JP5151446B2 - 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 - Google Patents
感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 Download PDFInfo
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- JP5151446B2 JP5151446B2 JP2007323730A JP2007323730A JP5151446B2 JP 5151446 B2 JP5151446 B2 JP 5151446B2 JP 2007323730 A JP2007323730 A JP 2007323730A JP 2007323730 A JP2007323730 A JP 2007323730A JP 5151446 B2 JP5151446 B2 JP 5151446B2
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- 238000001308 synthesis method Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 150000003577 thiophenes Chemical class 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
CH2=C(R6)−COOR7 (IV)
び/又は(E)アミン系化合物を含有すると好ましい。
撹拌機、還流冷却器、温度計、滴下ロート及び窒素ガス導入管を備えたフラスコに、質量比3:2のプロピレングリコールモノメチルエーテル及びトルエンの配合物450gを加え、窒素ガスを吹き込みながら撹拌して、80℃まで加熱した。一方、共重合単量体としてメタクリル酸150g、メタクリル酸フェノキシエチル175g及びスチレン175gと、アゾビスイソブチロニトリル9.0gとを混合した溶液(以下、「溶液a」という)を用意した。予め用意した質量比3:2のプロピレングリコールモノメチルエーテル及びトルエンの配合物に、上記溶液aを4時間かけて滴下した後、80℃で撹拌しながら2時間保温した。さらに、質量比3:2のプロピレングリコールモノメチルエーテル及びトルエンの配合物100gに、アゾビスイソブチロニトリル1.2gを溶解した溶液を10分かけて滴下した。滴下後の溶液を撹拌しながら80℃で3時間保温した後、30分間かけて90℃に加温した。90℃で2時間保温した後、冷却してバインダーポリマー(A−1)を得た。
ポンプ:日立L−6000型(日立製作所製、商品名)
カラム:Gelpack GL−R420 + Gelpack GL−R430 + Gelpack GL−R440(計3本)(以上、日立化成工業社製、商品名)
溶離液:テトラヒドロフラン
測定温度:40℃
流量:2.05mL/分
検出器:日立L−3300型RI(日立製作所製、商品名)
上記バインダーポリマー(A−1)〜(A−5)と、以下の材料とを表2に示される質量比で配合し、実施例1〜3及び比較例1〜3の感光性樹脂組成物の溶液を調製した。
<光重合性化合物((B)成分)>
B−1:2,2−ビス(4−(メタクリロキシペンタエトキシ)フェニル)プロパン(日立化成工業社製、商品名「FA−321M」)
B−2:上記一般式(VI)で表される化合物であって、R13=R14=メチル基、m3=6(平均値)、n2+n3=12(平均値)であるビニル化合物(日立化成工業社製、商品名「FA−024M」)
B−3:4−ノルマルノニルフェノキシオクタエチレングリコールアクリレート(東亞合成社製、商品名「M−114」)
<光重合開始剤((C)成分)>
C−1:2,2’−ビス(2−クロロフェニル)−4,4’,5,5’−テトラフェニルビスイミダゾール(Hampford社製、商品名「BCIM」)
<増感色素((D)成分)>
D−1:9,10−ジブトキシアントラセン(川崎化成工業社製、商品名「DBA」、吸収極大を示す波長[λn]=368nm,388nm,410nm)
<(E)発色剤(アミン化合物)>
E−1:ロイコクリスタルバイオレット(山田化学社製)
<染料>
マラカイトグリーン(大阪有機化学工業(株)製)
<溶剤>
アセトン
トルエン
メタノール
得られた各感光性樹脂組成物の溶液を、支持フィルムとなる16μm厚のポリエチレンテレフタレートフィルム上に均一に塗布した。その後、70℃及び110℃の熱風対流式乾燥機を用いて乾燥して、乾燥後の膜厚が25μmの感光性樹脂組成物層を形成した。続いて、感光性樹脂組成物層上に保護フィルムをロール加圧により積層し、各実施例1〜3及び比較例1、2に係る感光性エレメントを得た。
