JP4973494B2 - 多層プリント配線板 - Google Patents

多層プリント配線板 Download PDF

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Publication number
JP4973494B2
JP4973494B2 JP2007509308A JP2007509308A JP4973494B2 JP 4973494 B2 JP4973494 B2 JP 4973494B2 JP 2007509308 A JP2007509308 A JP 2007509308A JP 2007509308 A JP2007509308 A JP 2007509308A JP 4973494 B2 JP4973494 B2 JP 4973494B2
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JP
Japan
Prior art keywords
layer
filled
via hole
conductor
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007509308A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2006101134A1 (ja
Inventor
高広 山下
暁秀 石原
直樹 久保田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP2007509308A priority Critical patent/JP4973494B2/ja
Publication of JPWO2006101134A1 publication Critical patent/JPWO2006101134A1/ja
Application granted granted Critical
Publication of JP4973494B2 publication Critical patent/JP4973494B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2007509308A 2005-03-24 2006-03-22 多層プリント配線板 Active JP4973494B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007509308A JP4973494B2 (ja) 2005-03-24 2006-03-22 多層プリント配線板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005085454 2005-03-24
JP2005085454 2005-03-24
PCT/JP2006/305721 WO2006101134A1 (ja) 2005-03-24 2006-03-22 多層プリント配線板
JP2007509308A JP4973494B2 (ja) 2005-03-24 2006-03-22 多層プリント配線板

Publications (2)

Publication Number Publication Date
JPWO2006101134A1 JPWO2006101134A1 (ja) 2008-09-04
JP4973494B2 true JP4973494B2 (ja) 2012-07-11

Family

ID=37023794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007509308A Active JP4973494B2 (ja) 2005-03-24 2006-03-22 多層プリント配線板

Country Status (3)

Country Link
JP (1) JP4973494B2 (enrdf_load_stackoverflow)
TW (1) TW200704327A (enrdf_load_stackoverflow)
WO (1) WO2006101134A1 (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5005416B2 (ja) * 2007-04-20 2012-08-22 新光電気工業株式会社 多層配線基板及びその製造方法
JP5125531B2 (ja) * 2008-01-16 2013-01-23 富士通セミコンダクター株式会社 配線基板及び半導体装置
JP5060998B2 (ja) * 2008-03-18 2012-10-31 日本特殊陶業株式会社 多層樹脂配線基板
TWI468093B (zh) 2008-10-31 2015-01-01 Princo Corp 多層基板之導孔結構及其製造方法
JP2015038909A (ja) * 2012-07-13 2015-02-26 イビデン株式会社 配線板及びその製造方法
JP6287149B2 (ja) * 2013-12-10 2018-03-07 イビデン株式会社 電子部品内蔵基板及び電子部品内蔵基板の製造方法
JP5797309B1 (ja) 2014-07-22 2015-10-21 株式会社フジクラ プリント配線板
JP2016072285A (ja) * 2014-09-26 2016-05-09 京セラ株式会社 回路基板およびプローブカード
CN105430876A (zh) * 2015-12-29 2016-03-23 景旺电子科技(龙川)有限公司 一种增加金属基板绝缘槽孔孔壁结合力的方法
US10103201B2 (en) 2016-07-05 2018-10-16 E Ink Holdings Inc. Flexible display device
TWI613942B (zh) * 2016-07-05 2018-02-01 元太科技工業股份有限公司 電連接結構
CN107580410B (zh) * 2016-07-05 2019-12-13 元太科技工业股份有限公司 电连接结构
US10607932B2 (en) 2016-07-05 2020-03-31 E Ink Holdings Inc. Circuit structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218531A (ja) * 2002-01-23 2003-07-31 Kyocera Corp 多層配線基板
JP2003283135A (ja) * 2002-03-25 2003-10-03 Kyocera Corp 配線基板
JP2004158703A (ja) * 2002-11-07 2004-06-03 Internatl Business Mach Corp <Ibm> プリント配線板とその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4468528B2 (ja) * 1999-11-26 2010-05-26 イビデン株式会社 多層プリント配線板およびその製造方法。
JP2003069233A (ja) * 2001-08-30 2003-03-07 Kyocera Corp 多層配線基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218531A (ja) * 2002-01-23 2003-07-31 Kyocera Corp 多層配線基板
JP2003283135A (ja) * 2002-03-25 2003-10-03 Kyocera Corp 配線基板
JP2004158703A (ja) * 2002-11-07 2004-06-03 Internatl Business Mach Corp <Ibm> プリント配線板とその製造方法

Also Published As

Publication number Publication date
WO2006101134A1 (ja) 2006-09-28
JPWO2006101134A1 (ja) 2008-09-04
TW200704327A (en) 2007-01-16
TWI328992B (enrdf_load_stackoverflow) 2010-08-11

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