JP2007096120A5 - - Google Patents

Claims (6)

  An insulating substrate made of a thermoplastic resin composition, a wiring board comprising a conductor pattern provided on the insulating substrate, and a via hole filled with a conductive paste composition formed on the insulating substrate. A multi-layer wiring board in which a plurality of wiring boards are superposed on each other or alternately superposed on a wiring board made of a material other than a thermoplastic resin composition, which is different from the wiring board, and laminated or sequentially laminated by thermal fusion. In the conductive paste composition filled in the via hole,
  A conductive powder and a binder component, wherein a mass ratio of the conductive powder and the binder component is 90/10 or more and less than 98/2,
  The conductive powder comprises first alloy particles and second metal particles,
The first alloy particles are non-lead solder particles having a melting point of 180 ° C. or higher and lower than 260 ° C .;
The second metal particles are at least one selected from the group consisting of Au, Ag, and Cu, and the mass ratio of the first alloy particles to the second metal particles is 76/24 or more 90 / Less than 10,
  The binder component is a mixture containing maleimides,
A conductive paste composition for filling via holes. An insulating substrate made of a thermoplastic resin composition, a wiring board comprising a conductor pattern provided on the insulating substrate, and a via hole filled with a conductive paste composition is formed on the insulating substrate. A multilayer wiring board in which a plurality of wiring boards are superposed on each other or alternately superposed on a wiring board made of a material other than a thermoplastic resin composition, which is different from the wiring board, and laminated or sequentially laminated by thermal fusion. In the conductive paste composition filled in the via hole,
A conductive powder and a binder component, wherein a mass ratio of the conductive powder and the binder component is 90/10 or more and less than 98/2;
The conductive powder comprises first alloy particles and second metal particles,
The first alloy particles are non-lead solder particles having a melting point of 180 ° C. or higher and lower than 260 ° C .;
The second metal particles are at least one selected from the group consisting of Au, Ag, and Cu, and the mass ratio of the first alloy particles to the second metal particles is 76/24 or more 90 / Less than 10,
The binder component is a mixture of polymerizable monomers that are cured by heating, and the melting point of the lead-free solder particles is included in the curing temperature range of the binder component.
A conductive paste composition for filling via holes. The conductive paste composition for filling via holes according to claim 1 or 2 , wherein the binder component is a mixture of an alkenylphenol compound and maleimides. 4. The conductive paste for filling via holes according to claim 1, wherein an average particle size of the first alloy particles and the second metal particles is 10 μm or less, and an average particle size difference is 2 μm or less. Composition. The first alloy particles are Sn—Cu, Sn—Sb, Sn—Ag—Cu, Sn—Ag—Cu—Bi, Sn—Ag—In, Sn—Ag—In—Bi, Sn—Zn, Sn— The conductive paste composition for filling via holes according to any one of claims 1 to 4 , wherein the conductive paste composition is filled with one or more lead-free solder particles selected from the group consisting of Zn-Bi and Sn-Ag-Bi. The alkenylphenol compound is dimethallylbisphenol A,
The maleimide is bis (4-maleimidophenyl) methane;
The conductive paste composition for filling via holes according to any one of claims 3 to 5 , wherein a molar ratio of the dimethallyl bisphenol A and the bis (4-maleimidophenyl) methane is 30/70 or more and less than 70/30. .