JP4971693B2 - 金属板抵抗器 - Google Patents
金属板抵抗器 Download PDFInfo
- Publication number
- JP4971693B2 JP4971693B2 JP2006161511A JP2006161511A JP4971693B2 JP 4971693 B2 JP4971693 B2 JP 4971693B2 JP 2006161511 A JP2006161511 A JP 2006161511A JP 2006161511 A JP2006161511 A JP 2006161511A JP 4971693 B2 JP4971693 B2 JP 4971693B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- alloy
- thermal expansion
- metal plate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 43
- 239000002184 metal Substances 0.000 title claims description 43
- 239000000956 alloy Substances 0.000 claims description 77
- 229910045601 alloy Inorganic materials 0.000 claims description 75
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 239000000919 ceramic Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 229910001374 Invar Inorganic materials 0.000 description 11
- 238000001514 detection method Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- 229910000990 Ni alloy Inorganic materials 0.000 description 7
- 238000004088 simulation Methods 0.000 description 6
- 229910000599 Cr alloy Inorganic materials 0.000 description 5
- 239000000788 chromium alloy Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 229910000640 Fe alloy Inorganic materials 0.000 description 4
- 229910000914 Mn alloy Inorganic materials 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910001313 Cobalt-iron alloy Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- HPDFFVBPXCTEDN-UHFFFAOYSA-N copper manganese Chemical compound [Mn].[Cu] HPDFFVBPXCTEDN-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
上層低熱膨張合金層:抵抗合金層:下層低熱膨張合金層
=3.1:3.8:3.1
とした。
α:熱膨張係数
E:ヤング率
V:体積率
すなわち、抵抗体10の熱膨張係数は、抵抗合金11と低熱膨張合金12の性質(熱膨張係数、ヤング率、体積率)から算出することができる。
上層低熱膨張合金層:抵抗合金層:下層低熱膨張合金層
=2.5:5.0:2.5
とした。
上層低熱膨張合金層:抵抗合金層:下層低熱膨張合金層
=2.5:5.0:2.5
とした。
11 抵抗合金
12 低熱膨張合金
13 電極
14 電極部分
15 抵抗体部分
16 粗調整スリット
17 電流端子
18 電圧検出端子
19 微調整スリット
20 抵抗体薄板
21 薄板
22 クラッド材
X 切欠き部幅
Claims (4)
- 板状の抵抗体と、該抵抗体の両端部に形成された電極と、を備えた金属板抵抗器であって、
前記電極は銅であり前記抵抗体と厚み方向に重なるように形成され、
前記抵抗体と前記電極とが重なる部分に、前記金属板抵抗器の電極が形成された両端方向に開放するように、且つ、前記電極を分離しない切欠き部を備えることを特徴とする金属板抵抗器。 - 前記抵抗体は、抵抗合金と、該抵抗合金よりも低い熱膨張係数を有する低熱膨張合金とを積層したものであることを特徴とする請求項1記載の金属板抵抗器。
- 前記切欠き部は、第1の切欠き部と、該第1の切欠き部よりも幅が狭い該第2の切欠き部とからなることを特徴とする請求項1記載の金属板抵抗器。
- 前記切欠き部により、前記電極に広幅部分と狭幅部分とが形成されることを特徴とする請求項1記載の金属板抵抗器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006161511A JP4971693B2 (ja) | 2006-06-09 | 2006-06-09 | 金属板抵抗器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006161511A JP4971693B2 (ja) | 2006-06-09 | 2006-06-09 | 金属板抵抗器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007329421A JP2007329421A (ja) | 2007-12-20 |
JP4971693B2 true JP4971693B2 (ja) | 2012-07-11 |
Family
ID=38929673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006161511A Active JP4971693B2 (ja) | 2006-06-09 | 2006-06-09 | 金属板抵抗器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4971693B2 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8242878B2 (en) | 2008-09-05 | 2012-08-14 | Vishay Dale Electronics, Inc. | Resistor and method for making same |
WO2011028870A1 (en) * | 2009-09-04 | 2011-03-10 | Vishay Dale Electronics, Inc. | Resistor with temperature coefficient of resistance (tcr) compensation |
JP6892339B2 (ja) * | 2012-01-06 | 2021-06-23 | ローム株式会社 | 抵抗器 |
JP2013157596A (ja) * | 2012-01-06 | 2013-08-15 | Rohm Co Ltd | チップ抵抗器、およびチップ抵抗器の製造方法 |
US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
JP6893296B2 (ja) * | 2016-03-29 | 2021-06-23 | パナソニックIpマネジメント株式会社 | 金属板抵抗器 |
US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
US11415601B2 (en) * | 2018-12-21 | 2022-08-16 | Cyntec Co., Ltd. | Resistor having low temperature coefficient of resistance |
EP4036939A4 (en) * | 2019-11-18 | 2022-10-05 | Suncall Corporation | SHUNT RESISTOR |
JP7491723B2 (ja) | 2020-04-20 | 2024-05-28 | Koa株式会社 | シャント抵抗器 |
US20230170112A1 (en) | 2020-04-27 | 2023-06-01 | Koa Corporation | Shunt resistor, method for manufacturing shunt resistor, and current detection device |
JP7430121B2 (ja) | 2020-08-07 | 2024-02-09 | Koa株式会社 | シャント抵抗器に用いられる抵抗合金、抵抗合金のシャント抵抗器への使用及び抵抗合金を用いたシャント抵抗器 |
IL300693B2 (en) | 2020-08-20 | 2024-02-01 | Vishay Dale Electronics Llc | Resistors, current sensing resistors, battery transitions, transition resistors, and flattening for their production |
JP7158053B2 (ja) | 2020-08-31 | 2022-10-21 | Koa株式会社 | シャント抵抗器に用いられる抵抗合金、抵抗合金のシャント抵抗器への使用及び抵抗合金を用いたシャント抵抗器 |
JP2023087730A (ja) | 2021-12-14 | 2023-06-26 | Koa株式会社 | シャント抵抗器および電流検出装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0820239B2 (ja) * | 1987-07-07 | 1996-03-04 | 日産自動車株式会社 | 車体計測方法 |
JPH0325994A (ja) * | 1989-06-23 | 1991-02-04 | Nec Corp | 混成集積回路 |
US5287083A (en) * | 1992-03-30 | 1994-02-15 | Dale Electronics, Inc. | Bulk metal chip resistor |
JPH10289803A (ja) * | 1997-04-16 | 1998-10-27 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
US5999085A (en) * | 1998-02-13 | 1999-12-07 | Vishay Dale Electronics, Inc. | Surface mounted four terminal resistor |
JP2003007503A (ja) * | 2001-06-18 | 2003-01-10 | Canon Inc | 電子部品及び電子部品と回路基板のはんだ付け検査方法 |
JP4391918B2 (ja) * | 2004-10-13 | 2009-12-24 | コーア株式会社 | 電流検出用抵抗器 |
-
2006
- 2006-06-09 JP JP2006161511A patent/JP4971693B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2007329421A (ja) | 2007-12-20 |
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