KR101032217B1 - 배치 증착 도구 및 압축된 보트 - Google Patents

배치 증착 도구 및 압축된 보트 Download PDF

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Publication number
KR101032217B1
KR101032217B1 KR1020087006178A KR20087006178A KR101032217B1 KR 101032217 B1 KR101032217 B1 KR 101032217B1 KR 1020087006178 A KR1020087006178 A KR 1020087006178A KR 20087006178 A KR20087006178 A KR 20087006178A KR 101032217 B1 KR101032217 B1 KR 101032217B1
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KR
South Korea
Prior art keywords
substrate
boat
support
holder
substrate holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020087006178A
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English (en)
Korean (ko)
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KR20080035695A (ko
Inventor
조셉 유도브스키
로버트 씨. 쿡
니르 메리
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20080035695A publication Critical patent/KR20080035695A/ko
Application granted granted Critical
Publication of KR101032217B1 publication Critical patent/KR101032217B1/ko
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/127—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by the substrate support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020087006178A 2005-08-31 2006-08-17 배치 증착 도구 및 압축된 보트 Expired - Fee Related KR101032217B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/216,969 2005-08-31
US11/216,969 US7748542B2 (en) 2005-08-31 2005-08-31 Batch deposition tool and compressed boat

Publications (2)

Publication Number Publication Date
KR20080035695A KR20080035695A (ko) 2008-04-23
KR101032217B1 true KR101032217B1 (ko) 2011-05-02

Family

ID=37809363

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087006178A Expired - Fee Related KR101032217B1 (ko) 2005-08-31 2006-08-17 배치 증착 도구 및 압축된 보트

Country Status (6)

Country Link
US (1) US7748542B2 (https=)
JP (1) JP4960362B2 (https=)
KR (1) KR101032217B1 (https=)
CN (1) CN101248215B (https=)
TW (1) TWI372435B (https=)
WO (1) WO2007027458A2 (https=)

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FR2902235B1 (fr) * 2006-06-09 2008-10-31 Alcatel Sa Dispositif de transport, de stockage et de transfert de substrats
US8440048B2 (en) 2009-01-28 2013-05-14 Asm America, Inc. Load lock having secondary isolation chamber
JP5857776B2 (ja) * 2011-04-08 2016-02-10 東京エレクトロン株式会社 基板保持具及び縦型熱処理装置並びに縦型熱処理装置の運転方法
US9257319B2 (en) 2011-06-03 2016-02-09 Tel Nexx, Inc. Parallel single substrate processing system with alignment features on a process section frame
EP2802424A4 (en) * 2012-01-10 2015-12-23 Hzo Inc PRE-DELIVERY, MATERIAL PROCESSING SYSTEMS WITH CONFIGURED PRE-DELIVERY FOR USE AND RELATED METHODS
US9153466B2 (en) * 2012-04-26 2015-10-06 Asm Ip Holding B.V. Wafer boat
US9493874B2 (en) * 2012-11-15 2016-11-15 Cypress Semiconductor Corporation Distribution of gas over a semiconductor wafer in batch processing
CN103743239B (zh) * 2013-12-27 2015-05-20 深圳市华星光电技术有限公司 石英卡夹装置及其制作方法与带该石英卡夹装置的oled高温炉
CN105102087A (zh) * 2014-03-01 2015-11-25 Hzo股份有限公司 优化通过材料沉积设备的前驱材料的蒸发的船形器皿
CN104022059B (zh) * 2014-04-22 2017-01-25 上海华力微电子有限公司 一种半导体炉管的晶舟
JP6468901B2 (ja) * 2015-03-19 2019-02-13 東京エレクトロン株式会社 基板処理装置
TWI663671B (zh) * 2015-04-30 2019-06-21 環球晶圓股份有限公司 晶圓轉換裝置及其晶圓轉換方法
EP3559307B1 (en) 2017-02-08 2022-08-03 Picosun Oy Deposition or cleaning apparatus with movable structure and method of operation
JP6846993B2 (ja) * 2017-06-19 2021-03-24 東京エレクトロン株式会社 基板保持具及びこれを用いた基板処理装置
US11075105B2 (en) 2017-09-21 2021-07-27 Applied Materials, Inc. In-situ apparatus for semiconductor process module
JP7030604B2 (ja) * 2018-04-19 2022-03-07 三菱電機株式会社 ウエハボートおよびその製造方法
TWI740175B (zh) * 2019-07-05 2021-09-21 弘塑科技股份有限公司 卡匣旋轉設備和卡匣
KR102782608B1 (ko) * 2019-10-14 2025-03-14 삼성전자주식회사 반도체 제조 장비
KR102777080B1 (ko) * 2020-06-05 2025-03-05 삼성전자주식회사 개폐형 기판 수용 카세트 및 그 시스템

Citations (1)

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US20040052618A1 (en) 2002-09-12 2004-03-18 Hitachi Kokusai Electric Inc. Semiconductor device producing apparatus and producing method of semiconductor device

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TWI268570B (en) * 2003-08-20 2006-12-11 Innolux Display Corp Substrate cassette
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US20040052618A1 (en) 2002-09-12 2004-03-18 Hitachi Kokusai Electric Inc. Semiconductor device producing apparatus and producing method of semiconductor device

Also Published As

Publication number Publication date
JP2009506573A (ja) 2009-02-12
WO2007027458A3 (en) 2007-09-27
US20070059128A1 (en) 2007-03-15
CN101248215B (zh) 2010-07-28
TW200715449A (en) 2007-04-16
WO2007027458A2 (en) 2007-03-08
CN101248215A (zh) 2008-08-20
TWI372435B (en) 2012-09-11
JP4960362B2 (ja) 2012-06-27
KR20080035695A (ko) 2008-04-23
US7748542B2 (en) 2010-07-06

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