JP4937815B2 - 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 - Google Patents
電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 Download PDFInfo
- Publication number
- JP4937815B2 JP4937815B2 JP2007092269A JP2007092269A JP4937815B2 JP 4937815 B2 JP4937815 B2 JP 4937815B2 JP 2007092269 A JP2007092269 A JP 2007092269A JP 2007092269 A JP2007092269 A JP 2007092269A JP 4937815 B2 JP4937815 B2 JP 4937815B2
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- Prior art keywords
- copper alloy
- mass
- cooling
- phase particles
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 38
- 239000012776 electronic material Substances 0.000 title claims description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229910018598 Si-Co Inorganic materials 0.000 title description 10
- 229910008453 Si—Co Inorganic materials 0.000 title description 10
- 239000002245 particle Substances 0.000 claims description 79
- 238000001816 cooling Methods 0.000 claims description 64
- 238000005098 hot rolling Methods 0.000 claims description 30
- 229910045601 alloy Inorganic materials 0.000 claims description 27
- 239000000956 alloy Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 16
- 230000032683 aging Effects 0.000 claims description 15
- 238000005096 rolling process Methods 0.000 claims description 13
- 238000005097 cold rolling Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 238000005266 casting Methods 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052790 beryllium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 31
- 239000000243 solution Substances 0.000 description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 24
- 239000011651 chromium Substances 0.000 description 22
- 239000002244 precipitate Substances 0.000 description 22
- 229910052710 silicon Inorganic materials 0.000 description 15
- 238000005452 bending Methods 0.000 description 14
- 229910021332 silicide Inorganic materials 0.000 description 14
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 13
- 229910052759 nickel Inorganic materials 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 9
- 229910017052 cobalt Inorganic materials 0.000 description 8
- 239000010941 cobalt Substances 0.000 description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 8
- 230000000630 rising effect Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 6
- 230000002411 adverse Effects 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 239000006104 solid solution Substances 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 229910020711 Co—Si Inorganic materials 0.000 description 4
- 229910018098 Ni-Si Inorganic materials 0.000 description 3
- 229910018529 Ni—Si Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 238000004881 precipitation hardening Methods 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000003483 aging Methods 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 230000014616 translation Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007092269A JP4937815B2 (ja) | 2007-03-30 | 2007-03-30 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
| TW097108444A TW200900515A (en) | 2007-03-30 | 2008-03-11 | Cu-Ni-Si-Co-based copper alloy for electronic material, and method for production thereof |
| CN2008800101753A CN101646791B (zh) | 2007-03-30 | 2008-03-28 | 电子材料用Cu-Ni-Si-Co系铜合金及其制造方法 |
| KR1020097021841A KR101159562B1 (ko) | 2007-03-30 | 2008-03-28 | 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ-Ｃｏ계 구리 합금 및 그 제조 방법 |
| PCT/JP2008/056142 WO2008123436A1 (ja) | 2007-03-30 | 2008-03-28 | 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007092269A JP4937815B2 (ja) | 2007-03-30 | 2007-03-30 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008248333A JP2008248333A (ja) | 2008-10-16 |
| JP4937815B2 true JP4937815B2 (ja) | 2012-05-23 |
Family
ID=39830921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007092269A Active JP4937815B2 (ja) | 2007-03-30 | 2007-03-30 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4937815B2 (ko) |
