JP4972175B2 - 積層型チップキャパシタ - Google Patents
積層型チップキャパシタ Download PDFInfo
- Publication number
- JP4972175B2 JP4972175B2 JP2010030375A JP2010030375A JP4972175B2 JP 4972175 B2 JP4972175 B2 JP 4972175B2 JP 2010030375 A JP2010030375 A JP 2010030375A JP 2010030375 A JP2010030375 A JP 2010030375A JP 4972175 B2 JP4972175 B2 JP 4972175B2
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- Prior art keywords
- electrode
- internal electrode
- layer
- internal
- conductive via
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- 239000003990 capacitor Substances 0.000 title claims description 67
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 2
- 238000009751 slip forming Methods 0.000 claims 2
- 230000003071 parasitic effect Effects 0.000 description 12
- 230000000149 penetrating effect Effects 0.000 description 6
- 230000004907 flux Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
即ち、リードが交互に配置されているので、互いに逆のインダクタンス成分が部分的でしかない。また、内部電極を外部端子電極と連結させるために各々の内部電極にはリードが形成されるので、上記リード自体がキャパシタのESLを大きく増加させる原因として作用する。
この場合、上記キャパシタ本体の相互対向する2個の側面上に各面毎に4個ずつの外部端子電極が形成され得る。
上記導電性ビア層(22a、23a)は上記内部電極(12、13)に形成された貫通孔の内周面には接触しない点に留意しなければならない。
22 第1内部電極
23 第2内部電極
22a、23a 導電性ビア層
32、33 最下部電極層
32a、33a ビア接触部
32b、33b リード部
Claims (2)
- 複数の誘電体層が積層されて形成されたキャパシタ本体;
上記キャパシタ本体の一側面と上下部面の一部に形成された第1極性の第1の外部端子電極と上記第1極性と異なる極性の第2極性の第2の外部端子電極;
上記複数の誘電体層上に各々形成され、上記誘電体層を挟んで配置され、各々少なくとも一辺に少なくとも一つの貫通孔を有する複数の第1内部電極及び第2内部電極;
上記貫通孔の内周面と接触しないよう上記貫通孔を通過して垂直に延長され、上記第1内部電極にのみ接触する第1導電性ビアと上記第2内部電極にのみ接触する第2導電性ビア;及び
上記第1又は第2の外部端子電極が形成される上記キャパシタ本体の一側面に向かって延長されたリード部と、上記第1導電性ビアと第2導電性ビアと各々電気的に接続するビア接触部とを有する最下部電極層;を含み、
上記最下部電極層は、上記キャパシタ本体を形成する最下部の誘電体層上に形成され、上記第1内部電極と第2内部電極と異なる形状を有し、
上記最下部の誘電体層は、上記第1内部電極又は第2内部電極を備えず、上記リード部とビア接触部のみを有する積層型チップキャパシタ。 - 上記第1導電性ビアは、上記誘電体層の最上層の第1内部電極から上記最下部電極層の第1ビア接触部まで連続形成され、
上記第2導電性ビアは、上記誘電体層の最上層の第2内部電極から上記最下部電極層の第2ビア接触部まで連続形成される請求項1に記載の積層型チップキャパシタ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040101411A KR100714608B1 (ko) | 2004-12-03 | 2004-12-03 | 적층형 칩 커패시터 |
KR10-2004-0101411 | 2004-12-03 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005333782A Division JP4971626B2 (ja) | 2004-12-03 | 2005-11-18 | 積層型チップキャパシタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010141350A JP2010141350A (ja) | 2010-06-24 |
JP4972175B2 true JP4972175B2 (ja) | 2012-07-11 |
Family
ID=36573907
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005333782A Expired - Fee Related JP4971626B2 (ja) | 2004-12-03 | 2005-11-18 | 積層型チップキャパシタ |
JP2010030375A Expired - Fee Related JP4972175B2 (ja) | 2004-12-03 | 2010-02-15 | 積層型チップキャパシタ |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005333782A Expired - Fee Related JP4971626B2 (ja) | 2004-12-03 | 2005-11-18 | 積層型チップキャパシタ |
Country Status (4)
Country | Link |
---|---|
US (1) | US7292430B2 (ja) |
JP (2) | JP4971626B2 (ja) |
KR (1) | KR100714608B1 (ja) |
CN (1) | CN1783376B (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7916263B2 (en) | 2004-12-02 | 2011-03-29 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP4407836B2 (ja) * | 2006-03-17 | 2010-02-03 | Tdk株式会社 | 積層セラミックコンデンサ |
JP2007317786A (ja) * | 2006-05-24 | 2007-12-06 | Tdk Corp | 積層コンデンサ |
