JP5019040B2 - 圧電振動子、および発振器 - Google Patents
圧電振動子、および発振器 Download PDFInfo
- Publication number
- JP5019040B2 JP5019040B2 JP2007129470A JP2007129470A JP5019040B2 JP 5019040 B2 JP5019040 B2 JP 5019040B2 JP 2007129470 A JP2007129470 A JP 2007129470A JP 2007129470 A JP2007129470 A JP 2007129470A JP 5019040 B2 JP5019040 B2 JP 5019040B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- piezoelectric vibrator
- piezoelectric
- vibration
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 47
- 238000005452 bending Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 description 27
- 238000005530 etching Methods 0.000 description 19
- 230000008878 coupling Effects 0.000 description 14
- 238000010168 coupling process Methods 0.000 description 14
- 238000005859 coupling reaction Methods 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000010355 oscillation Effects 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 6
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007129470A JP5019040B2 (ja) | 2007-01-18 | 2007-05-15 | 圧電振動子、および発振器 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007009112 | 2007-01-18 | ||
| JP2007009112 | 2007-01-18 | ||
| JP2007129470A JP5019040B2 (ja) | 2007-01-18 | 2007-05-15 | 圧電振動子、および発振器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008199570A JP2008199570A (ja) | 2008-08-28 |
| JP2008199570A5 JP2008199570A5 (enExample) | 2010-06-17 |
| JP5019040B2 true JP5019040B2 (ja) | 2012-09-05 |
Family
ID=39758087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007129470A Expired - Fee Related JP5019040B2 (ja) | 2007-01-18 | 2007-05-15 | 圧電振動子、および発振器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5019040B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6028927B2 (ja) * | 2013-03-27 | 2016-11-24 | セイコーエプソン株式会社 | 振動子の製造方法、振動子、および発振器 |
| CN104505459B (zh) * | 2014-11-27 | 2017-06-30 | 南京航空航天大学 | 一种环形压电换能器的粘胶固化装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60167497U (ja) * | 1984-04-13 | 1985-11-07 | 日本電気株式会社 | 超音波センサ− |
| US5023503A (en) * | 1990-01-03 | 1991-06-11 | Motorola, Inc. | Super high frequency oscillator/resonator |
| JP3240219B2 (ja) * | 1993-08-20 | 2001-12-17 | 雅則 奥山 | 超音波センサ |
| JPH07113643A (ja) * | 1993-10-15 | 1995-05-02 | Nikon Corp | 圧電振動角速度計 |
| JPH10173476A (ja) * | 1996-12-06 | 1998-06-26 | Riken Corp | 音叉型圧電振動子 |
| JP3891190B2 (ja) * | 2004-05-21 | 2007-03-14 | ソニー株式会社 | 圧電素子、圧電装置および角速度センサ |
-
2007
- 2007-05-15 JP JP2007129470A patent/JP5019040B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008199570A (ja) | 2008-08-28 |
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