JP5031960B2 - 基板処理装置および半導体装置の製造方法 - Google Patents

基板処理装置および半導体装置の製造方法 Download PDF

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Publication number
JP5031960B2
JP5031960B2 JP2001296392A JP2001296392A JP5031960B2 JP 5031960 B2 JP5031960 B2 JP 5031960B2 JP 2001296392 A JP2001296392 A JP 2001296392A JP 2001296392 A JP2001296392 A JP 2001296392A JP 5031960 B2 JP5031960 B2 JP 5031960B2
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boat
stage
mounting plate
processing
standby
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Japanese (ja)
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JP2003100730A5 (enrdf_load_stackoverflow
JP2003100730A (ja
Inventor
光徳 竹下
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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JP2001296392A 2001-09-27 2001-09-27 基板処理装置および半導体装置の製造方法 Expired - Lifetime JP5031960B2 (ja)

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JP2001296392A JP5031960B2 (ja) 2001-09-27 2001-09-27 基板処理装置および半導体装置の製造方法

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JP2001296392A JP5031960B2 (ja) 2001-09-27 2001-09-27 基板処理装置および半導体装置の製造方法

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JP2003100730A JP2003100730A (ja) 2003-04-04
JP2003100730A5 JP2003100730A5 (enrdf_load_stackoverflow) 2008-11-06
JP5031960B2 true JP5031960B2 (ja) 2012-09-26

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101005675B1 (ko) * 2003-12-24 2011-01-05 동부일렉트로닉스 주식회사 버티컬 퍼니스의 보트이송장치
WO2006004052A1 (ja) * 2004-07-02 2006-01-12 Nippon Pillar Packing Co., Ltd. メカニカルシール
JP5027430B2 (ja) * 2006-03-07 2012-09-19 株式会社日立国際電気 基板処理装置
JP4670863B2 (ja) * 2007-12-18 2011-04-13 東京エレクトロン株式会社 熱処理装置及び熱処理方法並びに記憶媒体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03227018A (ja) * 1990-01-31 1991-10-08 Dainippon Screen Mfg Co Ltd 縦型熱処理炉
JP3240449B2 (ja) * 1993-11-05 2001-12-17 東京エレクトロン株式会社 処理装置
JP3543996B2 (ja) * 1994-04-22 2004-07-21 東京エレクトロン株式会社 処理装置
JP3264879B2 (ja) * 1997-11-28 2002-03-11 東京エレクトロン株式会社 基板処理システム、インターフェイス装置、および基板搬送方法
JPH11329988A (ja) * 1998-05-21 1999-11-30 Kokusai Electric Co Ltd 基板処理装置
JP3664897B2 (ja) * 1998-11-18 2005-06-29 東京エレクトロン株式会社 縦型熱処理装置
JP2000286326A (ja) * 1999-03-30 2000-10-13 Kokusai Electric Co Ltd 基板処理装置

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