス光学工業株式会社 内視鏡
JPH08107526A (ja) * 1994-10-05 1996-04-23 Olympus Optical Co Ltd 電子的撮像装置
JP3875505B2 (ja) * 2001-03-29 2007-01-31 オリンパス株式会社 撮像装置
JP2006174226A (ja) * 2004-12-17 2006-06-29 Konica Minolta Photo Imaging Inc 撮像ユニット及び撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1501696A (zh) * 2002-09-27 2004-06-02 ������������ʽ���� 摄像装置以及便携式终端设备
US6956272B2 (en) * 2004-03-10 2005-10-18 Micron Technology, Inc. Support frame for semiconductor packages

Also Published As

Publication number Publication date
JP5060935B2 (ja) 2012-10-31
CN101916766A (zh) 2010-12-15
CN101241924B (zh) 2010-09-22
CN101241924A (zh) 2008-08-13
JP2008219861A (ja) 2008-09-18

Similar Documents

Publication Publication Date Title
CN101916766B (zh) 成像装置模块和采用该成像装置模块的便携式电子设备
US7928358B2 (en) Imaging device module and portable electronic apparatus utilizing the same
US11887839B2 (en) Imaging unit and imaging apparatus
JP5291892B2 (ja) 撮像素子モジュール、撮像素子モジュールを用いたレンズユニット及び携帯用電子機器
JP4083521B2 (ja) 撮像装置
KR100669700B1 (ko) 방열 성능이 개선된 플라즈마 표시장치 조립체
KR101455124B1 (ko) 촬상 센서 패키지를 구비한 촬상장치
JP5740567B2 (ja) 撮像ユニットの放熱構造
US20070153120A1 (en) Imaging apparatus
CN108885324A (zh) 相机模块及包括该相机模块的光学设备
CN214544466U (zh) 一种摄像模组及电子设备
JP2009141609A (ja) 電子カメラおよびレンズユニット
US8369703B2 (en) Moving picture camera and electronic device including the same
JP2008271487A (ja) 撮像素子モジュール、撮像素子モジュールを用いたレンズユニット及び携帯用電子機器
JP2009060459A (ja) 撮像素子の発熱抑制方法、撮像素子の冷却方法、及び電子カメラ
JP2023170599A (ja) 撮像装置
JP2008227939A (ja) 撮像素子モジュール及びそれを用いた電子機器
JP2008278382A (ja) 撮像素子モジュール、撮像素子モジュールを用いた撮影レンズユニットおよび電子機器
RU2818664C2 (ru) Приводной двигатель, модуль видеокамеры и электронное устройство
JP2013229894A (ja) 撮像素子モジュール、撮像素子モジュールを用いたレンズユニット及び携帯用電子機器
CN223309898U (zh) 摄像模组及摄像设备
JP2007104573A (ja) 冷却撮像ユニット及びその撮像冷却ユニットが搭載された撮像装置
KR102790317B1 (ko) 영상 촬영 장치
JP2019050418A (ja) 撮像装置
CN115134483A (zh) 一种驱动马达、摄像头模组和电子设备

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20151125

Address after: Tokyo, Japan, Japan

Patentee after: Olympus Corporation

Address before: Tokyo, Japan, Japan

Patentee before: Olympus Imaging Corp.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130410

Termination date: 20190205

CF01 Termination of patent right due to non-payment of annual fee