JP4926676B2 - 多層プリント配線板の製造方法 - Google Patents
多層プリント配線板の製造方法 Download PDFInfo
- Publication number
- JP4926676B2 JP4926676B2 JP2006326633A JP2006326633A JP4926676B2 JP 4926676 B2 JP4926676 B2 JP 4926676B2 JP 2006326633 A JP2006326633 A JP 2006326633A JP 2006326633 A JP2006326633 A JP 2006326633A JP 4926676 B2 JP4926676 B2 JP 4926676B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- multilayer
- printed wiring
- forming
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 claims description 54
- 239000010410 layer Substances 0.000 claims description 45
- 230000003014 reinforcing effect Effects 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 239000011229 interlayer Substances 0.000 claims description 11
- 238000004070 electrodeposition Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical group C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229920001721 polyimide Polymers 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000002787 reinforcement Effects 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
多層プリント配線板の製造方法において、
a) 可撓性絶縁ベース材の少なくとも一面に配線パターンを有する内層のコア配線板を製造する工程、
b) 外層ビルドアップ層用の可撓性銅張積層板を前記内層コア配線板に接着材を介し、積層して多層配線基材を形成する工程、
c) 前記多層配線基材の導通用孔形成部位に導通用孔を形成する工程、
d) 前記導通用孔を用いて層間接続を行う工程、
e) 前記多層配線基材の最外層に部品実装用のランドを含む配線パターンと、該配線パターンの間に配される補強パターンとを形成する工程、および
f) 前記補強パターンにソルダーレジスト層を形成する工程、
をそなえ、
前記工程e)が、
e1) 前記多層配線基材の最外層に、部品実装用のランドを含む配線パターンと、該配線パターン間に配される補強パターンベース部とを形成する工程、
および
e2) 前記補強パターンベース部上に、選択的に補強パターントップ部を電解めっきにより形成する工程、
を含むことを特徴とする多層プリント配線板の製造方法、
を提供するものである。
2 配線パターン
3 配線パターン
4 ビアフィルめっきで充填した有底ビアホール
5 ポリイミドフィルム
6 接着材
7 カバーレイ
8 両面コア配線板
9 絶縁ベース材
10 銅箔
11 片面可撓性銅張積層板
12 接着材
13 多層配線基材
14 導通用孔
15 ビアホール
15a ビアホールランド
16 補強パターン
16a 補強パターンベース部
16b 補強パターントップ部
17 ソルダーレジスト層
18 本発明による多層フレキシブルプリント配線板
19 ビアホール
19a ビアホールランド
20 従来工法による多層フレキシブルプリント配線板
Claims (2)
- 多層プリント配線板の製造方法において、
a) 可撓性絶縁ベース材の少なくとも一面に配線パターンを有する内層のコア配線板を製造する工程、
b) 外層ビルドアップ層用の可撓性銅張積層板を前記内層コア配線板に接着材を介し、積層して多層配線基材を形成する工程、
c) 前記多層配線基材の導通用孔形成部位に導通用孔を形成する工程、
d) 前記導通用孔を用いて層間接続を行う工程、
e) 前記多層配線基材の最外層に部品実装用のランドを含む配線パターンと、該配線パターンの間に配される補強パターンとを形成する工程、および
f) 前記補強パターンにソルダーレジスト層を形成する工程、
をそなえ、
前記工程e)が、
e1) 前記多層配線基材の最外層に、部品実装用のランドを含む配線パターンと、該配線パターン間に配される補強パターンベース部とを形成する工程、
および
e2) 前記補強パターンベース部上に、選択的に補強パターントップ部を電解めっきにより形成する工程、
を含むことを特徴とする多層プリント配線板の製造方法。 - 請求項1記載の多層プリント配線板の製造方法において、
前記工程f)が、電着手法で前記補強パターンに前記ソルダーレジスト層を形成することを特徴とする多層プリント配線板の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006326633A JP4926676B2 (ja) | 2006-12-04 | 2006-12-04 | 多層プリント配線板の製造方法 |
TW096140784A TWI457061B (zh) | 2006-12-04 | 2007-10-30 | 多層印刷配線板及其製造方法 |
KR1020070124365A KR20080051085A (ko) | 2006-12-04 | 2007-12-03 | 다층 프린트 배선판 및 그 제조방법 |
CN2007101966813A CN101198212B (zh) | 2006-12-04 | 2007-12-04 | 多层印刷布线板及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006326633A JP4926676B2 (ja) | 2006-12-04 | 2006-12-04 | 多層プリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008141033A JP2008141033A (ja) | 2008-06-19 |
JP4926676B2 true JP4926676B2 (ja) | 2012-05-09 |
Family
ID=39548284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006326633A Active JP4926676B2 (ja) | 2006-12-04 | 2006-12-04 | 多層プリント配線板の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4926676B2 (ja) |
KR (1) | KR20080051085A (ja) |
CN (1) | CN101198212B (ja) |
TW (1) | TWI457061B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101109204B1 (ko) * | 2009-11-13 | 2012-01-30 | 삼성전기주식회사 | 보강재를 구비한 인쇄회로기판 및 그 제조방법 |
TWI473215B (zh) * | 2011-12-08 | 2015-02-11 | Unimicron Technology Corp | 封裝基板之製法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56104492A (en) * | 1980-01-25 | 1981-08-20 | Asahi Chemical Ind | Method of manufacturing thick film fine pattern |
JPS6010689A (ja) * | 1983-06-29 | 1985-01-19 | 日本メクトロン株式会社 | フレキシブル回路基板の製造法 |
JPH05218598A (ja) * | 1992-01-31 | 1993-08-27 | Showa Electric Wire & Cable Co Ltd | プリント配線板 |
JP3961092B2 (ja) * | 1997-06-03 | 2007-08-15 | 株式会社東芝 | 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法 |
JP2001024297A (ja) * | 1999-07-09 | 2001-01-26 | Nippon Mektron Ltd | 可撓性多層回路基板のスル−ホ−ル導通構造及びその形成法 |
CN1179614C (zh) * | 2000-10-09 | 2004-12-08 | 耀华电子股份有限公司 | 软硬合成多层印刷电路板的制造方法 |
US7205483B2 (en) * | 2004-03-19 | 2007-04-17 | Matsushita Electric Industrial Co., Ltd. | Flexible substrate having interlaminar junctions, and process for producing the same |
-
2006
- 2006-12-04 JP JP2006326633A patent/JP4926676B2/ja active Active
-
2007
- 2007-10-30 TW TW096140784A patent/TWI457061B/zh active
- 2007-12-03 KR KR1020070124365A patent/KR20080051085A/ko not_active Application Discontinuation
- 2007-12-04 CN CN2007101966813A patent/CN101198212B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI457061B (zh) | 2014-10-11 |
TW200829116A (en) | 2008-07-01 |
CN101198212A (zh) | 2008-06-11 |
CN101198212B (zh) | 2010-12-15 |
JP2008141033A (ja) | 2008-06-19 |
KR20080051085A (ko) | 2008-06-10 |
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