JP4673750B2 - 金属板抵抗器および抵抗体 - Google Patents
金属板抵抗器および抵抗体 Download PDFInfo
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- JP4673750B2 JP4673750B2 JP2006004646A JP2006004646A JP4673750B2 JP 4673750 B2 JP4673750 B2 JP 4673750B2 JP 2006004646 A JP2006004646 A JP 2006004646A JP 2006004646 A JP2006004646 A JP 2006004646A JP 4673750 B2 JP4673750 B2 JP 4673750B2
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- Japan
- Prior art keywords
- alloy layer
- resistor
- alloy
- resistance
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052751 metal Inorganic materials 0.000 title claims description 31
- 239000002184 metal Substances 0.000 title claims description 31
- 239000000956 alloy Substances 0.000 claims description 98
- 229910045601 alloy Inorganic materials 0.000 claims description 97
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 9
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 7
- 239000000788 chromium alloy Substances 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 5
- 229910000914 Mn alloy Inorganic materials 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 2
- 239000007790 solid phase Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 15
- 229910001374 Invar Inorganic materials 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000896 Manganin Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Images
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- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
上層低膨張合金層:抵抗合金層:下層低膨張合金層=3.1:3.8:3.1
とした。
α:熱膨張係数
E:ヤング率
V:体積率
すなわち、抵抗体10の熱膨張係数は、抵抗合金層11と低膨張合金層12の性質(熱膨張係数、ヤング率、体積率)から算出することができる。
上層低膨張合金層:抵抗合金層:下層低膨張合金層=2.5:5.0:2.5
とした。
上層低膨張合金層:抵抗合金層:下層低膨張合金層=2.5:5.0:2.5
とした。
11 抵抗合金層
12 低膨張合金層
13 電極
Claims (9)
- 抵抗合金層と、該抵抗合金層よりも低い熱膨張係数の低膨張合金層とを積層した抵抗体と、
前記抵抗体の両端部に接合した電極と、を備えたことを特徴とする金属板抵抗器。 - 前記低膨張合金層の熱膨張係数は7×10−6/K以下であることを特徴とする請求項1記載の金属板抵抗器。
- 前記抵抗体は、前記抵抗合金層を前記低膨張合金層でサンドイッチ状に挟んだものであることを特徴とする請求項1または2記載の金属板抵抗器。
- 前記抵抗合金層は、銅・ニッケル系合金、銅・マンガン系合金、鉄・クロム系合金、ニッケル・クロム系合金のいずれかからなることを特徴とする請求項1乃至3のいずれかに記載の金属板抵抗器。
- 前記低膨張合金層は、ニッケル・鉄系合金、または、ニッケル・コバルト・鉄系合金のいずれかからなることを特徴とする請求項1乃至4のいずれかに記載の金属板抵抗器。
- 前記抵抗合金層と、前記低膨張合金層との接合は、拡散接合または固相接合によるものであることを特徴とする請求項1乃至5のいずれかに記載の金属板抵抗器。
- 抵抗合金層と、該抵抗合金層よりも低い熱膨張係数の低膨張合金層とを積層したことを特徴とする抵抗体。
- 前記低膨張合金層の熱膨張係数は7×10−6/K以下であることを特徴とする請求項7記載の抵抗体。
- 前記抵抗合金層を前記低膨張合金層でサンドイッチ状に挟んだことを特徴とする請求項7または8記載の抵抗体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006004646A JP4673750B2 (ja) | 2006-01-12 | 2006-01-12 | 金属板抵抗器および抵抗体 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2006004646A JP4673750B2 (ja) | 2006-01-12 | 2006-01-12 | 金属板抵抗器および抵抗体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007189000A JP2007189000A (ja) | 2007-07-26 |
JP4673750B2 true JP4673750B2 (ja) | 2011-04-20 |
Family
ID=38343969
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---|---|---|---|
JP2006004646A Active JP4673750B2 (ja) | 2006-01-12 | 2006-01-12 | 金属板抵抗器および抵抗体 |
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Country | Link |
---|---|
JP (1) | JP4673750B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5716228B2 (ja) * | 2010-03-29 | 2015-05-13 | コーア株式会社 | 抵抗体、抵抗器、およびその製造方法 |
DE102012013036B4 (de) * | 2012-06-29 | 2015-04-02 | Isabellenhütte Heusler Gmbh & Co. Kg | Widerstand, insbesondere niederohmiger Strommesswiderstand, sowie Beschichtungsverfahren hierzu |
US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
CN114889245A (zh) * | 2022-04-16 | 2022-08-12 | 上海殷菲合金材料有限公司 | 一种复合金属片及其制备方法和应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019694A (ja) * | 2003-06-26 | 2005-01-20 | Mitsubishi Materials Corp | パワーモジュール |
JP2005286167A (ja) * | 2004-03-30 | 2005-10-13 | Koa Corp | 抵抗用積層合金及びその製造方法 |
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- 2006-01-12 JP JP2006004646A patent/JP4673750B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019694A (ja) * | 2003-06-26 | 2005-01-20 | Mitsubishi Materials Corp | パワーモジュール |
JP2005286167A (ja) * | 2004-03-30 | 2005-10-13 | Koa Corp | 抵抗用積層合金及びその製造方法 |
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