JP5029617B2 - 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 - Google Patents
感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 Download PDFInfo
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- JP5029617B2 JP5029617B2 JP2008550999A JP2008550999A JP5029617B2 JP 5029617 B2 JP5029617 B2 JP 5029617B2 JP 2008550999 A JP2008550999 A JP 2008550999A JP 2008550999 A JP2008550999 A JP 2008550999A JP 5029617 B2 JP5029617 B2 JP 5029617B2
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Images
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Polymerisation Methods In General (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
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KR (2) | KR101141909B1 (ko) |
CN (3) | CN102385253B (ko) |
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WO2008078483A1 (ja) * | 2006-12-27 | 2008-07-03 | Hitachi Chemical Company, Ltd. | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
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JP5935462B2 (ja) * | 2011-05-10 | 2016-06-15 | 日立化成株式会社 | 感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法 |
JP5853588B2 (ja) * | 2011-10-26 | 2016-02-09 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
CN103076717A (zh) * | 2011-10-26 | 2013-05-01 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法 |
CN103076719B (zh) * | 2011-10-26 | 2019-08-09 | 日立化成株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法 |
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JPWO2015098870A1 (ja) * | 2013-12-27 | 2017-03-23 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP6361191B2 (ja) * | 2014-03-14 | 2018-07-25 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びタッチパネルの製造方法 |
CN106796397A (zh) | 2014-09-18 | 2017-05-31 | 日立化成株式会社 | 感光性树脂组合物、感光性元件、带有抗蚀剂图案的基板的制造方法以及印刷配线板的制造方法 |
MY186932A (en) * | 2015-09-11 | 2021-08-26 | Asahi Chemical Ind | Photosensitive resin composition |
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CN109856912A (zh) * | 2019-03-11 | 2019-06-07 | 浙江福斯特新材料研究院有限公司 | 一种高附着力感光性树脂组合物 |
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WO2021192058A1 (ja) * | 2020-03-24 | 2021-09-30 | 昭和電工マテリアルズ株式会社 | 感光性樹脂組成物、感光性エレメント、及び配線基板の製造方法 |
JP2023059827A (ja) | 2021-10-15 | 2023-04-27 | 三菱製紙株式会社 | 感光性樹脂組成物及びめっき方法 |
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CN102393605A (zh) | 2012-03-28 |
JP2012137768A (ja) | 2012-07-19 |
JP5679080B2 (ja) | 2015-03-04 |
CN101568883B (zh) | 2012-01-18 |
WO2008078483A1 (ja) | 2008-07-03 |
TWI412887B (zh) | 2013-10-21 |
CN102393605B (zh) | 2014-06-11 |
JPWO2008078483A1 (ja) | 2010-04-15 |
CN102385253B (zh) | 2014-08-27 |
KR101141909B1 (ko) | 2012-05-03 |
JP2014134815A (ja) | 2014-07-24 |
KR20110112473A (ko) | 2011-10-12 |
JP2012198573A (ja) | 2012-10-18 |
TW200848929A (en) | 2008-12-16 |
KR20090084944A (ko) | 2009-08-05 |
CN101568883A (zh) | 2009-10-28 |
TW201224656A (en) | 2012-06-16 |
KR101168828B1 (ko) | 2012-07-25 |
TWI644175B (zh) | 2018-12-11 |
CN102385253A (zh) | 2012-03-21 |
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