| KR (1) | KR101159562B1 (ko) |
| CN (1) | CN101646791B (ko) |
| TW (1) | TW200900515A (ko) |
| WO (1) | WO2008123436A1 (ko) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2194151B1 (en) | 2007-09-28 | 2014-08-13 | JX Nippon Mining & Metals Corporation | Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy |
| JP4596490B2 (ja) * | 2008-03-31 | 2010-12-08 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
| JP5319700B2 (ja) * | 2008-12-01 | 2013-10-16 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
| JP5261161B2 (ja) | 2008-12-12 | 2013-08-14 | Ｊｘ日鉱日石金属株式会社 | Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
| JP4708485B2 (ja) * | 2009-03-31 | 2011-06-22 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法 |
| JP5578827B2 (ja) * | 2009-10-13 | 2014-08-27 | Ｄｏｗａメタルテック株式会社 | 高強度銅合金板材およびその製造方法 |
| JP4677505B1 (ja) * | 2010-03-31 | 2011-04-27 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
| JP5961335B2 (ja) | 2010-04-05 | 2016-08-02 | Ｄｏｗａメタルテック株式会社 | 銅合金板材および電気・電子部品 |
| JP4830035B2 (ja) | 2010-04-14 | 2011-12-07 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系合金及びその製造方法 |
| JP4672804B1 (ja) | 2010-05-31 | 2011-04-20 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法 |
| JP4708497B1 (ja) * | 2010-06-03 | 2011-06-22 | Ｊｘ日鉱日石金属株式会社 | Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法 |
| JP4834781B1 (ja) | 2010-08-24 | 2011-12-14 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金 |
| JP2012072470A (ja) | 2010-09-29 | 2012-04-12 | Jx Nippon Mining & Metals Corp | 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法 |
| CN102560191A (zh) * | 2010-12-09 | 2012-07-11 | 北京有色金属研究总院 | 一种高性能弹性铜合金及其制备和加工方法 |
| JP5441876B2 (ja) * | 2010-12-13 | 2014-03-12 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
| JP5451674B2 (ja) | 2011-03-28 | 2014-03-26 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
| JP4799701B1 (ja) * | 2011-03-29 | 2011-10-26 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法 |
| JP6039999B2 (ja) | 2012-10-31 | 2016-12-07 | Ｄｏｗａメタルテック株式会社 | Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法 |
| JP5647703B2 (ja) * | 2013-02-14 | 2015-01-07 | Ｄｏｗａメタルテック株式会社 | 高強度Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法並びに通電部品 |
| CN106636734B (zh) * | 2015-10-30 | 2019-01-15 | 北京有色金属研究总院 | 高强度、高导电、高抗应力松弛铜合金弹性材料及其制备方法 |
| CN105316523A (zh) * | 2015-12-02 | 2016-02-10 | 苏州龙腾万里化工科技有限公司 | 一种磨削机调节器用耐用电阻合金 |
| CN109072341B (zh) * | 2016-03-31 | 2021-07-27 | 同和金属技术有限公司 | Cu-Ni-Si系铜合金板材和制造法 |
| CN105908015A (zh) * | 2016-05-05 | 2016-08-31 | 太仓小小精密模具有限公司 | 一种抗氧化铜合金模具材料 |
| CN106399749B (zh) * | 2016-10-05 | 2018-01-05 | 宁波兴业盛泰集团有限公司 | 一种高强高弹铜镍硅系合金材料及其制备方法 |
| CN106756202A (zh) * | 2016-11-23 | 2017-05-31 | 宁波兴业盛泰集团有限公司 | 一种引线框架材料用复杂多元铜合金材料及其制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6045698B2 (ja) * | 1982-01-20 | 1985-10-11 | 日本鉱業株式会社 | 半導体機器用リ−ド材 |
| JPS63143230A (ja) * | 1986-12-08 | 1988-06-15 | Nippon Mining Co Ltd | 析出強化型高力高導電性銅合金 |
| JP3699701B2 (ja) * | 2002-10-31 | 2005-09-28 | 日鉱金属加工株式会社 | 易加工高力高導電性銅合金 |
| JP4068626B2 (ja) * | 2005-03-31 | 2008-03-26 | 日鉱金属株式会社 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法 |
| JP2007136467A (ja) * | 2005-11-15 | 2007-06-07 | Hitachi Cable Ltd | 銅合金鋳塊と該銅合金鋳塊の製造方法、および銅合金条の製造方法、並びに銅合金鋳塊の製造装置 |
-
2007
- 2007-03-30 JP JP2007092269A patent/JP4937815B2/ja active Active
-
2008
- 2008-03-11 TW TW097108444A patent/TW200900515A/zh unknown
- 2008-03-28 WO PCT/JP2008/056142 patent/WO2008123436A1/ja active Application Filing
- 2008-03-28 KR KR1020097021841A patent/KR101159562B1/ko active IP Right Grant
- 2008-03-28 CN CN2008800101753A patent/CN101646791B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008123436A1 (ja) | 2008-10-16 |
| KR101159562B1 (ko) | 2012-06-26 |
| CN101646791B (zh) | 2011-11-16 |
| TWI367952B (ko) | 2012-07-11 |
| CN101646791A (zh) | 2010-02-10 |
| JP2008248333A (ja) | 2008-10-16 |
| TW200900515A (en) | 2009-01-01 |
| KR20090122303A (ko) | 2009-11-26 |
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