JP4982602B2 - 表面実装水晶振動子及びその製造方法 - Google Patents

表面実装水晶振動子及びその製造方法 Download PDF

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Publication number
JP4982602B2
JP4982602B2 JP2010232505A JP2010232505A JP4982602B2 JP 4982602 B2 JP4982602 B2 JP 4982602B2 JP 2010232505 A JP2010232505 A JP 2010232505A JP 2010232505 A JP2010232505 A JP 2010232505A JP 4982602 B2 JP4982602 B2 JP 4982602B2
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JP
Japan
Prior art keywords
terminal
crystal
lead
substrate
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010232505A
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English (en)
Japanese (ja)
Other versions
JP2011211681A (ja
JP2011211681A5 (enExample
Inventor
泰男 酒葉
征司 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
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Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2010232505A priority Critical patent/JP4982602B2/ja
Priority to TW099141507A priority patent/TWI479707B/zh
Priority to US12/929,096 priority patent/US8305150B2/en
Priority to CN201110005103.3A priority patent/CN102195600B/zh
Publication of JP2011211681A publication Critical patent/JP2011211681A/ja
Publication of JP2011211681A5 publication Critical patent/JP2011211681A5/ja
Application granted granted Critical
Publication of JP4982602B2 publication Critical patent/JP4982602B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0509—Holders or supports for bulk acoustic wave devices consisting of adhesive elements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP2010232505A 2010-03-09 2010-10-15 表面実装水晶振動子及びその製造方法 Expired - Fee Related JP4982602B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010232505A JP4982602B2 (ja) 2010-03-09 2010-10-15 表面実装水晶振動子及びその製造方法
TW099141507A TWI479707B (zh) 2010-03-09 2010-11-30 表面安裝石英振盪子及其製造方法
US12/929,096 US8305150B2 (en) 2010-03-09 2010-12-30 Surface mount crystal oscillator and manufacturing method of the same
CN201110005103.3A CN102195600B (zh) 2010-03-09 2011-01-12 表面安装晶体振荡器及其制造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010051597 2010-03-09
JP2010051597 2010-03-09
JP2010232505A JP4982602B2 (ja) 2010-03-09 2010-10-15 表面実装水晶振動子及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012097566A Division JP5292491B2 (ja) 2010-03-09 2012-04-23 シート状セラミックベース及びその製造方法

Publications (3)

Publication Number Publication Date
JP2011211681A JP2011211681A (ja) 2011-10-20
JP2011211681A5 JP2011211681A5 (enExample) 2012-01-19
JP4982602B2 true JP4982602B2 (ja) 2012-07-25

Family

ID=44559410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010232505A Expired - Fee Related JP4982602B2 (ja) 2010-03-09 2010-10-15 表面実装水晶振動子及びその製造方法

Country Status (4)

