JP4903027B2 - 基板搬送装置および基板支持体 - Google Patents

基板搬送装置および基板支持体 Download PDF

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Publication number
JP4903027B2
JP4903027B2 JP2006292675A JP2006292675A JP4903027B2 JP 4903027 B2 JP4903027 B2 JP 4903027B2 JP 2006292675 A JP2006292675 A JP 2006292675A JP 2006292675 A JP2006292675 A JP 2006292675A JP 4903027 B2 JP4903027 B2 JP 4903027B2
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Japan
Prior art keywords
pick
substrate
support
base
angle
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Active
Application number
JP2006292675A
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English (en)
Japanese (ja)
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JP2007208235A (ja
Inventor
星児 岡部
健次 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2006292675A priority Critical patent/JP4903027B2/ja
Priority to KR1020070001636A priority patent/KR100856588B1/ko
Priority to TW096100553A priority patent/TWI397495B/zh
Priority to CN200710001578.9A priority patent/CN1994841B/zh
Publication of JP2007208235A publication Critical patent/JP2007208235A/ja
Application granted granted Critical
Publication of JP4903027B2 publication Critical patent/JP4903027B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2006292675A 2006-01-06 2006-10-27 基板搬送装置および基板支持体 Active JP4903027B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006292675A JP4903027B2 (ja) 2006-01-06 2006-10-27 基板搬送装置および基板支持体
KR1020070001636A KR100856588B1 (ko) 2006-01-06 2007-01-05 기판 반송 장치 및 기판 지지체
TW096100553A TWI397495B (zh) 2006-01-06 2007-01-05 A substrate transfer device and a substrate support
CN200710001578.9A CN1994841B (zh) 2006-01-06 2007-01-08 基板搬送装置及基板支承体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006001124 2006-01-06
JP2006001124 2006-01-06
JP2006292675A JP4903027B2 (ja) 2006-01-06 2006-10-27 基板搬送装置および基板支持体

Publications (2)

Publication Number Publication Date
JP2007208235A JP2007208235A (ja) 2007-08-16
JP4903027B2 true JP4903027B2 (ja) 2012-03-21

Family

ID=38487395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006292675A Active JP4903027B2 (ja) 2006-01-06 2006-10-27 基板搬送装置および基板支持体

Country Status (4)

Country Link
JP (1) JP4903027B2 (zh)
KR (1) KR100856588B1 (zh)
CN (1) CN1994841B (zh)
TW (1) TWI397495B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5800447B2 (ja) * 2007-03-09 2015-10-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板移送用高温抗垂下エンドエフェクター
CN101417747B (zh) * 2008-12-11 2011-11-23 友达光电股份有限公司 传送台机构
TW201135372A (en) * 2009-10-20 2011-10-16 Nikon Corp Substrate supporting apparatus, substrate supporting member, substrate transfer apparatus, exposure apparatus, and device manufacturing method
JP5613001B2 (ja) * 2010-10-13 2014-10-22 東京エレクトロン株式会社 基板処理システム及び基板搬送方法
JP2013062316A (ja) 2011-09-12 2013-04-04 Tokyo Electron Ltd 搬送装置及びプラズマ処理システム
CN102534555A (zh) * 2011-12-31 2012-07-04 无锡市奥曼特科技有限公司 用于硅片自动上下料系统的出片机构
JP6799395B2 (ja) * 2016-06-30 2020-12-16 株式会社荏原製作所 基板ホルダ、電子デバイス製造装置において基板を搬送する搬送システム、および電子デバイス製造装置
CN111149059B (zh) * 2017-09-29 2022-08-26 株式会社尼康 基板搬运、曝光装置、方法、平板显示器及元件制造方法
WO2019064585A1 (ja) * 2017-09-29 2019-04-04 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、基板搬送方法、及び露光方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0380143U (zh) * 1989-12-05 1991-08-16
JP2677913B2 (ja) * 1991-05-13 1997-11-17 三菱電機株式会社 半導体製造装置のシール機構および半導体装置の製造方法
JP3445257B2 (ja) * 1993-07-21 2003-09-08 キヤノン株式会社 処理システム及びこれを用いた露光装置およびデバイス製造方法
JPH0799225A (ja) * 1993-09-27 1995-04-11 Dainippon Screen Mfg Co Ltd 基板搬送装置
JPH08148539A (ja) * 1994-11-25 1996-06-07 Sharp Corp 半導体製造装置
JPH11188681A (ja) * 1997-12-24 1999-07-13 Canon Inc 基板搬送用ハンド及びその吸着機構
JP2000200810A (ja) * 1999-01-07 2000-07-18 Micronics Japan Co Ltd プロ―バ
JP3080143U (ja) * 2001-03-08 2001-09-14 オリンパス光学工業株式会社 基板搬送装置
CN1165799C (zh) * 2001-04-27 2004-09-08 瀚宇彩晶股份有限公司 液晶显示器模组的外框置放架
JP2003060004A (ja) * 2001-08-20 2003-02-28 Yaskawa Electric Corp ロボットハンド
JP3908005B2 (ja) * 2001-10-29 2007-04-25 株式会社アイテック ワーク搬送ロボット
JP2003197728A (ja) * 2001-12-27 2003-07-11 Aitec:Kk 基板収納カセット
KR100479494B1 (ko) * 2002-09-18 2005-03-30 삼성전자주식회사 기판 반송 로봇
KR100596050B1 (ko) * 2002-10-31 2006-07-03 삼성코닝정밀유리 주식회사 유리기판의 이송시스템
JP2004342933A (ja) * 2003-05-16 2004-12-02 Kondo Seisakusho:Kk ウエハハンド
JP4302575B2 (ja) * 2003-05-30 2009-07-29 東京エレクトロン株式会社 基板搬送装置および真空処理装置
DE112004001210T5 (de) * 2003-07-04 2006-06-08 Rorze Corp. Transportvorrichtung und Transportsteuerverfahren für eine dünne Platte
JP4360961B2 (ja) * 2004-03-30 2009-11-11 大日本スクリーン製造株式会社 基板搬送ロボットおよび基板処理装置

Also Published As

Publication number Publication date
CN1994841B (zh) 2014-02-12
TW200738539A (en) 2007-10-16
TWI397495B (zh) 2013-06-01
KR100856588B1 (ko) 2008-09-03
KR20070074496A (ko) 2007-07-12
JP2007208235A (ja) 2007-08-16
CN1994841A (zh) 2007-07-11

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