JP4907171B2 - プローブピン - Google Patents
プローブピン Download PDFInfo
- Publication number
- JP4907171B2 JP4907171B2 JP2005380377A JP2005380377A JP4907171B2 JP 4907171 B2 JP4907171 B2 JP 4907171B2 JP 2005380377 A JP2005380377 A JP 2005380377A JP 2005380377 A JP2005380377 A JP 2005380377A JP 4907171 B2 JP4907171 B2 JP 4907171B2
- Authority
- JP
- Japan
- Prior art keywords
- probe pin
- plunger
- layer
- shape
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000523 sample Substances 0.000 title claims description 34
- 230000003014 reinforcing effect Effects 0.000 claims description 17
- 239000012212 insulator Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 31
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000005323 electroforming Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Description
図1は、この発明の実施の形態であるプローブピンの概要構成を示す断面図である。このプローブピン10は、プランジャー1,2とコイルばね3とを有し、絶縁プレート4に収納される。絶縁プレート4は、プレート状の中間絶縁体5を有し、この中間絶縁体5は、被検査物の接触端子位置に対応した位置に円柱状の孔部8を有する。中間絶縁体5の上側および下側には、それぞれ上側絶縁体6および下側絶縁体7が層状に設けられ、孔部8と同軸であって孔部8の径に比して小さな径をもつ円形の上側開口部8aおよび下側開口部8bをそれぞれ有する。そして、孔部8と、上側開口部8aをもつ上側絶縁体6と、下側開口部8bをもつ下側絶縁体7とによって、プローブピン10を収納するホルダを形成する。
3 コイルばね
4 絶縁プレート
5 中間絶縁体
6 上側絶縁体
7 下側絶縁体
8 孔部
8a 上側開口部
8b 下側開口部
10,20 プローブピン
11 中心層
12,13 補強層
14 抜け止め部
21a 接合端部
Claims (5)
- 絶縁体からなるホルダに収納されて被検査物に接触するプローブピンであって、
前記被検査物に接触する側の先端がくさび状に形成された略帯状平板の中心層と該中心層の両面に略帯状平板で形成され該中心層を補強する補強層とを有し、前記ホルダへ収納される場合に該ホルダが有する開口部に挿入される多層平板状のプランジャーを備え、
前記補強層の形状は、前記中心層の形状を面的に縮小した形状であることを特徴とするプローブピン。 - 前記プランジャーは、
前記中心層と前記補強層とが積層される方向と直交する平面に対して面対称な形状をなすことを特徴とする請求項1に記載のプローブピン。 - 前記プランジャーは、
長手方向と直交する断面の少なくとも一部が十字形状をなすことを特徴とする請求項1または2に記載のプローブピン。 - 前記中心層は、くさび状に形成されてコイルばねと嵌合するばね接合端部を有し、
前記ばね接合端部の基部の幅が該ばね接合端部の先端部の幅に比して狭いことを特徴とする請求項1〜3のいずれか一項に記載のプローブピン。 - 前記中心層および前記補強層は、Cu、Au、Ag、Niのいずれかであることを特徴とする請求項1〜4のいずれか一項に記載のプローブピン。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005380377A JP4907171B2 (ja) | 2005-12-28 | 2005-12-28 | プローブピン |
PCT/JP2006/325754 WO2007074764A1 (ja) | 2005-12-28 | 2006-12-25 | プローブピン |
TW095149407A TW200730832A (en) | 2005-12-28 | 2006-12-28 | Probe pin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005380377A JP4907171B2 (ja) | 2005-12-28 | 2005-12-28 | プローブピン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007178403A JP2007178403A (ja) | 2007-07-12 |
JP4907171B2 true JP4907171B2 (ja) | 2012-03-28 |
Family
ID=38217984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005380377A Active JP4907171B2 (ja) | 2005-12-28 | 2005-12-28 | プローブピン |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4907171B2 (ja) |
TW (1) | TW200730832A (ja) |
WO (1) | WO2007074764A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4900843B2 (ja) | 2008-12-26 | 2012-03-21 | 山一電機株式会社 | 半導体装置用電気接続装置及びそれに使用されるコンタクト |
KR101064852B1 (ko) | 2010-05-24 | 2011-09-14 | 김재길 | 프로브 카드용 니들 |
KR101149758B1 (ko) * | 2010-06-30 | 2012-07-11 | 리노공업주식회사 | 프로브 |
KR102092430B1 (ko) * | 2012-12-04 | 2020-03-23 | 일본전자재료(주) | 전기적 접촉자 |
KR101439342B1 (ko) | 2013-04-18 | 2014-09-16 | 주식회사 아이에스시 | 포고핀용 탐침부재 |
TWI555987B (zh) | 2014-01-28 | 2016-11-01 | Spring sleeve type probe and its manufacturing method | |
KR101492242B1 (ko) * | 2014-07-17 | 2015-02-13 | 주식회사 아이에스시 | 검사용 접촉장치 및 전기적 검사소켓 |
JP6084591B2 (ja) * | 2014-08-05 | 2017-02-22 | 株式会社アイエスシーIsc Co., Ltd. | ポゴピン用プローブ部材 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3979478B2 (ja) * | 1998-05-01 | 2007-09-19 | 株式会社エンプラス | コンタクトピン及びこのコンタクトピンを用いた電気部品用ソケット |
JP3768183B2 (ja) * | 2002-10-28 | 2006-04-19 | 山一電機株式会社 | 狭ピッチicパッケージ用icソケット |
KR100573089B1 (ko) * | 2003-03-17 | 2006-04-24 | 주식회사 파이컴 | 프로브 및 그 제조방법 |
JP4101773B2 (ja) * | 2004-02-09 | 2008-06-18 | 山一電機株式会社 | Icソケット |
-
2005
- 2005-12-28 JP JP2005380377A patent/JP4907171B2/ja active Active
-
2006
- 2006-12-25 WO PCT/JP2006/325754 patent/WO2007074764A1/ja active Application Filing
- 2006-12-28 TW TW095149407A patent/TW200730832A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW200730832A (en) | 2007-08-16 |
WO2007074764A1 (ja) | 2007-07-05 |
JP2007178403A (ja) | 2007-07-12 |
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