JP6287149B2 - 電子部品内蔵基板及び電子部品内蔵基板の製造方法 - Google Patents
電子部品内蔵基板及び電子部品内蔵基板の製造方法 Download PDFInfo
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- JP6287149B2 JP6287149B2 JP2013255047A JP2013255047A JP6287149B2 JP 6287149 B2 JP6287149 B2 JP 6287149B2 JP 2013255047 A JP2013255047 A JP 2013255047A JP 2013255047 A JP2013255047 A JP 2013255047A JP 6287149 B2 JP6287149 B2 JP 6287149B2
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- 239000000758 substrate Substances 0.000 title claims description 100
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000004020 conductor Substances 0.000 claims description 149
- 238000007747 plating Methods 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 239000011889 copper foil Substances 0.000 claims description 22
- 238000007772 electroless plating Methods 0.000 claims description 19
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000003985 ceramic capacitor Substances 0.000 claims description 7
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 7
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 90
- 239000003990 capacitor Substances 0.000 description 38
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- 239000010949 copper Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- 238000009713 electroplating Methods 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000011229 interlayer Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 229910001414 potassium ion Inorganic materials 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- C25D7/00—Electroplating characterised by the article coated
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- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- H—ELECTRICITY
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- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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Description
コア基板30はキャビティ(開口部)20を有している。本実施形態では、キャビティ20はコア基板30を貫通している。
キャビティ20の内部には、コンデンサ110が収容されている。キャビティ20の側壁とコンデンサ110との隙間には樹脂50が充填されている。これにより、コンデンサ110がキャビティ20の内部において固定されている。
スルーホール導体36は、貫通孔31内をめっきで充填することにより形成される。貫通孔31は、コア基板30の第1面Fに開口する第1開口部31fと、第2面Sに開口する第2開口部31sとで形成されている。第1開口部31fは第1面から第2面に向かってテーパしているとともに、第2開口部31sは第2面から第1面に向かってテーパしており、該第1開口部31fと該第2開口部31sはコア基板30の内部で繋がっている。
コンデンサ110は、小型で容量の大きな積層セラミックコンデンサ(MLCC)からなる。該コンデンサは、BaTiO3から主として成る誘電体層122とNi製の内部電極124とを交互に積層して成る本体部120と、電極112P、112Mとから成る。コンデンサ110の電極112P、112Mは、本体部120の端部まで延在している内部電極124と接触するようにNiペースト114が設けられ、該Niペースト114がCuめっき膜116で被覆され成る。
(1)BaTiO3から成る誘電体層122αとNi製の内部電極層124αとが交互に積層され積層体120αが形成される(図7(A))。
(2)積層体120αの端部まで延在している内部電極層124αと接触するようにNiペースト層114αが積層体の短辺側に塗布される(図7(B))。Niペースト層は、Ni粉とTiBaベース成分から主として成る。
(4)ピロリン酸銅(Cu7 P2 O7)とピロリン酸カリウム(K4 P2 O7)を用いるピロリン酸銅めっきによって、Niペースト114上にCuめっき膜116が被覆され、水洗工程を経てコンデンサ110が完成される(図7(D))。
(1)絶縁性基材18とその両面に銅箔32が積層されている両面銅張積層板30zが出発材料である。絶縁性基材は第1面Fとその第1面と反対側の第2面Sを有する。銅箔32の厚みは1μm以上5μm以下であることが好ましい。銅箔32の表面に図示されない黒化処理が施される(図2(A))。
20 開口
30 コア基板
34F、34S 導体層
50F、50S 層間樹脂絶縁層
60Fa、60Sa 接続ビア導体
100 電子部品内蔵基板
110 コンデンサ
112M、112P 電極
114 Niペースト
116 銅めき膜
Claims (12)
- 導体パターンを備える樹脂製の絶縁基板の開口に端子を備えるセラミック製の電子部品を収容し、前記絶縁基板及び前記電子部品上に樹脂絶縁層を被覆し、前記樹脂絶縁層を貫通して前記導体パターン及び前記端子に至るビア導体を設けた電子部品内蔵基板であって、
前記ビア導体と前記導体パターンの接続部、前記ビア導体と前記端子の接続部は窪んでいて、前記導体パターンの接続部の窪みの深さは、前記端子の接続部の窪みの深さよりも深い。 - 請求項1の電子部品内蔵基板であって、
前記電子部品は積層セラミックコンデンサである。 - 請求項2の電子部品内蔵基板であって、
前記絶縁基板のX−Y方向の熱膨張係数は、前記積層セラミックコンデンサのX−Y方向の熱膨張係数よりも低い。 - 請求項1の電子部品内蔵基板であって、
前記導体パターンの接続部の窪みの深さと、前記端子の接続部の窪みの深さとの比は0.5以上1.0未満である。 - 請求項1の電子部品内蔵基板であって、
前記導体パターンは、銅箔、無電解めっき導体層、硫酸銅めっき導体層からなり、
前記端子はピロリン酸銅めっき導体層である。 - 請求項5の電子部品内蔵基板であって、
前記導体パターン側の窪みは、前記硫酸銅めっき導体層内に形成され、
前記電子部品端子側の窪みは、前記ピロリン酸銅めっき導体層内に形成されている。 - 電子部品内蔵基板の製造方法であって、
樹脂製の絶縁基板に導体パターンを形成することと、
前記絶縁基板に開口を形成することと、
前記絶縁基板の開口に端子を備えるセラミック製の電子部品を収容することと、
前記絶縁基板及び前記電子部品上に樹脂絶縁層及び銅箔を積層することと、
前記銅箔及び樹脂絶縁層を貫通して前記導体パターン及び前記端子に至るビア用開口をレーザで設けることと、
エッチングにより前記銅箔を剥離すると共に、前記ビア用開口の底部の前記端子に窪みを形成し、前記ビア用開口の底部の前記導体パターンに、前記端子の窪みよりも深い窪みを形成することと、
前記ビア用開口にめっきによりビア導体を設けることと、を備える。 - 請求項7の電子部品内蔵基板の製造方法であって、
前記導体パターンの形成は硫酸銅めっきにより行われ、
前記端子はピロリン酸銅めっきにより形成されている。 - 請求項7の電子部品内蔵基板の製造方法であって、
前記導体パターンは、銅箔、無電解めっき導体層、硫酸銅めっき導体層から行わ、
前記端子はピロリン酸銅めっきにより形成されている。 - 請求項7の電子部品内蔵基板の製造方法であって、
前記樹脂絶縁層及び銅箔の積層は、プライマー付き銅箔を樹脂絶縁層に積層して行う。 - 請求項7の電子部品内蔵基板の製造方法であって、
前記導体パターンを形成後、該導体パターンに粗化処理を行う。 - 請求項7の電子部品内蔵基板の製造方法であって、
前記銅箔の厚みは1μm以上5μm以下である。
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