JP4960362B2 - バッチ堆積ツールおよび圧縮ボート - Google Patents

バッチ堆積ツールおよび圧縮ボート Download PDF

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Publication number
JP4960362B2
JP4960362B2 JP2008529102A JP2008529102A JP4960362B2 JP 4960362 B2 JP4960362 B2 JP 4960362B2 JP 2008529102 A JP2008529102 A JP 2008529102A JP 2008529102 A JP2008529102 A JP 2008529102A JP 4960362 B2 JP4960362 B2 JP 4960362B2
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JP
Japan
Prior art keywords
substrate
boat
support
holder
compression
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2008529102A
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English (en)
Japanese (ja)
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JP2009506573A (ja
JP2009506573A5 (https=
Inventor
ジョセフ ユドフスキー，
ロバート シー． クック，
ニアー メリー，
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Publication of JP2009506573A5 publication Critical patent/JP2009506573A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/127—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by the substrate support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting
JP2008529102A 2005-08-31 2006-08-17 バッチ堆積ツールおよび圧縮ボート Expired - Fee Related JP4960362B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/216,969 2005-08-31
US11/216,969 US7748542B2 (en) 2005-08-31 2005-08-31 Batch deposition tool and compressed boat
PCT/US2006/032413 WO2007027458A2 (en) 2005-08-31 2006-08-17 Batch deposition tool and compressed boat

Publications (3)

Publication Number Publication Date
JP2009506573A JP2009506573A (ja) 2009-02-12
JP2009506573A5 JP2009506573A5 (https=) 2011-08-18
JP4960362B2 true JP4960362B2 (ja) 2012-06-27

Family

ID=37809363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008529102A Expired - Fee Related JP4960362B2 (ja) 2005-08-31 2006-08-17 バッチ堆積ツールおよび圧縮ボート

Country Status (6)

Country Link
US (1) US7748542B2 (https=)
JP (1) JP4960362B2 (https=)
KR (1) KR101032217B1 (https=)
CN (1) CN101248215B (https=)
TW (1) TWI372435B (https=)
WO (1) WO2007027458A2 (https=)

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US8440048B2 (en) 2009-01-28 2013-05-14 Asm America, Inc. Load lock having secondary isolation chamber
JP5857776B2 (ja) * 2011-04-08 2016-02-10 東京エレクトロン株式会社 基板保持具及び縦型熱処理装置並びに縦型熱処理装置の運転方法
US9257319B2 (en) 2011-06-03 2016-02-09 Tel Nexx, Inc. Parallel single substrate processing system with alignment features on a process section frame
EP2802424A4 (en) * 2012-01-10 2015-12-23 Hzo Inc PRE-DELIVERY, MATERIAL PROCESSING SYSTEMS WITH CONFIGURED PRE-DELIVERY FOR USE AND RELATED METHODS
US9153466B2 (en) * 2012-04-26 2015-10-06 Asm Ip Holding B.V. Wafer boat
US9493874B2 (en) * 2012-11-15 2016-11-15 Cypress Semiconductor Corporation Distribution of gas over a semiconductor wafer in batch processing
CN103743239B (zh) * 2013-12-27 2015-05-20 深圳市华星光电技术有限公司 石英卡夹装置及其制作方法与带该石英卡夹装置的oled高温炉
CN105102087A (zh) * 2014-03-01 2015-11-25 Hzo股份有限公司 优化通过材料沉积设备的前驱材料的蒸发的船形器皿
CN104022059B (zh) * 2014-04-22 2017-01-25 上海华力微电子有限公司 一种半导体炉管的晶舟
JP6468901B2 (ja) * 2015-03-19 2019-02-13 東京エレクトロン株式会社 基板処理装置
TWI663671B (zh) * 2015-04-30 2019-06-21 環球晶圓股份有限公司 晶圓轉換裝置及其晶圓轉換方法
EP3559307B1 (en) 2017-02-08 2022-08-03 Picosun Oy Deposition or cleaning apparatus with movable structure and method of operation
JP6846993B2 (ja) * 2017-06-19 2021-03-24 東京エレクトロン株式会社 基板保持具及びこれを用いた基板処理装置
US11075105B2 (en) 2017-09-21 2021-07-27 Applied Materials, Inc. In-situ apparatus for semiconductor process module
JP7030604B2 (ja) * 2018-04-19 2022-03-07 三菱電機株式会社 ウエハボートおよびその製造方法
TWI740175B (zh) * 2019-07-05 2021-09-21 弘塑科技股份有限公司 卡匣旋轉設備和卡匣
KR102782608B1 (ko) * 2019-10-14 2025-03-14 삼성전자주식회사 반도체 제조 장비
KR102777080B1 (ko) * 2020-06-05 2025-03-05 삼성전자주식회사 개폐형 기판 수용 카세트 및 그 시스템

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US4191295A (en) * 1978-08-14 1980-03-04 Rca Corporation Processing rack
US4375975A (en) * 1980-06-04 1983-03-08 Mgi International Inc. Centrifugal separator
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US4679689A (en) * 1985-09-03 1987-07-14 General Signal Corporation Processing, shipping and/or storage container for photomasks and/or wafers
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
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KR100226489B1 (ko) 1996-12-28 1999-10-15 김영환 웨이퍼 지지 및 이송 기구
JPH10303136A (ja) * 1997-04-23 1998-11-13 Kokusai Electric Co Ltd 半導体製造装置の縦型炉
US20030049372A1 (en) 1997-08-11 2003-03-13 Cook Robert C. High rate deposition at low pressures in a small batch reactor
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JP3510510B2 (ja) * 1998-12-04 2004-03-29 東芝セラミックス株式会社 石英製半導体ウェーハボートの製造用治具およびこれを用いた製造方法
JP2000235974A (ja) * 1999-02-12 2000-08-29 Toshiba Microelectronics Corp 半導体製造装置
JP2001351871A (ja) 2000-06-09 2001-12-21 Asm Japan Kk 半導体製造装置
JP2002043229A (ja) 2000-07-25 2002-02-08 Hitachi Kokusai Electric Inc 半導体製造装置
KR100410982B1 (ko) 2001-01-18 2003-12-18 삼성전자주식회사 반도체 제조장치용 보트
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JP2004103990A (ja) 2002-09-12 2004-04-02 Hitachi Kokusai Electric Inc 半導体製造装置および半導体装置の製造方法
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US7682455B2 (en) * 2003-07-11 2010-03-23 Tec-Sem Ag Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components
TWI268570B (en) * 2003-08-20 2006-12-11 Innolux Display Corp Substrate cassette
JP2005228991A (ja) * 2004-02-13 2005-08-25 Hitachi Kokusai Electric Inc 基板処理装置

Also Published As

Publication number Publication date
JP2009506573A (ja) 2009-02-12
WO2007027458A3 (en) 2007-09-27
US20070059128A1 (en) 2007-03-15
CN101248215B (zh) 2010-07-28
KR101032217B1 (ko) 2011-05-02
TW200715449A (en) 2007-04-16
WO2007027458A2 (en) 2007-03-08
CN101248215A (zh) 2008-08-20
TWI372435B (en) 2012-09-11
KR20080035695A (ko) 2008-04-23
US7748542B2 (en) 2010-07-06

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