続いて、銅箔(厚さ35mm)を両面に積層したガラスエポキシ材である銅張積層板(日立化成工業社製、商品名:MCL−E−67)の銅表面を#600相当のブラシを持つ研磨機(三啓社製)を用いて研磨し、水洗後、空気流で乾燥させ、銅張積層板(基板)を得た。その後、銅張積層板を80℃に加温した後、銅張積層板上に上記各感光性エレメントの保護フィルムを除去しながら、各感光性樹脂組成物層が銅張積層板の表面上に密着するようにして、120℃で4kgf/cm2の圧力下でラミネート(積層)し、試験片を作製した。
<光感度>
各感光性エレメントが積層された銅張積層板を冷却し23℃になった時点で、支持フィルムに、濃度領域0.00〜2.00、濃度ステップ0.05、タブレットの大きさ20mm×187mm、各ステップの大きさが3mm×12mmである41段ステップタブレットを有するフォトツールを密着させた。405nmの青紫色レーザダイオードを光源とする日立ビアメカニクス社製直描機「DE−1AH」(商品名)を使用して、所定の露光量でフォトツール及び支持フィルムを介して感光性樹脂組成物層に露光(描画)した。また、ライン幅/スペース幅6/6〜22/22(単位:mm)の描画パターンを使用し、70mJ/cm2を露光したときの残存ステップ段数を感度として示した。なお、照度の測定は405nm対応プローブを適用した紫外線照度計(ウシオ電機(株)製、商品名:UIT−150)を用いて行った。
得られた結果を表4に示す。
現像後、解像密着が得られた最少寸法を解像度とした。すなわち、解像度(解像密着性)は、露光後の現像処理によって未露光部をきれいに除去することができ、なおかつラインが蛇行、カケを生じることなく形成されたライン幅/スペース幅のうち最も小さい値(単位:μm)を、その評価指標とした。解像度の評価は、数値が小さいほど良好な値である。得られた結果を下記表4に示す。現像後のレジスト形状は、日立走査型電子顕微鏡「S−500A」を用いて観察した。レジスト形状は矩形に近いことが望ましい。
レジストパターンの剥離性は、以下の方法で評価した。まず、各実施例及び比較例に係る感光性樹脂組成物層を銅張積層板上に形成し、各感光性樹脂組成物層を所定の露光量で露光し現像して、40mm×50mmの大きさの光硬化膜を作製した。そして、3%水酸化ナトリウム水溶液を用いて剥離を行った。剥離性は、光硬化膜を銅張積層板上から完全に剥離し除去したときの時間を剥離時間として測定し、それを評価指標とした。また、剥離完了後の剥離片のサイズを目視にて観察した(S:サイズ小で剥離性良好、B:サイズ大で剥離性不良)なお、表3に剥離プロセスの条件を示す。また、得られた結果を表4に示す。
表4に示されるように、実施例1〜3では、解像密着性(L/S)が9〜12μmと良好であり、剥離時間が適度に短く、また、剥離片サイズも小さく、光感度、解像度及び剥離性のバランスが良好であった。一方、比較例1、2では剥離時間は短いものの、解像度が良好ではなかった。
ム。
Claims (10)
- (A)下記一般式(I)、(II)及び(III)で表される2価の基を有し、重量平均分子量が30000〜150000であるバインダーポリマー、
(B)光重合性化合物、及び
(C)光重合開始剤
を含有する、感光性樹脂組成物。
- 前記(B)光重合性化合物が、ビスフェノールA系(メタ)アクリレート化合物を含む、請求項1記載の感光性樹脂組成物。
- 前記(B)光重合性化合物が、エチレングリコール鎖及びプロピレングリコール鎖の双方を有するポリアルキレングリコールジ(メタ)アクリレートを含む、請求項1又は2に記載の感光性樹脂組成物。
- 前記(B)光重合性化合物が、分子内に1つのエチレン性不飽和基を有する化合物を含む、請求項1〜3のいずれか一項に記載の感光性樹脂組成物。
- 前記(C)光重合開始剤は、ヘキサアリールビイミダゾール誘導体である、請求項1〜4のいずれか一項に記載の感光性樹脂組成物。
- (D)増感色素を更に含有する、請求項1〜5のいずれか一項に記載の感光性樹脂組成物。
- (E)アミン系化合物を更に含有する、請求項1〜6のいずれか一項に記載の感光性樹脂組成物。
- 支持フィルムと、当該支持フィルム上に形成された請求項1〜7のいずれか一項に記載の感光性樹脂組成物からなる感光性樹脂組成物層と、を備える感光性エレメント。
- 回路形成用基板上に、請求項1〜7のいずれか一項に記載の感光性樹脂組成物からなる感光性樹脂組成物層を積層する工程、
前記感光性樹脂組成物層の所定部分に活性光線を照射して露光部を光硬化する露光工程、及び
前記感光性樹脂組成物層が積層された前記回路形成用基板から前記感光性樹脂組成物層の前記露光部以外の部分を除去する現像工程
を有するレジストパターンの形成方法。 - 請求項9記載のレジストパターンの形成方法によりレジストパターンが形成された回路形成用基板を、エッチング又はめっきして導体パターンを形成する工程を有するプリント配線板の製造方法。
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