JP4892033B2 - リードフレームの製造方法 - Google Patents

リードフレームの製造方法 Download PDF

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Publication number
JP4892033B2
JP4892033B2 JP2009116788A JP2009116788A JP4892033B2 JP 4892033 B2 JP4892033 B2 JP 4892033B2 JP 2009116788 A JP2009116788 A JP 2009116788A JP 2009116788 A JP2009116788 A JP 2009116788A JP 4892033 B2 JP4892033 B2 JP 4892033B2
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JP
Japan
Prior art keywords
lead frame
roughened
base material
substrate
roughening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009116788A
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English (en)
Japanese (ja)
Other versions
JP2010267730A5 (https=
JP2010267730A (ja
Inventor
剛介 高橋
永 田代
光則 森
Original Assignee
日立ケーブルプレシジョン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立ケーブルプレシジョン株式会社 filed Critical 日立ケーブルプレシジョン株式会社
Priority to JP2009116788A priority Critical patent/JP4892033B2/ja
Priority to CN200910179516.6A priority patent/CN101887877B/zh
Publication of JP2010267730A publication Critical patent/JP2010267730A/ja
Publication of JP2010267730A5 publication Critical patent/JP2010267730A5/ja
Application granted granted Critical
Publication of JP4892033B2 publication Critical patent/JP4892033B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2009116788A 2009-05-13 2009-05-13 リードフレームの製造方法 Expired - Fee Related JP4892033B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009116788A JP4892033B2 (ja) 2009-05-13 2009-05-13 リードフレームの製造方法
CN200910179516.6A CN101887877B (zh) 2009-05-13 2009-10-12 引线框的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009116788A JP4892033B2 (ja) 2009-05-13 2009-05-13 リードフレームの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011244853A Division JP5376540B2 (ja) 2011-11-08 2011-11-08 リードフレーム及び半導体装置

Publications (3)

Publication Number Publication Date
JP2010267730A JP2010267730A (ja) 2010-11-25
JP2010267730A5 JP2010267730A5 (https=) 2011-01-13
JP4892033B2 true JP4892033B2 (ja) 2012-03-07

Family

ID=43073710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009116788A Expired - Fee Related JP4892033B2 (ja) 2009-05-13 2009-05-13 リードフレームの製造方法

Country Status (2)

Country Link
JP (1) JP4892033B2 (https=)
CN (1) CN101887877B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12224229B2 (en) 2021-03-16 2025-02-11 Kabushiki Kaisha Toshiba Semiconductor device with grooved die pad

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5251991B2 (ja) * 2011-01-14 2013-07-31 トヨタ自動車株式会社 半導体モジュール
US9576884B2 (en) * 2013-03-09 2017-02-21 Adventive Ipbank Low profile leaded semiconductor package
JP6142380B2 (ja) * 2014-05-08 2017-06-07 Ｓｈマテリアル株式会社 リードフレーム及びその製造方法
JP6686691B2 (ja) * 2016-05-16 2020-04-22 株式会社デンソー 電子装置
JP6479265B2 (ja) * 2016-12-27 2019-03-06 古河電気工業株式会社 リードフレーム材およびその製造方法ならびに半導体パッケージ
JP7449665B2 (ja) * 2019-09-26 2024-03-14 株式会社Kanzacc 金属条材およびその金属条材の製造方法
JP7029504B2 (ja) * 2020-09-23 2022-03-03 Ｓｈプレシジョン株式会社 リードフレームおよびパワー系半導体装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60231349A (ja) * 1984-05-01 1985-11-16 Toshiba Corp リ−ドフレ−ム
JPS61263142A (ja) * 1985-05-15 1986-11-21 Mitsui Haitetsuku:Kk リ−ドフレ−ム
JP2006210958A (ja) * 1997-02-27 2006-08-10 Fujitsu Ltd 半導体装置
JP4208893B2 (ja) * 1997-02-27 2009-01-14 富士通マイクロエレクトロニクス株式会社 半導体装置の製造方法
SG76591A1 (en) * 1999-02-27 2000-11-21 Aem Tech Engineers Pte Ltd Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
JP4329678B2 (ja) * 2004-11-11 2009-09-09 株式会社デンソー 半導体装置に用いるリードフレームの製造方法
JP2006147664A (ja) * 2004-11-16 2006-06-08 Hitachi Ltd 電子装置用モールド部品、および電子装置
JP4857594B2 (ja) * 2005-04-26 2012-01-18 大日本印刷株式会社 回路部材、及び回路部材の製造方法
US20090146280A1 (en) * 2005-11-28 2009-06-11 Dai Nippon Printing Co., Ltd. Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member
JP4620584B2 (ja) * 2005-12-27 2011-01-26 大日本印刷株式会社 回路部材の製造方法
JP2007287765A (ja) * 2006-04-13 2007-11-01 Denso Corp 樹脂封止型半導体装置
JP2008103455A (ja) * 2006-10-18 2008-05-01 Nec Electronics Corp 半導体装置および半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12224229B2 (en) 2021-03-16 2025-02-11 Kabushiki Kaisha Toshiba Semiconductor device with grooved die pad

Also Published As

Publication number Publication date
CN101887877B (zh) 2016-02-03
CN101887877A (zh) 2010-11-17
JP2010267730A (ja) 2010-11-25

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