JP2007178403A - プローブピン - Google Patents
プローブピン Download PDFInfo
- Publication number
- JP2007178403A JP2007178403A JP2005380377A JP2005380377A JP2007178403A JP 2007178403 A JP2007178403 A JP 2007178403A JP 2005380377 A JP2005380377 A JP 2005380377A JP 2005380377 A JP2005380377 A JP 2005380377A JP 2007178403 A JP2007178403 A JP 2007178403A
- Authority
- JP
- Japan
- Prior art keywords
- probe pin
- plunger
- layer
- shape
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 35
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 description 31
- 239000012212 insulator Substances 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000005323 electroforming Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
【解決手段】被検査物に接触する側の先端がくさび状に形成された略帯状の平板の中心層11と、中心層11の両面の少なくとも一面に略帯状の平板で形成され中心層11を補強する補強層12とを有した多層平板状のプランジャー1を備える。
【選択図】 図2
Description
図1は、この発明の実施の形態であるプローブピンの概要構成を示す断面図である。このプローブピン10は、プランジャー1,2とコイルばね3とを有し、絶縁プレート4に収納される。絶縁プレート4は、プレート状の中間絶縁体5を有し、この中間絶縁体5は、被検査物の接触端子位置に対応した位置に円柱状の孔部8を有する。中間絶縁体5の上側および下側には、それぞれ上側絶縁体6および下側絶縁体7が層状に設けられ、孔部8と同軸であって孔部8の径に比して小さな径をもつ円形の上側開口部8aおよび下側開口部8bをそれぞれ有する。そして、孔部8と、上側開口部8aをもつ上側絶縁体6と、下側開口部8bをもつ下側絶縁体7とによって、プローブピン10を収納するホルダを形成する。
3 コイルばね
4 絶縁プレート
5 中間絶縁体
6 上側絶縁体
7 下側絶縁体
8 孔部
8a 上側開口部
8b 下側開口部
10,20 プローブピン
11 中心層
12,13 補強層
14 抜け止め部
21a 接合端部
Claims (4)
- 被検査物に接触する側の先端がくさび状に形成された略帯状平板の中心層と該中心層の両面の少なくとも一面に略帯状平板で形成され該中心層を補強する補強層とを有した多層平板状のプランジャーを備えたことを特徴とするプローブピン。
- コイルばねと嵌合する前記中心層のばね接合端部は、くさび状に形成され、かつ該ばね接合端部の基部の幅が先端部に比して狭いことを特徴とする請求項1に記載のプローブピン。
- 前記補強層の形状は、前記中心層の形状を面的に縮小した形状であることを特徴とする請求項1または2に記載のプローブピン。
- 前記中心層および前記補強層は、低抵抗部材であることを特徴とする請求項1〜3のいずれか一つに記載のプローブピン。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005380377A JP4907171B2 (ja) | 2005-12-28 | 2005-12-28 | プローブピン |
PCT/JP2006/325754 WO2007074764A1 (ja) | 2005-12-28 | 2006-12-25 | プローブピン |
TW095149407A TW200730832A (en) | 2005-12-28 | 2006-12-28 | Probe pin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005380377A JP4907171B2 (ja) | 2005-12-28 | 2005-12-28 | プローブピン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007178403A true JP2007178403A (ja) | 2007-07-12 |
JP4907171B2 JP4907171B2 (ja) | 2012-03-28 |
Family
ID=38217984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005380377A Active JP4907171B2 (ja) | 2005-12-28 | 2005-12-28 | プローブピン |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4907171B2 (ja) |
TW (1) | TW200730832A (ja) |
WO (1) | WO2007074764A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7677901B1 (en) | 2008-12-26 | 2010-03-16 | Yamaichi Electronics Co., Ltd. | Electric connecting apparatus for semiconductor devices and contact used therefor |
KR101064852B1 (ko) | 2010-05-24 | 2011-09-14 | 김재길 | 프로브 카드용 니들 |
WO2014087906A1 (ja) * | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | 電気的接触子 |
JP2015141200A (ja) * | 2014-01-28 | 2015-08-03 | 旺▲夕▼科技股▲分▼有限公司 | スプリングプローブおよびその製造方法 |
JP2016038206A (ja) * | 2014-08-05 | 2016-03-22 | 株式会社アイエスシーIsc Co., Ltd. | ポゴピン用プローブ部材 |
