JP5022557B2 - ビームシステムのビームカラムを傾動する方法とその装置並びにビームシステム - Google Patents

ビームシステムのビームカラムを傾動する方法とその装置並びにビームシステム Download PDF

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JP5022557B2
JP5022557B2 JP2003155741A JP2003155741A JP5022557B2 JP 5022557 B2 JP5022557 B2 JP 5022557B2 JP 2003155741 A JP2003155741 A JP 2003155741A JP 2003155741 A JP2003155741 A JP 2003155741A JP 5022557 B2 JP5022557 B2 JP 5022557B2
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subassembly
beam column
column
curvature
radius
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Japanese (ja)
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JP2004079511A5 (enExample
JP2004079511A (ja
Inventor
アレックス・グロコルスキー
リカード・ドレイノーニ
マイケル・タングワイ
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エフ・イ−・アイ・カンパニー
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/023—Means for mechanically adjusting components not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/16—Vessels; Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/024—Moving components not otherwise provided for
    • H01J2237/0245—Moving whole optical system relatively to object

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2003155741A 2002-05-31 2003-05-30 ビームシステムのビームカラムを傾動する方法とその装置並びにビームシステム Expired - Fee Related JP5022557B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/159,790 US6661009B1 (en) 2002-05-31 2002-05-31 Apparatus for tilting a beam system
US10/159,790 2002-05-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011061583A Division JP5485209B2 (ja) 2002-05-31 2011-03-02 ビームシステムのビームカラムを傾動する方法

Publications (3)

Publication Number Publication Date
JP2004079511A JP2004079511A (ja) 2004-03-11
JP2004079511A5 JP2004079511A5 (enExample) 2006-07-13
JP5022557B2 true JP5022557B2 (ja) 2012-09-12

Family

ID=29419713

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2003155741A Expired - Fee Related JP5022557B2 (ja) 2002-05-31 2003-05-30 ビームシステムのビームカラムを傾動する方法とその装置並びにビームシステム
JP2011061583A Expired - Fee Related JP5485209B2 (ja) 2002-05-31 2011-03-02 ビームシステムのビームカラムを傾動する方法
JP2013096896A Expired - Fee Related JP5635645B2 (ja) 2002-05-31 2013-05-02 ビームシステムのビームカラムを傾動する装置並びにビームシステム

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2011061583A Expired - Fee Related JP5485209B2 (ja) 2002-05-31 2011-03-02 ビームシステムのビームカラムを傾動する方法
JP2013096896A Expired - Fee Related JP5635645B2 (ja) 2002-05-31 2013-05-02 ビームシステムのビームカラムを傾動する装置並びにビームシステム

Country Status (3)

Country Link
US (1) US6661009B1 (enExample)
EP (1) EP1367629A3 (enExample)
JP (3) JP5022557B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011146399A (ja) * 2002-05-31 2011-07-28 Fei Co ビームシステムのビームカラムを傾動する方法とその装置並びにビームシステム
US8278133B2 (en) 2010-04-20 2012-10-02 Panasonic Corporation Method for joining a film onto a substrate