JP4335237B2 (ja) * | 2006-07-21 | 2009-09-30 | Tdk株式会社 | 貫通型積層コンデンサ |
JP4400612B2 (ja) * | 2006-10-31 | 2010-01-20 | Tdk株式会社 | 積層コンデンサ、および積層コンデンサの製造方法 |
JP4626605B2 (ja) * | 2006-11-07 | 2011-02-09 | 株式会社村田製作所 | 積層コンデンサ |
KR100887124B1 (ko) * | 2007-08-06 | 2009-03-04 | 삼성전기주식회사 | 적층형 칩 커패시터 |
JP5217692B2 (ja) * | 2008-07-02 | 2013-06-19 | 株式会社村田製作所 | 積層セラミック電子部品 |
KR100992286B1 (ko) * | 2008-10-10 | 2010-11-05 | 삼성전기주식회사 | 적층형 칩 커패시터 |
CN102110684B (zh) * | 2009-12-24 | 2014-03-12 | 中芯国际集成电路制造(北京)有限公司 | 半导体电容装置 |
JP5201223B2 (ja) * | 2011-01-28 | 2013-06-05 | 株式会社村田製作所 | 電子部品及び基板モジュール |
KR20130126812A (ko) | 2012-04-25 | 2013-11-21 | 삼성전기주식회사 | 에너지 저장 장치 |
KR102069627B1 (ko) * | 2013-10-31 | 2020-01-23 | 삼성전기주식회사 | 복합 전자부품 및 그 실장 기판 |
KR101548813B1 (ko) | 2013-11-06 | 2015-08-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR102086481B1 (ko) | 2014-04-16 | 2020-03-09 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 적층 세라믹 커패시터가 실장된 회로 기판 |
KR101707729B1 (ko) * | 2015-03-09 | 2017-02-17 | 성균관대학교산학협력단 | 적층 커패시터 패키지 |
CN105719831A (zh) * | 2015-04-22 | 2016-06-29 | 周景振 | 集成构造型介电平面式高能谐振电容器 |
CN105469986A (zh) * | 2015-12-25 | 2016-04-06 | 青岛海特新蓝生物科技有限公司 | 阻燃多层电容 |
KR101867982B1 (ko) * | 2016-07-20 | 2018-06-18 | 삼성전기주식회사 | 커패시터 및 그 실장 기판 |
KR102494324B1 (ko) * | 2016-07-27 | 2023-02-01 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
KR102632349B1 (ko) * | 2016-09-05 | 2024-02-02 | 삼성전기주식회사 | 커패시터 부품 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10270282A (ja) | 1997-03-21 | 1998-10-09 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサ |
US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
US6542352B1 (en) * | 1997-12-09 | 2003-04-01 | Daniel Devoe | Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias |
JP2001189234A (ja) * | 1999-12-28 | 2001-07-10 | Tdk Corp | 積層コンデンサ |
JP4332634B2 (ja) * | 2000-10-06 | 2009-09-16 | Tdk株式会社 | 積層型電子部品 |
KR100384113B1 (ko) * | 2000-11-08 | 2003-05-14 | 주식회사 이노칩테크놀로지 | 고주파 저항-커패시터 복합 칩 및 그 제조 방법 |
US6532143B2 (en) * | 2000-12-29 | 2003-03-11 | Intel Corporation | Multiple tier array capacitor |
JP4461641B2 (ja) * | 2001-05-30 | 2010-05-12 | 三菱マテリアル株式会社 | 積層型チップサーミスタ及びその製造方法 |
US6496355B1 (en) * | 2001-10-04 | 2002-12-17 | Avx Corporation | Interdigitated capacitor with ball grid array (BGA) terminations |
-
2004
- 2004-12-03 KR KR1020040101411A patent/KR100714608B1/ko not_active IP Right Cessation
-
2005
- 2005-11-15 US US11/272,877 patent/US7292430B2/en not_active Expired - Fee Related
- 2005-11-18 JP JP2005333782A patent/JP4971626B2/ja not_active Expired - Fee Related
- 2005-11-30 CN CN200510125876XA patent/CN1783376B/zh not_active Expired - Fee Related
-
2010
- 2010-02-15 JP JP2010030375A patent/JP4972175B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1783376A (zh) | 2006-06-07 |
JP2010141350A (ja) | 2010-06-24 |
KR20060062543A (ko) | 2006-06-12 |
JP2006165538A (ja) | 2006-06-22 |
US20060120018A1 (en) | 2006-06-08 |
CN1783376B (zh) | 2010-12-08 |
KR100714608B1 (ko) | 2007-05-07 |
US7292430B2 (en) | 2007-11-06 |
JP4971626B2 (ja) | 2012-07-11 |
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