JP4965102B2 - ビアホール充填用導電性ペースト組成物 - Google Patents

ビアホール充填用導電性ペースト組成物 Download PDF

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Publication number
JP4965102B2
JP4965102B2 JP2005285481A JP2005285481A JP4965102B2 JP 4965102 B2 JP4965102 B2 JP 4965102B2 JP 2005285481 A JP2005285481 A JP 2005285481A JP 2005285481 A JP2005285481 A JP 2005285481A JP 4965102 B2 JP4965102 B2 JP 4965102B2
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Japan
Prior art keywords
conductive paste
wiring board
paste composition
particles
binder component
Prior art date
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Expired - Fee Related
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JP2005285481A
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Japanese (ja)
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JP2007096120A5 (enExample
JP2007096120A (ja
Inventor
紳月 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
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Mitsubishi Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Mitsubishi Plastics Inc filed Critical Mitsubishi Plastics Inc
Priority to JP2005285481A priority Critical patent/JP4965102B2/ja
Publication of JP2007096120A publication Critical patent/JP2007096120A/ja
Publication of JP2007096120A5 publication Critical patent/JP2007096120A5/ja
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Publication of JP4965102B2 publication Critical patent/JP4965102B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2005285481A 2005-09-29 2005-09-29 ビアホール充填用導電性ペースト組成物 Expired - Fee Related JP4965102B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005285481A JP4965102B2 (ja) 2005-09-29 2005-09-29 ビアホール充填用導電性ペースト組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005285481A JP4965102B2 (ja) 2005-09-29 2005-09-29 ビアホール充填用導電性ペースト組成物

Publications (3)

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JP2007096120A JP2007096120A (ja) 2007-04-12
JP2007096120A5 JP2007096120A5 (enExample) 2007-07-12
JP4965102B2 true JP4965102B2 (ja) 2012-07-04

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Family Applications (1)

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JP2005285481A Expired - Fee Related JP4965102B2 (ja) 2005-09-29 2005-09-29 ビアホール充填用導電性ペースト組成物

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JP (1) JP4965102B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027300A (ja) * 2008-07-16 2010-02-04 Mitsubishi Chemicals Corp 導電性ペースト、導電性ペーストの製造方法、および、多層配線基板
JP5424632B2 (ja) * 2008-12-19 2014-02-26 キヤノン株式会社 インクジェット記録ヘッド用基板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03287680A (ja) * 1990-04-03 1991-12-18 Toagosei Chem Ind Co Ltd 有機厚膜ペースト組成物
JPH08302273A (ja) * 1995-05-12 1996-11-19 Toagosei Co Ltd ワニスおよびその応用
JP3514647B2 (ja) * 1999-01-05 2004-03-31 三菱樹脂株式会社 多層プリント配線板およびその製造方法
JP2000223836A (ja) * 1999-01-28 2000-08-11 Kyocera Corp 多層配線基板およびその製造方法
JP2000323804A (ja) * 1999-05-07 2000-11-24 Toagosei Co Ltd プリント配線板用銅張り積層板
JP2003092467A (ja) * 2001-09-19 2003-03-28 Tatsuta Electric Wire & Cable Co Ltd プリント配線基板およびその製法

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Publication number Publication date
JP2007096120A (ja) 2007-04-12

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