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AU2003211027A1 (en) 2002-03-27 2003-10-13 Nanoink, Inc. Method and apparatus for aligning patterns on a substrate
US20040051053A1 (en) * 2002-05-22 2004-03-18 Barletta William A. Universal pattern generator with multiplex addressing
KR100664307B1 (ko) * 2004-08-13 2007-01-04 삼성전자주식회사 쉐도우 마스크, 및 이를 이용한 수직 테이퍼링 구조물제작방법
JP5033314B2 (ja) * 2004-09-29 2012-09-26 株式会社日立ハイテクノロジーズ イオンビーム加工装置及び加工方法
DE102005002006A1 (de) * 2005-01-15 2006-07-27 Kuratorium Offis E.V. Vorrichtung zur Herstellung von 3D-Strukturen
US7298495B2 (en) * 2005-06-23 2007-11-20 Lewis George C System and method for positioning an object through use of a rotating laser metrology system
JP2007164992A (ja) * 2005-12-09 2007-06-28 Sii Nanotechnology Inc 複合荷電粒子ビーム装置
JP2008157673A (ja) * 2006-12-21 2008-07-10 Sii Nanotechnology Inc 試料把持体の把持面作製方法
US8524139B2 (en) * 2009-08-10 2013-09-03 FEI Compay Gas-assisted laser ablation
JP5564346B2 (ja) * 2010-07-08 2014-07-30 株式会社キーエンス 拡大観察装置
US8766213B2 (en) 2012-09-07 2014-07-01 Fei Company Automated method for coincident alignment of a laser beam and a charged particle beam
KR101615513B1 (ko) 2014-06-17 2016-04-27 한국표준과학연구원 하전입자 빔 정렬 장치 및 이의 이용방법
CN104267288B (zh) * 2014-10-08 2017-08-25 国家电网公司 基于阀电压或阀电流的hvdc换相失败故障诊断方法
CN106783493B (zh) * 2016-12-01 2018-07-10 聚束科技（北京）有限公司 一种真空气氛处理装置、样品观测系统及方法
TW202534727A (zh) * 2023-11-06 2025-09-01 德商卡爾蔡司Ｓｍｔ有限公司 用於可互換製程模組的模組化計量裝置

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US4465934A (en) 1981-01-23 1984-08-14 Veeco Instruments Inc. Parallel charged particle beam exposure system
JPS57132657A (en) * 1981-02-06 1982-08-17 Akashi Seisakusho Co Ltd Inclined moving body tube type scanning electron microscope and its similar apparatus
JPS57194531A (en) * 1981-05-26 1982-11-30 Toshiba Corp Electron beam transfer device
US4864228A (en) * 1985-03-15 1989-09-05 Fairchild Camera And Instrument Corporation Electron beam test probe for integrated circuit testing
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JPH084090B2 (ja) 1986-08-27 1996-01-17 株式会社日立製作所 Ｉｃ配線の切断方法及び装置
DE3802598C1 (enExample) * 1988-01-29 1989-04-13 Karl Heinz 3057 Neustadt De Stellmann
JPH0235725A (ja) 1988-07-26 1990-02-06 Matsushita Electric Ind Co Ltd ドライエッチング方法およびドライエッチング装置
US4891516A (en) * 1989-02-27 1990-01-02 Huntington Mechanical Laboratories, Inc. Device for axially and angularly positioning a beam or the like in a sealed chamber
KR910016054A (ko) 1990-02-23 1991-09-30 미다 가쓰시게 마이크로 전자 장치용 표면 처리 장치 및 그 방법
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JP3113674B2 (ja) 1990-11-21 2000-12-04 株式会社日立製作所 荷電ビーム処理方法およびその装置
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JP2854466B2 (ja) * 1992-08-28 1999-02-03 株式会社日立製作所 荷電粒子線装置
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JP2000306540A (ja) * 1999-04-16 2000-11-02 Nippon Steel Corp イオン注入装置におけるビーム電流測定装置
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US6501078B1 (en) * 2000-03-16 2002-12-31 Applied Materials, Inc. Ion extraction assembly
JP2002093685A (ja) * 2000-09-19 2002-03-29 Nikon Corp ステージ装置及び露光装置
US6661009B1 (en) * 2002-05-31 2003-12-09 Fei Company Apparatus for tilting a beam system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011146399A (ja) * 2002-05-31 2011-07-28 Fei Co ビームシステムのビームカラムを傾動する方法とその装置並びにビームシステム
US8278133B2 (en) 2010-04-20 2012-10-02 Panasonic Corporation Method for joining a film onto a substrate

Also Published As

Publication number Publication date
EP1367629A2 (en) 2003-12-03
JP2004079511A (ja) 2004-03-11
JP2013179070A (ja) 2013-09-09
EP1367629A3 (en) 2009-01-07
JP2011146399A (ja) 2011-07-28
JP5485209B2 (ja) 2014-05-07
US20030222221A1 (en) 2003-12-04
JP5635645B2 (ja) 2014-12-03
US6661009B1 (en) 2003-12-09

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