Country Link
US (1) US8305150B2 (enExample)
JP (1) JP4982602B2 (enExample)
CN (1) CN102195600B (enExample)
TW (1) TWI479707B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5893900B2 (ja) * 2010-12-28 2016-03-23 日本電波工業株式会社 表面実装水晶振動子及び基板シート
JP6119108B2 (ja) 2012-04-10 2017-04-26 セイコーエプソン株式会社 電子デバイス、電子機器、ベース基板の製造方法および電子デバイスの製造方法
JP2015012457A (ja) * 2013-06-28 2015-01-19 京セラクリスタルデバイス株式会社 水晶デバイス
JP6282843B2 (ja) * 2013-10-31 2018-02-21 京セラ株式会社 水晶デバイス
JP2015088962A (ja) * 2013-10-31 2015-05-07 京セラクリスタルデバイス株式会社 水晶デバイス
JP2015142214A (ja) * 2014-01-28 2015-08-03 京セラクリスタルデバイス株式会社 水晶デバイス
JP2015142218A (ja) * 2014-01-28 2015-08-03 京セラクリスタルデバイス株式会社 水晶デバイス
JP6487150B2 (ja) * 2014-03-25 2019-03-20 京セラ株式会社 水晶デバイス
JP2016001862A (ja) * 2014-05-23 2016-01-07 日本電波工業株式会社 表面実装水晶振動子及びその製造方法、発振器
JP6418810B2 (ja) * 2014-06-26 2018-11-07 京セラ株式会社 水晶デバイス
JP2016103746A (ja) * 2014-11-28 2016-06-02 京セラクリスタルデバイス株式会社 圧電デバイス
JP2016103747A (ja) * 2014-11-28 2016-06-02 京セラクリスタルデバイス株式会社 水晶振動子
WO2016132767A1 (ja) 2015-02-18 2016-08-25 株式会社村田製作所 圧電振動デバイス及びその製造方法
JP2017183808A (ja) * 2016-03-28 2017-10-05 京セラ株式会社 水晶素子および水晶デバイス
JP2018074370A (ja) * 2016-10-28 2018-05-10 日本電波工業株式会社 圧電デバイス
JP2020043433A (ja) * 2018-09-07 2020-03-19 京セラ株式会社 水晶デバイス
JP2020123804A (ja) * 2019-01-30 2020-08-13 セイコーエプソン株式会社 発振器、発振器の製造方法、電子機器および移動体
TWI763298B (zh) * 2021-02-03 2022-05-01 國立陽明交通大學 石英振盪器的製作方法與結構

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3614030B2 (ja) * 1999-04-02 2005-01-26 株式会社村田製作所 マザー基板，子基板およびそれを用いた電子部品ならびにその製造方法
JP3489508B2 (ja) 1999-10-07 2004-01-19 株式会社村田製作所 導電性キャップ、電子部品及び導電性キャップの絶縁皮膜形成方法
JP3438709B2 (ja) * 2000-08-31 2003-08-18 セイコーエプソン株式会社 圧電デバイス及びその製造方法と圧電発振器の製造方法
JP2003179456A (ja) 2001-12-11 2003-06-27 Nippon Dempa Kogyo Co Ltd 水晶製品用表面実装容器及びこれを用いた水晶製品
US7034441B2 (en) * 2002-11-13 2006-04-25 Nihon Dempa Kogyo Co., Ltd Surface mount crystal unit and surface mount crystal oscillator
JP2004166006A (ja) * 2002-11-13 2004-06-10 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶振動子
JP3843983B2 (ja) * 2003-03-20 2006-11-08 セイコーエプソン株式会社 圧電振動子
JP4548012B2 (ja) * 2003-12-11 2010-09-22 株式会社大真空 圧電振動デバイス
US7256568B2 (en) * 2004-05-11 2007-08-14 The Hong Kong University Of Science And Technology Single inductor multiple-input multiple-output switching converter and method of use
JP2006033413A (ja) * 2004-07-15 2006-02-02 Daishinku Corp 圧電振動デバイス
JP4426395B2 (ja) * 2004-07-30 2010-03-03 日本電波工業株式会社 表面実装用水晶発振器の製造方法
JP4577041B2 (ja) * 2005-02-25 2010-11-10 株式会社大真空 圧電振動子の周波数調整方法
JP2007158419A (ja) 2005-11-30 2007-06-21 Nippon Dempa Kogyo Co Ltd 表面実装用水晶発振器
JP5150177B2 (ja) * 2006-10-05 2013-02-20 日本電波工業株式会社 水晶振動子
JP2009100353A (ja) * 2007-10-18 2009-05-07 Nippon Dempa Kogyo Co Ltd 水晶デバイス

Also Published As

Publication number Publication date
US20110221535A1 (en) 2011-09-15
CN102195600B (zh) 2014-04-16
US8305150B2 (en) 2012-11-06
TWI479707B (zh) 2015-04-01
TW201145628A (en) 2011-12-16
CN102195600A (zh) 2011-09-21
JP2011211681A (ja) 2011-10-20

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