JP4885838B2 - 波形パッドコンディショナーおよびその使用方法 - Google Patents

波形パッドコンディショナーおよびその使用方法 Download PDF

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Publication number
JP4885838B2
JP4885838B2 JP2007502804A JP2007502804A JP4885838B2 JP 4885838 B2 JP4885838 B2 JP 4885838B2 JP 2007502804 A JP2007502804 A JP 2007502804A JP 2007502804 A JP2007502804 A JP 2007502804A JP 4885838 B2 JP4885838 B2 JP 4885838B2
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JP
Japan
Prior art keywords
corrugated
abrasive
polishing
pad
disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2007502804A
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English (en)
Japanese (ja)
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JP2007528300A5 (https=
JP2007528300A (ja
Inventor
エム． パルムグレン，ゲーリー
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2007528300A publication Critical patent/JP2007528300A/ja
Publication of JP2007528300A5 publication Critical patent/JP2007528300A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Secondary Cells (AREA)
  • Branch Pipes, Bends, And The Like (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2007502804A 2004-03-09 2005-01-25 波形パッドコンディショナーおよびその使用方法 Expired - Fee Related JP4885838B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/797,892 2004-03-09
US10/797,892 US6951509B1 (en) 2004-03-09 2004-03-09 Undulated pad conditioner and method of using same
PCT/US2005/002310 WO2005095059A1 (en) 2004-03-09 2005-01-25 Undulated pad conditioner and method of using same

Publications (3)

Publication Number Publication Date
JP2007528300A JP2007528300A (ja) 2007-10-11
JP2007528300A5 JP2007528300A5 (https=) 2008-03-13
JP4885838B2 true JP4885838B2 (ja) 2012-02-29

Family

ID=34920155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007502804A Expired - Fee Related JP4885838B2 (ja) 2004-03-09 2005-01-25 波形パッドコンディショナーおよびその使用方法

Country Status (10)

Country Link
US (1) US6951509B1 (https=)
EP (1) EP1722926B1 (https=)
JP (1) JP4885838B2 (https=)
KR (1) KR101127256B1 (https=)
CN (1) CN100563931C (https=)
AT (1) ATE439944T1 (https=)
DE (1) DE602005016086D1 (https=)
MY (1) MY135136A (https=)
TW (1) TWI358743B (https=)
WO (1) WO2005095059A1 (https=)

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US7744447B2 (en) * 2005-03-16 2010-06-29 Goei, Co., Ltd. Abrasive disc
TWI290337B (en) * 2005-08-09 2007-11-21 Princo Corp Pad conditioner for conditioning a CMP pad and method of making the same
JP4791121B2 (ja) * 2005-09-22 2011-10-12 新日鉄マテリアルズ株式会社 研磨布用ドレッサー
WO2007043263A1 (ja) * 2005-10-14 2007-04-19 Asahi Glass Company, Limited 研磨パッド用ツルーイング部材及び研磨パッドのツルーイング方法
WO2009158507A2 (en) * 2008-06-26 2009-12-30 Saint-Gobain Abrasives, Inc. Chemical mechanical planarization pad conditioner and method of forming
TW201016387A (en) * 2008-10-22 2010-05-01 jian-min Song CMP Pad Dressers with Hybridized abrasive surface and related methods
US8628597B2 (en) 2009-06-25 2014-01-14 3M Innovative Properties Company Method of sorting abrasive particles, abrasive particle distributions, and abrasive articles including the same
WO2017110156A1 (ja) * 2015-12-25 2017-06-29 ニューレジストン株式会社 研削装置および当該研削装置用の研削具
CN106078517A (zh) * 2016-08-03 2016-11-09 咏巨科技有限公司 一种抛光垫修整装置
US10471567B2 (en) * 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
CN106733792A (zh) * 2016-12-12 2017-05-31 北京中电科电子装备有限公司 一种用于半导体磨削台的清洁装置
JP7232763B2 (ja) * 2016-12-21 2023-03-03 スリーエム イノベイティブ プロパティズ カンパニー スペーサ及びウェハ平坦化システムを有するパッドコンディショナ
WO2019102331A1 (en) * 2017-11-21 2019-05-31 3M Innovative Properties Company Coated abrasive disc and methods of making and using the same
US20200094375A1 (en) * 2018-09-26 2020-03-26 Cana Diamond Technology, LLC Multiple zone pad conditioning disk
US12325106B2 (en) * 2018-10-31 2025-06-10 Taiwan Semiconductor Manufacturing Company, Ltd. Device for conditioning chemical mechanical polishing
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
GB2590511B (en) * 2019-11-20 2023-10-25 Best Engineered Surface Tech Llc Hybrid CMP conditioning head
CN116749080B (zh) * 2023-08-18 2023-11-14 浙江求是半导体设备有限公司 修整方法
CN117863092A (zh) * 2024-02-01 2024-04-12 杭州萧山昌宇五金机械有限公司 一种合金齿磨轮及其制造工艺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2990661A (en) * 1958-07-10 1961-07-04 Donald P Hackett Backing disk for abrasive sheet

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FR1596322A (https=) * 1968-01-05 1970-06-15
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US5014468A (en) 1989-05-05 1991-05-14 Norton Company Patterned coated abrasive for fine surface finishing
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JP3036348B2 (ja) 1994-03-23 2000-04-24 三菱マテリアル株式会社 ウェーハ研磨パッドのツルーイング装置
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KR20010005993A (ko) 1997-04-04 2001-01-15 오브시디안 인코포레이티드 향상된 폴리싱을 위한 폴리싱 미디어 매거진
US6194317B1 (en) 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
US6093280A (en) * 1997-08-18 2000-07-25 Lsi Logic Corporation Chemical-mechanical polishing pad conditioning systems
US6200199B1 (en) * 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
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JP2002057130A (ja) * 2000-08-14 2002-02-22 Three M Innovative Properties Co Ｃｍｐ用研磨パッド
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Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
US2990661A (en) * 1958-07-10 1961-07-04 Donald P Hackett Backing disk for abrasive sheet

Also Published As

Publication number Publication date
EP1722926A1 (en) 2006-11-22
WO2005095059A1 (en) 2005-10-13
EP1722926B1 (en) 2009-08-19
US6951509B1 (en) 2005-10-04
TWI358743B (en) 2012-02-21
JP2007528300A (ja) 2007-10-11
CN1929956A (zh) 2007-03-14
CN100563931C (zh) 2009-12-02
DE602005016086D1 (de) 2009-10-01
ATE439944T1 (de) 2009-09-15
US20050202760A1 (en) 2005-09-15
TW200539256A (en) 2005-12-01
MY135136A (en) 2008-02-29
KR101127256B1 (ko) 2012-03-29
KR20060132717A (ko) 2006-12-21

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