US9726693B2 (en) | 2013-04-18 | 2017-08-08 | Isc Co., Ltd. | Probe member for pogo pin |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101149758B1 (ko) * | 2010-06-30 | 2012-07-11 | 리노공업주식회사 | 프로브 |
KR101492242B1 (ko) * | 2014-07-17 | 2015-02-13 | 주식회사 아이에스시 | 검사용 접촉장치 및 전기적 검사소켓 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11317270A (ja) * | 1998-05-01 | 1999-11-16 | Enplas Corp | コンタクトピン及びこのコンタクトピンを用いた電気部品用ソケット |
JP2004152495A (ja) * | 2002-10-28 | 2004-05-27 | Yamaichi Electronics Co Ltd | 狭ピッチicパッケージ用icソケット |
WO2004084295A1 (en) * | 2003-03-17 | 2004-09-30 | Phicom Corporation | Probe and method of making same |
JP2005222912A (ja) * | 2004-02-09 | 2005-08-18 | Yamaichi Electronics Co Ltd | Icソケット |
-
2005
- 2005-12-28 JP JP2005380377A patent/JP4907171B2/ja active Active
-
2006
- 2006-12-25 WO PCT/JP2006/325754 patent/WO2007074764A1/ja active Application Filing
- 2006-12-28 TW TW095149407A patent/TW200730832A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11317270A (ja) * | 1998-05-01 | 1999-11-16 | Enplas Corp | コンタクトピン及びこのコンタクトピンを用いた電気部品用ソケット |
JP2004152495A (ja) * | 2002-10-28 | 2004-05-27 | Yamaichi Electronics Co Ltd | 狭ピッチicパッケージ用icソケット |
WO2004084295A1 (en) * | 2003-03-17 | 2004-09-30 | Phicom Corporation | Probe and method of making same |
JP2005222912A (ja) * | 2004-02-09 | 2005-08-18 | Yamaichi Electronics Co Ltd | Icソケット |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7677901B1 (en) | 2008-12-26 | 2010-03-16 | Yamaichi Electronics Co., Ltd. | Electric connecting apparatus for semiconductor devices and contact used therefor |
KR101064852B1 (ko) | 2010-05-24 | 2011-09-14 | 김재길 | 프로브 카드용 니들 |
CN104755943B (zh) * | 2012-12-04 | 2018-04-27 | 日本电子材料株式会社 | 电接触构件 |
WO2014087906A1 (ja) * | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | 電気的接触子 |
CN104755943A (zh) * | 2012-12-04 | 2015-07-01 | 日本电子材料株式会社 | 电接触构件 |
KR102092430B1 (ko) | 2012-12-04 | 2020-03-23 | 일본전자재료(주) | 전기적 접촉자 |
KR20150092094A (ko) * | 2012-12-04 | 2015-08-12 | 일본전자재료(주) | 전기적 접촉자 |
JP2018091870A (ja) * | 2012-12-04 | 2018-06-14 | 日本電子材料株式会社 | 電気的接触子 |
US9972933B2 (en) | 2012-12-04 | 2018-05-15 | Japan Electronic Materials Corporation | Contact probe |
JPWO2014087906A1 (ja) * | 2012-12-04 | 2017-01-05 | 日本電子材料株式会社 | 電気的接触子 |
US9774121B2 (en) | 2012-12-04 | 2017-09-26 | Japan Electronics Material Corporation | Contact probe |
US9726693B2 (en) | 2013-04-18 | 2017-08-08 | Isc Co., Ltd. | Probe member for pogo pin |
US9506949B2 (en) | 2014-01-28 | 2016-11-29 | Mpi Corporation | Spring probe |
JP2015141200A (ja) * | 2014-01-28 | 2015-08-03 | 旺▲夕▼科技股▲分▼有限公司 | スプリングプローブおよびその製造方法 |
JP2016038206A (ja) * | 2014-08-05 | 2016-03-22 | 株式会社アイエスシーIsc Co., Ltd. | ポゴピン用プローブ部材 |
Also Published As
Publication number | Publication date |
---|---|
WO2007074764A1 (ja) | 2007-07-05 |
TW200730832A (en) | 2007-08-16 |
JP4907171B2 (ja) | 2012-03-28 |
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