JP2007096120A5 - - Google Patents
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- Publication number
- JP2007096120A5 JP2007096120A5 JP2005285481A JP2005285481A JP2007096120A5 JP 2007096120 A5 JP2007096120 A5 JP 2007096120A5 JP 2005285481 A JP2005285481 A JP 2005285481A JP 2005285481 A JP2005285481 A JP 2005285481A JP 2007096120 A5 JP2007096120 A5 JP 2007096120A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- particles
- paste composition
- wiring board
- binder component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 14
- 239000002245 particle Substances 0.000 claims 14
- 229910045601 alloy Inorganic materials 0.000 claims 8
- 239000000956 alloy Substances 0.000 claims 8
- 239000011230 binding agent Substances 0.000 claims 8
- 239000002923 metal particle Substances 0.000 claims 7
- 239000000843 powder Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000011342 resin composition Substances 0.000 claims 4
- 229910000679 solder Inorganic materials 0.000 claims 4
- 229920005992 thermoplastic resin Polymers 0.000 claims 4
- 230000008018 melting Effects 0.000 claims 3
- 238000002844 melting Methods 0.000 claims 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical group O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 2
- 150000003923 2,5-pyrrolediones Chemical class 0.000 claims 2
- 229910052797 bismuth Inorganic materials 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 230000004927 fusion Effects 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 229910017944 Ag—Cu Inorganic materials 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Natural products C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 1
- 229910020888 Sn-Cu Inorganic materials 0.000 claims 1
- 229910020935 Sn-Sb Inorganic materials 0.000 claims 1
- 229910020994 Sn-Zn Inorganic materials 0.000 claims 1
- 229910019204 Sn—Cu Inorganic materials 0.000 claims 1
- 229910008757 Sn—Sb Inorganic materials 0.000 claims 1
- 229910009069 Sn—Zn Inorganic materials 0.000 claims 1
- 229910007563 Zn—Bi Inorganic materials 0.000 claims 1
- -1 dimethallyl bisphenol A Chemical compound 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005285481A JP4965102B2 (ja) | 2005-09-29 | 2005-09-29 | ビアホール充填用導電性ペースト組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005285481A JP4965102B2 (ja) | 2005-09-29 | 2005-09-29 | ビアホール充填用導電性ペースト組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007096120A JP2007096120A (ja) | 2007-04-12 |
| JP2007096120A5 true JP2007096120A5 (enExample) | 2007-07-12 |
| JP4965102B2 JP4965102B2 (ja) | 2012-07-04 |
Family
ID=37981437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005285481A Expired - Fee Related JP4965102B2 (ja) | 2005-09-29 | 2005-09-29 | ビアホール充填用導電性ペースト組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4965102B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010027300A (ja) * | 2008-07-16 | 2010-02-04 | Mitsubishi Chemicals Corp | 導電性ペースト、導電性ペーストの製造方法、および、多層配線基板 |
| JP5424632B2 (ja) * | 2008-12-19 | 2014-02-26 | キヤノン株式会社 | インクジェット記録ヘッド用基板の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03287680A (ja) * | 1990-04-03 | 1991-12-18 | Toagosei Chem Ind Co Ltd | 有機厚膜ペースト組成物 |
| JPH08302273A (ja) * | 1995-05-12 | 1996-11-19 | Toagosei Co Ltd | ワニスおよびその応用 |
| JP3514647B2 (ja) * | 1999-01-05 | 2004-03-31 | 三菱樹脂株式会社 | 多層プリント配線板およびその製造方法 |
| JP2000223836A (ja) * | 1999-01-28 | 2000-08-11 | Kyocera Corp | 多層配線基板およびその製造方法 |
| JP2000323804A (ja) * | 1999-05-07 | 2000-11-24 | Toagosei Co Ltd | プリント配線板用銅張り積層板 |
| JP2003092467A (ja) * | 2001-09-19 | 2003-03-28 | Tatsuta Electric Wire & Cable Co Ltd | プリント配線基板およびその製法 |
-
2005
- 2005-09-29 JP JP2005285481A patent/JP4965102B2/ja not_active Expired - Fee Related
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