JP4935962B2 - 透明導電性フィルム及びその製造方法 - Google Patents
透明導電性フィルム及びその製造方法 Download PDFInfo
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- JP4935962B2 JP4935962B2 JP2011523247A JP2011523247A JP4935962B2 JP 4935962 B2 JP4935962 B2 JP 4935962B2 JP 2011523247 A JP2011523247 A JP 2011523247A JP 2011523247 A JP2011523247 A JP 2011523247A JP 4935962 B2 JP4935962 B2 JP 4935962B2
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- transparent conductive
- conductive film
- oxide
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- substance
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Classifications
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Electric Cables (AREA)
- Position Input By Displaying (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011523247A JP4935962B2 (ja) | 2010-05-06 | 2011-04-28 | 透明導電性フィルム及びその製造方法 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010106193 | 2010-05-06 | ||
| JP2010106193 | 2010-05-06 | ||
| PCT/JP2011/060353 WO2011138922A1 (ja) | 2010-05-06 | 2011-04-28 | 透明導電性フィルム及びその製造方法 |
| JP2011523247A JP4935962B2 (ja) | 2010-05-06 | 2011-04-28 | 透明導電性フィルム及びその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| JP2011283626A Division JP5834894B2 (ja) | 2010-05-06 | 2011-12-26 | 透明導電性フィルムの製造方法 |
Publications (2)
| Publication Number | Publication Date |
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| JP4935962B2 true JP4935962B2 (ja) | 2012-05-23 |
| JPWO2011138922A1 JPWO2011138922A1 (ja) | 2013-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011523247A Active JP4935962B2 (ja) | 2010-05-06 | 2011-04-28 | 透明導電性フィルム及びその製造方法 |
| JP2011283626A Expired - Fee Related JP5834894B2 (ja) | 2010-05-06 | 2011-12-26 | 透明導電性フィルムの製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011283626A Expired - Fee Related JP5834894B2 (ja) | 2010-05-06 | 2011-12-26 | 透明導電性フィルムの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP4935962B2 (zh) |
| TW (1) | TWI512765B (zh) |
| WO (1) | WO2011138922A1 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013118693A1 (ja) * | 2012-02-10 | 2013-08-15 | 東洋紡株式会社 | 透明導電性フィルム |
| JP6172389B2 (ja) * | 2015-03-31 | 2017-08-02 | 東洋紡株式会社 | 透明導電性フィルム |
| TWI740216B (zh) * | 2019-09-24 | 2021-09-21 | 光洋應用材料科技股份有限公司 | 銦錫鎳氧化物靶材及其製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0843840A (ja) * | 1994-07-27 | 1996-02-16 | Toppan Printing Co Ltd | 表示装置用電極板 |
| JPH0843841A (ja) * | 1994-07-27 | 1996-02-16 | Toppan Printing Co Ltd | 透明導電膜の形成方法 |
| JP2001332123A (ja) * | 1999-12-02 | 2001-11-30 | Mitsubishi Materials Corp | 導電性顔料粉末及びこれを用いて作られた透明導電膜 |
| JP2004149883A (ja) * | 2002-10-31 | 2004-05-27 | Mitsui Mining & Smelting Co Ltd | 高抵抗透明導電膜用スパッタリングターゲット及び高抵抗透明導電膜の製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3211066A1 (de) * | 1982-03-25 | 1983-09-29 | Siemens AG, 1000 Berlin und 8000 München | Transparente leitschicht |
| JPS60121606A (ja) * | 1983-12-05 | 1985-06-29 | コニカ株式会社 | 透明導電膜 |
| JP2989886B2 (ja) * | 1990-11-30 | 1999-12-13 | 日東電工株式会社 | アナログ式タツチパネル |
| JP3349194B2 (ja) * | 1993-06-10 | 2002-11-20 | 帝人株式会社 | 透明導電性積層体 |
| JP3447163B2 (ja) * | 1995-11-30 | 2003-09-16 | 出光興産株式会社 | 透明導電積層体 |
| JP3943617B2 (ja) * | 1995-12-07 | 2007-07-11 | 出光興産株式会社 | 透明導電積層体およびこれを用いたタッチパネル |
| JP2002157928A (ja) * | 2000-11-16 | 2002-05-31 | Toyobo Co Ltd | 透明導電性フィルム、透明導電性シートの製造方法およびタッチパネル |
| JP2002275623A (ja) * | 2001-03-19 | 2002-09-25 | Sumitomo Metal Mining Co Ltd | 透明導電性薄膜形成用焼結体ターゲット、その製造方法、及びそれより得られる透明導電性薄膜 |
| JP3627864B2 (ja) * | 2001-12-27 | 2005-03-09 | 東洋紡績株式会社 | 透明導電性フィルム、透明導電性シートおよびタッチパネル |
| JP2004349112A (ja) * | 2003-05-22 | 2004-12-09 | Toyobo Co Ltd | 透明導電性フィルム及び透明導電性シートの製造方法、及びタッチパネル |
| JP2010070418A (ja) * | 2008-09-18 | 2010-04-02 | Idemitsu Kosan Co Ltd | ＳｎＯ２−Ｉｎ２Ｏ３系酸化物焼結体及び非晶質透明導電膜 |
| KR101099414B1 (ko) * | 2008-09-25 | 2011-12-27 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 투명 도전막 제조용의 산화물 소결체 |
| CN102171160A (zh) * | 2008-09-25 | 2011-08-31 | Jx日矿日石金属株式会社 | 透明导电膜制造用的氧化物烧结体 |
-
2011
- 2011-04-28 WO PCT/JP2011/060353 patent/WO2011138922A1/ja active Application Filing
- 2011-04-28 JP JP2011523247A patent/JP4935962B2/ja active Active
- 2011-05-04 TW TW100115582A patent/TWI512765B/zh not_active IP Right Cessation
- 2011-12-26 JP JP2011283626A patent/JP5834894B2/ja not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0843840A (ja) * | 1994-07-27 | 1996-02-16 | Toppan Printing Co Ltd | 表示装置用電極板 |
| JPH0843841A (ja) * | 1994-07-27 | 1996-02-16 | Toppan Printing Co Ltd | 透明導電膜の形成方法 |
| JP2001332123A (ja) * | 1999-12-02 | 2001-11-30 | Mitsubishi Materials Corp | 導電性顔料粉末及びこれを用いて作られた透明導電膜 |
| JP2004149883A (ja) * | 2002-10-31 | 2004-05-27 | Mitsui Mining & Smelting Co Ltd | 高抵抗透明導電膜用スパッタリングターゲット及び高抵抗透明導電膜の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012107336A (ja) | 2012-06-07 |
| TW201218218A (en) | 2012-05-01 |
| JP5834894B2 (ja) | 2015-12-24 |
| WO2011138922A1 (ja) | 2011-11-10 |
| JPWO2011138922A1 (ja) | 2013-07-22 |
| TWI512765B (zh) | 2015-12-11 |
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